TW201250159A - Light-emitting diode module - Google Patents
Light-emitting diode module Download PDFInfo
- Publication number
- TW201250159A TW201250159A TW100119202A TW100119202A TW201250159A TW 201250159 A TW201250159 A TW 201250159A TW 100119202 A TW100119202 A TW 100119202A TW 100119202 A TW100119202 A TW 100119202A TW 201250159 A TW201250159 A TW 201250159A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating
- light
- emitting diode
- circuit board
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 claims abstract description 66
- 239000010949 copper Substances 0.000 claims abstract description 66
- 238000005476 soldering Methods 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims description 41
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 230000008018 melting Effects 0.000 claims description 15
- 238000002844 melting Methods 0.000 claims description 15
- 230000005496 eutectics Effects 0.000 claims description 13
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 5
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000001816 cooling Methods 0.000 abstract 11
- 238000003466 welding Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100119202A TW201250159A (en) | 2011-06-01 | 2011-06-01 | Light-emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100119202A TW201250159A (en) | 2011-06-01 | 2011-06-01 | Light-emitting diode module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201250159A true TW201250159A (en) | 2012-12-16 |
| TWI418736B TWI418736B (enExample) | 2013-12-11 |
Family
ID=48139205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100119202A TW201250159A (en) | 2011-06-01 | 2011-06-01 | Light-emitting diode module |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201250159A (enExample) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100566140B1 (ko) * | 2003-05-14 | 2006-03-30 | (주)나노팩 | 발광다이오드와 그 패키지 구조체 및 제조방법 |
| US7296916B2 (en) * | 2004-12-21 | 2007-11-20 | 3M Innovative Properties Company | Illumination assembly and method of making same |
| KR100854328B1 (ko) * | 2006-07-07 | 2008-08-28 | 엘지전자 주식회사 | 발광 소자 패키지 및 그 제조방법 |
| TWM311119U (en) * | 2006-11-15 | 2007-05-01 | Unity Opto Technology Co Ltd | Heat-dissipating module for LED |
| TWM311844U (en) * | 2006-11-17 | 2007-05-11 | Mgta Consultant Co Ltd | Heat dissipation devices for LED lamps |
| CN201475720U (zh) * | 2009-08-10 | 2010-05-19 | 林万炯 | 具有散热电路板的led灯 |
-
2011
- 2011-06-01 TW TW100119202A patent/TW201250159A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI418736B (enExample) | 2013-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |