CN100524807C - 有机发光显示装置及其制造方法 - Google Patents
有机发光显示装置及其制造方法 Download PDFInfo
- Publication number
- CN100524807C CN100524807C CNB2007100082514A CN200710008251A CN100524807C CN 100524807 C CN100524807 C CN 100524807C CN B2007100082514 A CNB2007100082514 A CN B2007100082514A CN 200710008251 A CN200710008251 A CN 200710008251A CN 100524807 C CN100524807 C CN 100524807C
- Authority
- CN
- China
- Prior art keywords
- substrate
- pixel region
- integrated circuit
- semiconductor integrated
- extension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 203
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 40
- 239000011521 glass Substances 0.000 claims description 31
- 229910052760 oxygen Inorganic materials 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 4
- QYIJPFYCTROKTM-UHFFFAOYSA-N [Sn].P(O)(O)(O)=O Chemical compound [Sn].P(O)(O)(O)=O QYIJPFYCTROKTM-UHFFFAOYSA-N 0.000 claims description 3
- 239000005385 borate glass Substances 0.000 claims description 3
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 claims description 3
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 81
- 239000012044 organic layer Substances 0.000 description 16
- 239000011368 organic material Substances 0.000 description 14
- 239000010408 film Substances 0.000 description 12
- 239000000654 additive Substances 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 11
- 239000001301 oxygen Substances 0.000 description 11
- 230000000996 additive effect Effects 0.000 description 10
- 239000000945 filler Substances 0.000 description 10
- 238000007789 sealing Methods 0.000 description 10
- 229920001621 AMOLED Polymers 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000027756 respiratory electron transport chain Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000003230 hygroscopic agent Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Inorganic materials [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 3
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 description 3
- 239000002800 charge carrier Substances 0.000 description 3
- 229960004643 cupric oxide Drugs 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000005284 excitation Effects 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 239000000395 magnesium oxide Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 230000000505 pernicious effect Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052723 transition metal Inorganic materials 0.000 description 2
- 150000003624 transition metals Chemical class 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920002153 Hydroxypropyl cellulose Polymers 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 239000001863 hydroxypropyl cellulose Substances 0.000 description 1
- 235000010977 hydroxypropyl cellulose Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910003450 rhodium oxide Inorganic materials 0.000 description 1
- CWBWCLMMHLCMAM-UHFFFAOYSA-M rubidium(1+);hydroxide Chemical compound [OH-].[Rb+].[Rb+] CWBWCLMMHLCMAM-UHFFFAOYSA-M 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060008766 | 2006-01-27 | ||
KR1020060008766A KR100688789B1 (ko) | 2006-01-27 | 2006-01-27 | 유기전계발광 표시 장치 및 그의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101009320A CN101009320A (zh) | 2007-08-01 |
CN100524807C true CN100524807C (zh) | 2009-08-05 |
Family
ID=37913666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2007100082514A Active CN100524807C (zh) | 2006-01-27 | 2007-01-26 | 有机发光显示装置及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7994534B2 (zh) |
EP (1) | EP1814175B1 (zh) |
JP (1) | JP2007200856A (zh) |
KR (1) | KR100688789B1 (zh) |
CN (1) | CN100524807C (zh) |
TW (1) | TWI364109B (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100671643B1 (ko) | 2006-01-27 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 및 그의 제조 방법 |
US7652305B2 (en) * | 2007-02-23 | 2010-01-26 | Corning Incorporated | Methods and apparatus to improve frit-sealed glass package |
US7815480B2 (en) * | 2007-11-30 | 2010-10-19 | Corning Incorporated | Methods and apparatus for packaging electronic components |
KR101113370B1 (ko) * | 2009-11-11 | 2012-02-29 | 삼성모바일디스플레이주식회사 | 박막트랜지스터 및 이를 구비한 유기전계 발광 표시장치 |
KR101734911B1 (ko) | 2010-08-10 | 2017-05-15 | 삼성디스플레이 주식회사 | 유기 발광 디스플레이 장치 및 그 제조 방법 |
JP5816029B2 (ja) * | 2011-08-24 | 2015-11-17 | 株式会社半導体エネルギー研究所 | 発光装置 |
KR20140061095A (ko) * | 2012-11-13 | 2014-05-21 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치 제조 방법 |
KR20150043136A (ko) | 2013-10-14 | 2015-04-22 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
KR102518746B1 (ko) * | 2016-06-01 | 2023-04-07 | 삼성디스플레이 주식회사 | 표시 장치 |
JP2018124465A (ja) * | 2017-02-02 | 2018-08-09 | セイコーエプソン株式会社 | 電気光学装置、電子機器、および実装構造体 |
KR102476539B1 (ko) * | 2017-12-12 | 2022-12-12 | 엘지디스플레이 주식회사 | 마이크로 디스플레이 장치 및 디스플레이 집적회로 |
JP7286928B2 (ja) * | 2018-08-23 | 2023-06-06 | 大日本印刷株式会社 | 調光装置およびその製造方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1234567A (en) * | 1915-09-14 | 1917-07-24 | Edward J Quigley | Soft collar. |
US4238704A (en) | 1979-02-12 | 1980-12-09 | Corning Glass Works | Sealed beam lamp of borosilicate glass with a sealing glass of zinc silicoborate and a mill addition of cordierite |
GB9217336D0 (en) | 1992-08-14 | 1992-09-30 | Philips Electronics Uk Ltd | Active matrix display devices and methods for driving such |
JP3814810B2 (ja) | 1996-04-05 | 2006-08-30 | 日本電気硝子株式会社 | ビスマス系ガラス組成物 |
JPH1074583A (ja) * | 1996-08-30 | 1998-03-17 | Sanyo Electric Co Ltd | 有機elディスプレイ及び有機elディスプレイの 製造方法 |
US6731260B2 (en) | 1997-10-13 | 2004-05-04 | Sanyo Electric Co., Ltd. | Display device |
JPH11194367A (ja) | 1997-10-13 | 1999-07-21 | Sanyo Electric Co Ltd | 表示装置 |
JP2004151716A (ja) * | 1997-10-13 | 2004-05-27 | Sanyo Electric Co Ltd | 表示装置 |
DE60044482D1 (de) | 1999-03-05 | 2010-07-15 | Canon Kk | Bilderzeugungsvorrichtung |
US6555025B1 (en) | 2000-01-31 | 2003-04-29 | Candescent Technologies Corporation | Tuned sealing material for sealing of a flat panel display |
KR100316781B1 (ko) | 2000-02-25 | 2001-12-20 | 김순택 | 레이저를 이용한 유리평판표시패널의 프릿 프레임 밀봉 방법 |
TWI238375B (en) * | 2000-05-31 | 2005-08-21 | Toshiba Corp | Pumping circuit and flat panel display device |
US6646284B2 (en) | 2000-12-12 | 2003-11-11 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and method of manufacturing the same |
KR100370406B1 (ko) | 2000-12-22 | 2003-02-05 | 삼성에스디아이 주식회사 | 레이저를 이용한 평판표시장치의 진공 패키징 방법 |
US6614057B2 (en) * | 2001-02-07 | 2003-09-02 | Universal Display Corporation | Sealed organic optoelectronic structures |
US20040169174A1 (en) * | 2001-05-24 | 2004-09-02 | Huh Jin Woo | Container for encapsulating oled and manufacturing method thereof |
JP2002372928A (ja) | 2001-06-13 | 2002-12-26 | Sony Corp | タイリング型表示装置及びその製造方法 |
JP2003228302A (ja) | 2002-02-04 | 2003-08-15 | Toshiba Electronic Engineering Corp | 表示装置及びその製造方法 |
JP2003255845A (ja) | 2002-02-28 | 2003-09-10 | Sanyo Electric Co Ltd | 有機elディスプレイパネル |
JP2003332045A (ja) | 2002-05-09 | 2003-11-21 | Sanyo Electric Co Ltd | エレクトロルミネッセンス表示装置及びその製造方法 |
KR20040010026A (ko) * | 2002-07-25 | 2004-01-31 | 가부시키가이샤 히타치세이사쿠쇼 | 전계방출형 화상표시장치 |
JP4050972B2 (ja) | 2002-10-16 | 2008-02-20 | 株式会社 日立ディスプレイズ | 表示装置 |
JP4299021B2 (ja) | 2003-02-19 | 2009-07-22 | ヤマト電子株式会社 | 封着加工材及び封着加工用ペースト |
US6998776B2 (en) | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
US20040206953A1 (en) | 2003-04-16 | 2004-10-21 | Robert Morena | Hermetically sealed glass package and method of fabrication |
KR100544123B1 (ko) | 2003-07-29 | 2006-01-23 | 삼성에스디아이 주식회사 | 평판표시장치 |
US7291967B2 (en) | 2003-08-29 | 2007-11-06 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting element including a barrier layer and a manufacturing method thereof |
KR20050073855A (ko) | 2004-01-12 | 2005-07-18 | 삼성전자주식회사 | 플렉셔블 디스플레이 및 그 제조 방법 |
JP4936643B2 (ja) | 2004-03-02 | 2012-05-23 | 株式会社リコー | 半導体装置及びその製造方法 |
KR100590252B1 (ko) | 2004-03-17 | 2006-06-19 | 삼성에스디아이 주식회사 | 유기 전계 발광 표시 장치 |
US20050248270A1 (en) | 2004-05-05 | 2005-11-10 | Eastman Kodak Company | Encapsulating OLED devices |
US7173377B2 (en) * | 2004-05-24 | 2007-02-06 | Samsung Sdi Co., Ltd. | Light emission device and power supply therefor |
KR100681022B1 (ko) | 2004-06-16 | 2007-02-09 | 엘지전자 주식회사 | 유기 전계발광표시소자 및 그 제조방법 |
US7791270B2 (en) * | 2004-09-17 | 2010-09-07 | Semiconductor Energy Laboratory Co., Ltd | Light-emitting device with reduced deterioration of periphery |
US20060087230A1 (en) * | 2004-10-22 | 2006-04-27 | Eastman Kodak Company | Desiccant film in top-emitting OLED |
CN101073164B (zh) * | 2004-12-06 | 2010-05-05 | 株式会社半导体能源研究所 | 发光元件和使用该元件的发光装置 |
KR100671643B1 (ko) | 2006-01-27 | 2007-01-19 | 삼성에스디아이 주식회사 | 유기전계발광 표시 장치 및 그의 제조 방법 |
-
2006
- 2006-01-27 KR KR1020060008766A patent/KR100688789B1/ko active IP Right Grant
- 2006-09-05 JP JP2006240516A patent/JP2007200856A/ja active Pending
- 2006-09-29 US US11/540,366 patent/US7994534B2/en active Active
- 2006-12-12 TW TW095146415A patent/TWI364109B/zh active
-
2007
- 2007-01-25 EP EP07101149.8A patent/EP1814175B1/en active Active
- 2007-01-26 CN CNB2007100082514A patent/CN100524807C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20070176171A1 (en) | 2007-08-02 |
TWI364109B (en) | 2012-05-11 |
JP2007200856A (ja) | 2007-08-09 |
TW200731527A (en) | 2007-08-16 |
KR100688789B1 (ko) | 2007-03-02 |
EP1814175A2 (en) | 2007-08-01 |
US7994534B2 (en) | 2011-08-09 |
EP1814175A3 (en) | 2011-02-23 |
CN101009320A (zh) | 2007-08-01 |
EP1814175B1 (en) | 2016-10-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100524807C (zh) | 有机发光显示装置及其制造方法 | |
CN100492654C (zh) | 有机发光显示装置及其制造方法 | |
CN100568526C (zh) | 制造有机发光显示装置的方法 | |
EP1814178B1 (en) | Organic light-emitting display with frit seal and reinforcing structure bonded to frame | |
US9004972B2 (en) | Organic light-emitting display device with frit seal and reinforcing structure | |
CN100573868C (zh) | 有机发光显示器及其制造方法 | |
US8299705B2 (en) | Organic light emitting display device and manufacturing method thereof | |
US7837530B2 (en) | Method of sealing an organic light emitting display by means of a glass frit seal assembly | |
US7385347B2 (en) | Organic electroluminescence display device and manufacturing method thereof | |
US7586259B2 (en) | Flat panel display device and method of making the same | |
US7749039B2 (en) | Organic light emitting display device and method of manufacturing the same | |
US20070170423A1 (en) | Organic light-emitting display and method of making the same | |
US20070170857A1 (en) | Organic light-emitting display device and method of manufacturing the same | |
CN101009316B (zh) | 平板显示设备及其制造方法 | |
CN100492655C (zh) | 有机发光显示装置及其制造 | |
US20070176552A1 (en) | Flat panel display device and method of making the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20090116 Address after: Gyeonggi Do Korea Suwon Applicant after: Samsung Mobile Display Co., Ltd. Address before: Gyeonggi Do Lingtong District letter hole 575 Suwon Applicant before: Samsung SDI Co., Ltd. |
|
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG MOBILE DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG SDI CO., LTD. Effective date: 20090116 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG MOBILE DISPLAY CO., LTD. Effective date: 20121108 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121108 Address after: South Korea Gyeonggi Do Yongin Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do Korea Suwon Patentee before: Samsung Mobile Display Co., Ltd. |