CN100504614C - Stepping scan photo-etching machine double-platform exchanging and positioning system - Google Patents

Stepping scan photo-etching machine double-platform exchanging and positioning system Download PDF

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Publication number
CN100504614C
CN100504614C CNB2006100257497A CN200610025749A CN100504614C CN 100504614 C CN100504614 C CN 100504614C CN B2006100257497 A CNB2006100257497 A CN B2006100257497A CN 200610025749 A CN200610025749 A CN 200610025749A CN 100504614 C CN100504614 C CN 100504614C
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China
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guide rail
silicon chip
platform
double
positioning system
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CN1828427A (en
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李映笙
李小平
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Shanghai Micro Electronics Equipment Co Ltd
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Shanghai Micro Electronics Equipment Co Ltd
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Publication of CN1828427A publication Critical patent/CN1828427A/en
Priority to PCT/CN2006/002862 priority patent/WO2007118376A1/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Wherein, it sets one/two x-direction guide rail on pre-treating position and exposure position respectively. This invention reduces time consumption for exchange of exposure position and exposure time of every silicon slice, simplifies system, and improves system efficiency and reliability.

Description

Step scan photo-etching machine double-platform exchanging and positioning system
Technical field
The invention belongs to accurate positioning field, relate in particular to the motion positions device of silicon chip in the semicon industry.
Background technology
Photo-mask process is meant the exposure of the graphics chip on the mask is transferred on the silicon chip that it is one of operation important in the IC Chip Production manufacture process.Comprise the sub-operation of multiple tracks in one photo-mask process: sheet, prealignment, aligning, exposure etc. up and down.The production efficiency of system (throughput) is by each line operation travelling speed decision.
Typical lithographic equipment is the structure of a silicon chip platform, and as shown in Figure 1, system is mainly by illuminator 16, mask platform positioning system 15, projection objective system 14, silicon chip platform motion locating system 2, focusing and leveling detection system 13 compositions such as grade, wherein 200 is silicon chip, 500 is mask.Illuminator is made up of lighting source and illumination objective lens system, and light beam is imaged on the figure on the mask on the silicon chip by the projection objective with reduction magnification by mask unit, is photoetching process.Silicon chip is carried in the basic role of silicon chip platform motion locating system exactly, aims at exposure, actions such as last lower silicon slice, all actions are all carried out on a silicon chip platform, and the circulation of single silicon wafer exposure as shown in Figure 2, everything series operation, the production efficiency of system are just by this circulation decision.Improve the production efficiency of system, need to shorten the working time of each several part.Along with chip features live width (CD) is more and more littler, the technique of alignment precision prescribed is more and more higher at present, and the silicon chip platform is required to realize the high precision low-velocity scanning, and it is quite difficult to want to reduce the aligning time.Only improve constantly the stepping and the exposure sweep velocity of silicon chip platform in addition, but improving constantly of speed can cause dynamic performance to worsen, this technical requirement to protective device and running precision control is very high, and the cost of paying improves greatly.
The structure of two silicon chip platforms has appearred adopting at present on lithographic equipment, as shown in Figure 3, system forms similar Fig. 1, comprise illuminator 16, mask platform positioning system 15, projection objective system 14, silicon chip platform positioning system 2a, 2b, focusing and leveling detection system 13, with the single silicon-chip platform many a silicon chip platform.Two silicon wafer stage systems with aim in the photo-mask process, another one platform 2a is transferred in work such as sheet up and down, so just can with the silicon chip platform 2b concurrent working of carrying out exposure, expose shown in the circulation synoptic diagram as Fig. 4, the exposure of single silicon chip is shortened cycling time greatly, is not improving can enhance productivity under the silicon chip platform step-scan speed conditions (throughput).The patent of two platforms such as WO98/40791 (open date: 1998.9.17; Country origin: Holland) describe, have the unit of two commutative cooperations and a platform to support seat in each silicon chip platform structure, platform supports seat to link to each other with guide rail.During work, a silicon chip can be in the pre-service work before the pre-service station exposes, the another one silicon chip exposes at the exposure station, when two end-of-jobs, two platforms all move to switch respectively, after carry out the exchange that platform is supported seat, from the engagement unit of a platform, move to the engagement unit of another one platform, thereby realize the exchange of two silicon chip platforms.This mode can realize shortening the exposure working time of each silicon chip, does not improve under the silicon chip platform movement velocity to increase substantially production efficiency.
Yet also there are some problems in this structure, is the mode of being of coupled connections because each adopts with guide rail, in exchange process, and platform support seat and silicon chip platform need of short duration separation, platform is in free state during this period of time, can the bearing accuracy of system be impacted.At patent US 2001/0004105 (open date 2001.6.21; Country origin: Holland) though in foregoing invention is improved, but increased many protective devices and pick-up unit, system architecture is complicated.Because when running to the position of two exchanges, there is the range of movement overlapping region in two silicon chip platforms, this can cause bumping in two platform motion processes, causes serious consequence in addition.The Machine guarding and the hardware and software control method of many anti-this kind collisions have been proposed simultaneously, the problem that these need that all are structure itself exists overcome in the latter's patent.
Patent WO 01/40875 (open date 2001.7.6; Country origin: proposed another two platform structure the U.S.), the distinguishing feature of this invention is that each all has independently a sheet device and an alignment device up and down, divides the both sides that are located at the whole silicon wafer base station, is the exposure position in two centre positions.During work, a silicon chip platform can be carried out exposure, the another one platform carries out sheet and aligning up and down simultaneously, when the work of two platforms is finished, but the silicon chip platform straight line that is in exposure position shifts out the exposure position, aims at the platform shift-in exposure position that finishes simultaneously, and two platforms move mutually noninterfere, and the path of operation is short, and exchange velocity is fast.Finish the platform of silicon wafer exposure and just can carry out down sheet, last new film, the pre-service work before exposing on the measurement position of self in the back.Finish the exposure circulation of a silicon chip like this.
The structure of above-mentioned patent is moved simple and reliablely, has overcome the deficiency of first kind of scheme mentioned above, but has been apparent that very much, and this structure and preceding a kind of comparison are overlapped alignment device and sheet device up and down owing to have more one, and cost significantly increases.Alignment device or focusing leveling device accuracy requirement are very high, no matter be the processing and manufacturing of device itself, and Unit Installation requires also to require to have turned over one times with the control of single alignment device, and all situations have all significantly increased the manufacturing cost of system.In addition, because the exposure station is arranged on the centre position of two pre-service stations, for the whole silicon wafer base station, the above-mentioned first kind of patent scheme of comparing, many stations have so just increased the overall dimension of silicon chip base station.
Summary of the invention
The technical issues that need to address of the present invention are to provide a kind of step scan photo-etching machine double-platform exchanging and positioning system, make that silicon wafer exposure becomes shorter cycling time the time simple in structure.
Technical scheme of the present invention is as follows:
Comprise total base station, be arranged on total base station and run on the silicon chip platform positioning unit of exposure station and run on the silicon chip platform positioning unit of pre-service station, each silicon chip platform positioning unit comprises the silicon chip bogey, the motion positions pick-up unit, x is to guide rail, y is to guide rail, striated pattern, each silicon chip bogey is installed on x on guide rail, can be along x to guide rail movement, x is installed in y to guide rail also can be along y to guide rail movement on guide rail, the x of two stations can dock to guide rail, striated pattern all is installed on the guide rail, motion positions pick-up unit position measurement and the feedback that station silicon wafer exposure and pre-service station silicon chip are aimed at that be used to expose, it is characterized in that: the pre-service station is provided with an x to guide rail, and the exposure station is provided with two x to guide rail.
As improvement of the present invention, on described each silicon chip bogey, be respectively arranged with cable stage, cable stage can be in total base station two lateral movements by the cable stage guide rail.Described cable stage comprise x to slide block, be arranged on the y of x in slide block to slide block, drive x to the x of slide block movement to drive unit and drive y to the y of slide block movement to drive unit.
As improvement of the present invention, air-bearing is adopted in being connected of described each silicon chip bogey and guide rail, can adopt one of the air-bearing of vacuum preload or permanent magnetism preload air-bearing.
As improvement of the present invention, described motion positions pick-up unit adopts laser interferometer system, is arranged at the mutually perpendicular both sides of silicon chip platform positioning unit respectively.
As improvement of the present invention, each silicon chip bogey is carried on x on line slideway, and can make the friction free step motion to guide rail along x, x has the y that becomes the H type with it to line slideway to the both sides of guide rail, and guide's x rail bearing carries the silicon chip bogey can make the friction free step motion at y on guide rail.
As improvement of the present invention, each x all has striated pattern to the y of guide rail and both sides on guide rail, is used for the position location feedback of silicon chip platform.
The present invention's beneficial effect compared with prior art is: because a guide rail is set up in exposure position, not only can realize the exchange of two bogeys, greatly reduce board consuming time of exposure position simultaneously, exchange process becomes simply, and cost is effectively controlled.In addition, adopt two stations: the pre-service station before exposure station and the exposure, realized the concurrent working of two stations, reduced the time of each silicon wafer exposure, system can enhance productivity under the constant situation of the movement velocity that keeps separate unit silicon chip platform positioning system and acceleration; In addition, the simple structure of the present invention makes has eliminated the overlapping region on the work space, and two station work are no longer interfered, thereby needn't adopt the device of extra anticollision, have simplified system, have reduced cost, have improved reliability effectively.
Description of drawings
Fig. 1 is the litho machine structural representation of single silicon-chip platform positioning system;
Fig. 2 is single silicon-chip platform exposure circulation synoptic diagram;
Fig. 3 is the litho machine structural representation of existing pair of silicon chip platform positioning system;
Fig. 4 is two silicon chip platform exposure circulation synoptic diagram of corresponding diagram 3;
Fig. 5 is the structural representation of the two silicon chip platform positioning systems of the present invention;
Fig. 6 changes process flow diagram for of the present invention pair of silicon chip chaptrel;
Fig. 7～Figure 12 is the dynamic duty synoptic diagram of a workflow.
The 1-base station
2,2a, 2b-all refer to silicon chip platform motion locating system
13-focusing and leveling and alignment device
The 14-projection objective system
15-mask platform motion locating system
The 16-illuminator
The 200-silicon chip
The 500-mask
10a, 10b, 11b are that x is to rail unit
20a, 21a, 20b, 21b are that y is to the line slideway face
30a, 30b are cable stage
39a, 39b are the cable stage guide rail
40a, 49a, 40b, 41b, 49b are linear gratings
50a, 51a, 50b, 51b are two-frequency laser interferometer
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is elaborated.
Fig. 5 has shown the state when the two silicon chip platform positioning systems of the present invention are in work, its structure comprises total base station 1, be arranged on total base station and run on the silicon chip platform positioning unit of exposure station and run on the silicon chip platform positioning unit of pre-service station, and each silicon chip platform positioning unit comprises silicon chip bogey 2a (the silicon chip bogey of pre-service station), 2b (the silicon chip bogey of exposure station), motion positions pick- up unit 50a, 51a, 50b, 51b; X is to guide rail 10a or 10b, 11b; Y is to guide rail 20a, 21a or 20b, 21b, each silicon chip bogey is installed on x on guide rail, can be along x to guide rail movement, x is installed in y to guide rail also can be along y to guide rail movement on guide rail, the x of two stations can dock to guide rail, striated pattern 40a all is installed on the guide rail, 49a or 40b, 41b, 49b, motion positions pick-up unit be used to the to expose position measurement and the feedback of station silicon wafer exposure position and pre-service station silicon chip aligned position, the x of pre-service station setting is 10a to guide rail, from Fig. 7-13, exposure station two x up and down is respectively 10b to guide rail, 11b.Remove this, also comprise cable stage 30a, 30b,, it is through being arranged at cable stage guide rail 39a, the 39b motion of total base station both sides.
As Fig. 5, the work that this moment, the x that can dock set at the pre-service station to line slideway 10a and silicon chip bogey 2a, the exposure work that x sets at the exposure station to line slideway 10b and another silicon chip bogey 2b, wherein x to line slideway 11b in silicon chip edge of table position, the platform with exposure does not produce interference, temporarily is in idle state.Cable stage 30a, 30b drive by being arranged at its inner drive unit, make the cable on the silicon chip bogey keep being synchronized with the movement with silicon chip bogey 2a, 2b.
Silicon chip bogey 2a of the present invention, 2b and guide rail 10a, 10b, 11b, adopted the friction free air-bearing between guide rail 10a, 10b, 11b and guide rail 20a, 21a, 20b, the 21b, the preload mode of vacuum preload as air bearing adopted at some position, optionally also can adopt the permanent magnetism preload.
Striated pattern 40a, 49a, 40b, 41b, 49b are housed on the guide rail of the present invention respectively, grating 40a, 40b, 41b can be used as two silicon chip bogey 2a, the 2b position feedback device along the x direction, and striated pattern 49a, 49b then can be used as silicon chip bogey 2a, the 2b position feedback device along the y direction.To the center exposure position of exposure station and the aligned position of pre-service station, adopt laser interferometer detection system 50a, 51a, 50b, 51b as the position measurement feedback assembly.The position of two platform exchange process also adopts aiding sensors to be controlled in addition.
Fig. 6 has shown the flow process of two silicon chip platform work, in photoetching process, according to the present practice gained, the exposure area pattern of the sheet up and down of silicon chip and aligning time and silicon chip thereof will be less than the exposure needed time of whole silicon wafer detection time, therefore, the flow process of two platform work can be optimized for the step shown in the process flow diagram, the visible Fig. 7-Figure 12 of detailed topology layout.
Table scale with temporary pre-service station among the figure is 2a, and the table scale of exposure station is 2b.In operation beginning, see step 200, two platforms all do not have silicon chip, at this moment, 2b is in idle state, the 2a platform moves to sheet position last slice up and down, after aim at data acquisition with focusing and leveling, see Fig. 7 in detail.Position probing is by striated pattern 40a, 49a and laser interferometer 50a, 51a feedback.
Step 210 sees Fig. 8 for details, after the silicon chip pre-service of silicon chip bogey 2a is finished, move to switch, two guide rails and the silicon chip bogey 2b of station of exposing this moment also moves to switch, realizes docking of guide rail 10a and guide rail 11b, and the position is controlled by striated pattern and sensor.
Step 220 sees Fig. 9 for details, and subsequently, linear motor driving silicon chip bogey 2a moves to the exposure station from the pre-service station, finishes the exchange of pretreated silicon chip platform.
Step 230, see Figure 10 for details, the guide rail of pre-service station moves quickly into the position of having finished the silicon chip platform 2b place of exposure in the exposure station, and realization guide rail 10a docks with guide rail 10b's, and 2b moves to the pre-service station from exposure position with guiding silicon chip bogey.
Step 240 sees Figure 11 for details, and silicon chip bogey 2b moves to the pre-service station from the exposure station under linear motor driving.Two chaptrels change execution.
Step 250 sees Figure 12 for details, and silicon chip bogey 2b moves to the position of sheet up and down of prealignment station, and the silicon chip that exposure is finished shifts out, and uploads new silicon chip, after move to aligned position, carry out a series of setting action; Simultaneously, silicon chip bogey 2a is driven by guide rail 11b, carries out exposure actions in the exposure position, and guide rail 10b moves to marginal position and temporarily is in idle state.
Step 260, the silicon wafer exposure of silicon chip bogey 2a finishes, and moves to switch; Simultaneously, the 2b that pre-service finishes also moves to switch, and realization guide rail 10a docks with 10b's, and by linear motor driving, 2b moves to the exposure station from the pre-service station.Picture specification is similar to the platform switch Fig. 8-9 among Fig. 7 in detail.
Step 270 after the guide rail 10a guiding silicon chip bogey 2b of pre-service station moves to the exposure station, moves quickly into the base station other end, and 11b achieves a butt joint with guide rail.This moment, silicon chip bogey 2b waited exposure.Picture specification is similar to Figure 10 in detail.
Step 280, linear motor driving silicon chip bogey 2a moves to the pre-service station from the exposure station, after can carry out a series of down last slice, setting work such as aligning and focusing and leveling measurement; Silicon chip bogey 2b carries out exposure actions under the driving of guide rail 10b.Picture specification is similar to Figure 11-Figure 12 in detail.
Wait for the silicon wafer exposure of 2b platform after step 290, the pre-service of 2a platform finish, when the exposure of 2b platform finishes, just move to switch respectively, the guide rail 10a of pre-service station docks with the temporarily idle guide rail 11b of exposure station, carries out the mobile exchange of platform.Repeating step 220 circulates with this, finishes continuous silicon wafer exposure action.
Below described the specific embodiment of the present invention, but the present invention does not limit to the motion positions that is used for the semiconductor lithography silicon chip, specifically, can be used for any needs and accurately locate, but and realize two the exchange concurrent workings device or systems.Therefore,, those skilled in the art will appreciate that under the situation that does not deviate from disclosed scope of the present invention in claims that any various modifications, interpolation and replacement all belong to protection scope of the present invention though disclose the preferred embodiments of the present invention.

Claims (9)

1. step scan photo-etching machine double-platform exchanging and positioning system, comprise total base station, be arranged on total base station and run on the silicon chip platform positioning unit of exposure station and run on the silicon chip platform positioning unit of pre-service station, each silicon chip platform positioning unit comprises the silicon chip bogey, the motion positions pick-up unit, x is to guide rail, y is to guide rail, striated pattern, each silicon chip bogey is installed on x on guide rail, can be along x to guide rail movement, x is installed in y to guide rail also can be along y to guide rail movement on guide rail, the x of two stations can dock to guide rail, x all is equipped with striated pattern to guide rail and y on guide rail, motion positions pick-up unit be used to the to expose position measurement and the feedback of station silicon wafer exposure position and pre-service station silicon chip aligned position, it is characterized in that: the pre-service station is provided with an x to guide rail, and the exposure station is provided with two x to guide rail.
2. double-platform exchanging and positioning system as claimed in claim 1 is characterized in that: be respectively arranged with cable stage on described each silicon chip bogey, cable stage can be in total base station two lateral movements by the cable stage guide rail.
3. double-platform exchanging and positioning system as claimed in claim 2 is characterized in that: described cable stage comprise x to slide block, be arranged on the y of x in slide block to slide block, drive x to the x of slide block movement to drive unit and drive y to the y of slide block movement to drive unit.
4. double-platform exchanging and positioning system as claimed in claim 1 is characterized in that: described each silicon chip bogey adopts air-bearing with being connected of guide rail.
5. double-platform exchanging and positioning system as claimed in claim 4 is characterized in that: described air-bearing adopts the air-bearing of vacuum preload or the air-bearing of permanent magnetism preload.
6. double-platform exchanging and positioning system as claimed in claim 1 is characterized in that: described motion positions pick-up unit adopts the two-frequency laser interferometer system, is arranged at the perpendicular both sides of silicon chip platform positioning unit respectively.
7. double-platform exchanging and positioning system as claimed in claim 1 is characterized in that: described silicon chip bogey makes not have the friction step motion along x to guide rail.
8. double-platform exchanging and positioning system as claimed in claim 1 is characterized in that: described x becomes H type with the y of its both sides to line slideway to guide rail.
9. as claim 1 or 8 described double-platform exchanging and positioning systems, it is characterized in that: described guide's x rail bearing carries the silicon chip bogey can make not have the friction step motion at y on guide rail.
CNB2006100257497A 2006-04-14 2006-04-14 Stepping scan photo-etching machine double-platform exchanging and positioning system Active CN100504614C (en)

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CNB2006100257497A CN100504614C (en) 2006-04-14 2006-04-14 Stepping scan photo-etching machine double-platform exchanging and positioning system
PCT/CN2006/002862 WO2007118376A1 (en) 2006-04-14 2006-10-26 Dual stage switching positioning system for step and scan lithography machine

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Patentee before: Shanghai Micro Electronics Equipment Co., Ltd.

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