CN100506877C - 固化性树脂组合物、保护膜及其形成方法 - Google Patents

固化性树脂组合物、保护膜及其形成方法 Download PDF

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Publication number
CN100506877C
CN100506877C CNB200580001415XA CN200580001415A CN100506877C CN 100506877 C CN100506877 C CN 100506877C CN B200580001415X A CNB200580001415X A CN B200580001415XA CN 200580001415 A CN200580001415 A CN 200580001415A CN 100506877 C CN100506877 C CN 100506877C
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CN
China
Prior art keywords
composition
acid
curable resin
resin composition
methyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB200580001415XA
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English (en)
Chinese (zh)
Other versions
CN1898291A (zh
Inventor
梶田彻
马场厚
志保浩司
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JSR Corp
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JSR Corp
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Publication of CN1898291A publication Critical patent/CN1898291A/zh
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Publication of CN100506877C publication Critical patent/CN100506877C/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/20—Manufacture of shaped structures of ion-exchange resins
    • C08J5/22—Films, membranes or diaphragms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Optical Filters (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CNB200580001415XA 2004-05-06 2005-02-18 固化性树脂组合物、保护膜及其形成方法 Expired - Fee Related CN100506877C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004137105 2004-05-06
JP137105/2004 2004-05-06

Publications (2)

Publication Number Publication Date
CN1898291A CN1898291A (zh) 2007-01-17
CN100506877C true CN100506877C (zh) 2009-07-01

Family

ID=35320194

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB200580001415XA Expired - Fee Related CN100506877C (zh) 2004-05-06 2005-02-18 固化性树脂组合物、保护膜及其形成方法

Country Status (5)

Country Link
JP (1) JP5163847B2 (ko)
KR (1) KR101087309B1 (ko)
CN (1) CN100506877C (ko)
TW (1) TWI385192B (ko)
WO (1) WO2005108458A1 (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7696292B2 (en) 2003-09-22 2010-04-13 Commonwealth Scientific And Industrial Research Organisation Low-polydispersity photoimageable acrylic polymers, photoresists and processes for microlithography
JP4688697B2 (ja) * 2006-03-03 2011-05-25 東洋合成工業株式会社 ジチオエステル誘導体及び連鎖移動剤並びにこれを用いたラジカル重合性重合体の製造方法
JP5296309B2 (ja) * 2006-12-15 2013-09-25 株式会社フジシールインターナショナル プラスチックフィルム用活性エネルギー線硬化性樹脂組成物及びプラスチックラベル
JP5224030B2 (ja) * 2007-03-22 2013-07-03 Ｊｓｒ株式会社 熱硬化性樹脂組成物、保護膜および保護膜の形成方法
WO2013035206A1 (ja) * 2011-09-09 2013-03-14 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 電子装置用シール剤組成物
JP6130110B2 (ja) * 2012-08-15 2017-05-17 大阪有機化学工業株式会社 エポキシ系共重合体
KR101748409B1 (ko) * 2014-07-30 2017-06-16 주식회사 엘지화학 편광자 보호 필름용 수지 조성물, 편광자 보호 필름, 및 이를 포함하는 편광판
JP6963215B2 (ja) * 2016-07-28 2021-11-05 日産化学株式会社 樹脂組成物
JP7236812B2 (ja) * 2017-04-27 2023-03-10 日本化薬株式会社 反応性ポリカルボン酸化合物、それを用いた活性エネルギー線硬化型樹脂組成物、その硬化物及びその用途
CN107390420A (zh) * 2017-08-02 2017-11-24 京东方科技集团股份有限公司 一种彩膜基板及显示装置
CN109422987B (zh) 2017-08-30 2021-03-09 京东方科技集团股份有限公司 平坦层用组合物、其制备方法、平坦层材料及显示装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1028433C (zh) * 1989-02-01 1995-05-17 北京大学 光固化组合物及其制备方法和用途
JPH0733855A (ja) * 1993-07-21 1995-02-03 Japan Synthetic Rubber Co Ltd 感放射線性樹脂組成物
JP3484808B2 (ja) * 1995-03-24 2004-01-06 Ｊｓｒ株式会社 層間絶縁膜形成用感放射線性樹脂組成物並びに層間絶縁膜およびその製造方法
JP2000290348A (ja) * 1999-04-12 2000-10-17 Toagosei Co Ltd 硬化性樹脂組成物
JP2002302532A (ja) * 2001-04-03 2002-10-18 Nippon Synthetic Chem Ind Co Ltd:The 光硬化性樹脂組成物及びその用途
WO2003037945A1 (fr) * 2001-10-29 2003-05-08 Kaneka Corporation Copolymere sequence a base d'acrylonitrile et compositions de resines thermoplastiques
JP4394870B2 (ja) * 2002-09-17 2010-01-06 株式会社カネカ 粘接着組成物、該粘接着組成物を用いた粘接着テープまたはシートおよびホットメルト型アクリル系粘接着剤
FR2848556B1 (fr) * 2002-12-13 2006-06-16 Bio Merieux Procede de polymerisation radicalaire controlee
JP2007515538A (ja) * 2003-12-23 2007-06-14 ザ ユニバーシティ オブ リーズ 連鎖移動剤を使用した重合
JP2007100020A (ja) * 2005-10-07 2007-04-19 Jsr Corp 硬化性樹脂組成物、保護膜およびその形成方法

Also Published As

Publication number Publication date
KR101087309B1 (ko) 2011-11-25
KR20070012451A (ko) 2007-01-25
JPWO2005108458A1 (ja) 2008-03-21
TWI385192B (zh) 2013-02-11
WO2005108458A1 (ja) 2005-11-17
CN1898291A (zh) 2007-01-17
TW200604238A (en) 2006-02-01
JP5163847B2 (ja) 2013-03-13

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