CN100504614C - Stepping scan photo-etching machine double-platform exchanging and positioning system - Google Patents

Stepping scan photo-etching machine double-platform exchanging and positioning system Download PDF

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CN100504614C
CN100504614C CN 200610025749 CN200610025749A CN100504614C CN 100504614 C CN100504614 C CN 100504614C CN 200610025749 CN200610025749 CN 200610025749 CN 200610025749 A CN200610025749 A CN 200610025749A CN 100504614 C CN100504614 C CN 100504614C
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wafer
station
stage
dual
exposure
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CN 200610025749
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CN1828427A (en
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李小平
李映笙
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上海微电子装备有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70716Stages
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70691Handling of masks or wafers
    • G03F7/70733Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask

Abstract

本发明公开了一种步进扫描光刻机双台交换定位系统,预处理工位设置有一个x向导轨,曝光工位设置有两个x向导轨。 The present invention discloses a step and scan lithography dual stage switching positioning system, there is provided a pre-processing workstation x is set to the guide rails, the exposure station has two x-guide rails. 有益效果是:不仅可以实现两承载装置的交换,极大地减少了曝光位的交换台的耗时,还实现了两个工位的并行工作,减少了每个硅片曝光的时间,系统可在保持单台硅片台定位系统的运动速度和加速度不变的情况下提高生产效率;简化了系统,降低了成本,有效地提高了可靠性。 Beneficial effects: two exchange can be achieved not only carrying device, greatly reducing the time-consuming exposure level switch station, also implements two parallel working stations, reducing the exposure time per wafer, the system can improved while maintaining a single wafer stage positioning system constant velocity and acceleration of productivity; simplifies the system, reducing the cost and effectively improves the reliability.

Description

步进扫描光刻机双台交换定位系统 Step and scan lithography dual stage switching Positioning System

技术领域 FIELD

本发明属于精确定位领域,尤其涉及半导体行业中硅片的运动定位装置。 The present invention is in the field of precision positioning, in particular, it relates to the movement positioning apparatus wafers in the semiconductor industry.

背景技术 Background technique

光刻工序是指将掩模上的芯片图形曝光转印到硅片上,它是集成电路芯片生产制造过程中重要的工序之一。 Photolithography step is a chip pattern on the mask onto the wafer exposure, it is an important step of the manufacturing process of integrated circuit chips. 一道光刻工序中包含多道子工序: A photolithography process comprising a multi-channel sub-steps of:

上下片、预对准、对准、曝光等。 Upper and lower sheets, pre-alignment, alignment exposure and the like. 系统的生产效率(throughput)由各道 System productivity (throughput) by the channel

子工序运行速度决定。 Sub-Processing speed decisions.

典型的光刻设备是一个硅片台的结构,如图1所示,系统主要由照明 Typical lithographic apparatus is a wafer stage configuration, as shown, the illumination system 1 is mainly composed of

系统16,掩模台定位系统15,投影物镜系统14,硅片台运动定位系统2,调焦调平检测系统13等组成,其中200为硅片,500为掩模。 System 16, mask table positioning system 15, projection lens system 14, the wafer stage motion positioning system 2, the focus leveling detection system 13 and the like, of which silicon wafer 200, 500 as a mask. 照明系统由照明光源和照明物镜系统组成,光束通过掩模单元,将掩模上的图形通过具有縮小倍率的投影物镜成像在硅片上,即为光刻过程。 The illumination system by the illumination light source and the objective system composed of the illumination light beam through a mask unit, by the pattern on the mask on the wafer, i.e. a lithographic process having a reduction magnification of the projection objective image. 硅片台运动定位系统的基本作用就是承载硅片,进行对准,曝光,上下硅片等动作,所有的动作都在一个硅片台上执行,单个硅片曝光的循环如图2所示,所有动作串联运行,系统的生产效率就由这个循环决定。 The basic role of the wafer stage positioning system is moving the wafer carrier, aligning, exposure, silicon wafer down operation, all the movements are performed in a wafer stage, a single wafer exposure cycle shown in Figure 2, all action series to run on the production efficiency of the system is determined by the cycle. 要提高系统的生产效率,需要缩短各部分的运行时间。 To improve the production efficiency of the system, it is necessary to shorten the running time of each part. 目前随着芯片特征线宽(CD)越来越小,对准技术要求精度越来越高,对硅片台要求实现高精度低速扫描,想要减少对准时间相当困难。 With the current chip feature size (CD) smaller, increasingly high precision alignment techniques required for high accuracy wafer stage requires the slow scan, want to reduce the alignment time is very difficult. 另外只有不断提高硅片台的步进和曝光扫描速度,但速度的不断提高会导致系统动态性能恶化,这对保护装置和运行精度控制的技术要求非常高,付出的成本大大提高。 Further exposure step and only continue to increase the scanning speed of the wafer stage, but continues to increase in speed will cause deterioration in dynamic performance, protection devices and techniques which control the operation precision is very high, greatly increased the cost paid.

目前在光刻设备上已出现采用双硅片台的结构,如图3所示,系统组 Currently dual wafer stage structure already on the lithographic apparatus, the system group 3 in FIG.

成结构类似图l,包括照明系统16,掩模台定位系统15,投影物镜系统14,硅片台定位系统2a、 2b,调焦调平检测系统13,与单硅片台比较多 Similar to the L configuration, comprises an illumination system 16, more mask table positioning system 15, projection lens system 14, a wafer stage positioning system 2a, 2b, the focus leveling detection system 13, the wafer stage single

了一个硅片台。 A wafer stage. 双硅片台系统将光刻工序中对准、上下片等工作转移到另外一个台2a,这样就可以与执行曝光的硅片台2b并行工作,如图4曝光 Dual wafer stage lithography process will be aligned, the upper and lower sheet is transferred to another work station 2a, so that it can work in parallel with the exposure of the wafer stages performed 2B, exposure in FIG. 4

循环示意图所示,单个硅片的曝光循环时间大大縮短,在不提高硅片台步进扫描速度情况下可提高生产效率(throughput)。 Cycle shown a schematic, greatly reducing the cycle time of a single wafer exposure, without increasing the scan speed of the wafer stepper case can improve production efficiency (throughput). 双台的专利如WO98/40791(公开日期:1998.9.17;国别:荷兰)所描述,每个硅片台结构中有两个可交换配合的单元和一个台支持座,台支持座与导轨相连。 Patent dual stage as WO98 / 40791 (Publication Date: 1998.9.17; Country: The Netherlands) as described, each of the wafer stage structure has two cooperating exchangeable unit and a support base station, base station supports the guide rail connected. 工作时, 一个硅片可在预处理工位进行曝光前的预处理工作,另外一个硅片在曝光工位进行曝光,当两项工作结束,两个台都分别移动到交换位置,后进行台支持座的交换,从一个台的配合单元,移动到另外一个台的配合单元,从而实现两硅片台的交换。 In operation, a wafer may be performed in the pretreatment station preprocessing before the exposure, the wafer is exposed in the other exposure station, when the end of the two work stations are moved respectively to the two switching positions, after station support base exchange with the unit from a station, with the mobile unit to another station, thereby enabling the exchange of two wafer stages. 这种方式可以实现縮短每个硅片的曝光工作时间,不提高硅片台运动速度下大幅度提高生产效率。 This embodiment may be implemented to shorten the exposure time per wafer is working, without increasing significantly improve production efficiency in the wafer stage moving speed.

然而这种结构也存在一些问题,由于每个台与导轨采用的是耦合连接方式,在交换过程中,台支持座与硅片台需短暂分离,这段时间台处于自由状态,会对系统的定位精度造成影响。 However, this structure also has some problems, because each station uses the guide rail coupling connection, in the exchange process, the base station supports the wafer stage for an isolated short, this time table in a free state, the system will positioning accuracy affected. 在专利US2001/0004105(公开日期2001.6.21;国别:荷兰)中虽对上述发明进行了改进,但是增加了许多防护装置和检测装置,系统结构复杂化。 Patent US2001 / 0004105 (Publication Date 2001.6.21; Country: The Netherlands) Although the foregoing invention has been improved, but increased the number of protection devices and the detection means, the system configuration complicated. 另外由于两硅片台在运行到两台交换的位置时,存在运动范围重叠区域,这会导致双台运动过程中发生碰撞,造成严重后果。 Further since the two wafer stages during operation of the switching position of the two, there is a motion range overlapping area, which leads to a collision dual stage during the movement, resulting in serious consequences. 在后者的专利中同时提出了许多防此种碰撞的机械保护装置和硬软件控制方法,这都是结构本身存在的需克服的问题。 In the latter patents also proposed numerous mechanical protection devices and control hardware and software such anti-collision method, which is a problem to be overcome exists in the structure itself.

专利WO 01/40875 (公开日期2001.7.6;国别:美国)中提出了另外一种双台结构,此发明的显著特点是每个台都有一个独立的上下片装置和对准装置,分设在整个硅片基台的两边,在两台的中间位置为曝光位。 Patent WO 01/40875 (publication date 2001.7.6; Country: USA) proposed another dual stage configuration, a distinctive feature of this invention is that each station has a separate alignment means and the upper and lower plate means, divided around the entire base of the wafer, it is at an intermediate position exposing the two bits. 工作时, 一个硅片台可以执行曝光,另外一个台同时进行上下片和对准, 当两个台的工作完成,处在曝光位置的硅片台可直线移出曝光位,同时对准完毕的台移进曝光位,两个台移动互不干涉,且运行的路径短,交换速度快。 In operation, a wafer stage may perform the exposure station at the same time a further upper and lower sheets and aligned when the two work stations is completed, at the exposure position of the wafer stage may be linearly moved out of the exposure position, while the alignment station is completed moved into an exposure position, two mobile stations interfere with each other, and a short path operation, exchange speed. 完成硅片曝光的台就可执行下片,上新片,后在自身的测量位上进行曝光前的预处理工作。 Exposing the wafer to complete the station can perform the backsheet, the new film, after exposure in the pretreatment of the work before the measuring site itself. 这样完成一个硅片的曝光循环。 Such a silicon wafer exposure cycle is completed.

上述专利的结构,运行简单可靠,克服了上文所述第一种方案的不足, 但是非常明显的是,这个结构与前一种比较,由于多出一套对准装置和上下片装置,成本显著增加。 Structure of the above patent, simple and reliable operation, overcomes the deficiencies of the first embodiment described above, it is obvious that this structure for comparison with the former, since the multiple alignment means and a set of upper and lower plate means, the cost of A significant increase. 对准装置或调焦调平装置精度要求非常高,不论是装置本身的加工制造,而且装置的安装要求也与单对准装置的控制要求翻了一倍,种种情况都显著增加了系统的制造成本。 Alignment means or a focus leveling apparatus of very high precision, regardless of the manufacturing apparatus itself, and the installation requirements of the device and also a single alignment device control requirements doubled, these circumstances significantly increased manufacturing system cost. 另外,由于曝光工位设置在两个预处理工位的中间位置,对于整个硅片基台而言,相比较上述第一种专利方案,多了一个工位,这样就增加了硅片基台的总体尺寸。 Further, since the exposure station disposed at an intermediate position of the two pre-processing workstation, the entire base wafer, the above-described first comparison Pat embodiment, more than one station, thus increasing the base wafer the overall size. 发明内容 SUMMARY

本发明需要解决的技术问题在于提供一种步进扫描光刻机双台交换定位系统,使得结构简单的同时硅片曝光循环时间变得更短。 The present invention is a technical problem to be solved is to provide a step and scan lithography dual stage switching positioning system, such that a simple structure while the wafer was exposed becomes shorter cycle times.

本发明的技术方案如下: Aspect of the present invention is as follows:

包括总基台、设置在总基台上并运行于曝光工位的硅片台定位单元和运行于预处理工位的硅片台定位单元,每个硅片台定位单元包括硅片承载装置、运动定位检测装置、x向导轨、y向导轨、线性光栅,每个硅片承载装置安装于x向导轨上,可沿x向导轨运动,x向导轨安装在y向导轨上并可沿y向导轨运动,两个工位的x向导轨可进行对接,导轨上均安装有线性光栅,运动定位检测装置用于曝光工位硅片曝光和预处理工位硅片对准的位置测量和反馈,其特征在于:预处理工位设置有一个x向导轨, 曝光工位设置有两个x向导轨。 Total base comprising, on a base and provided at a total run an exposure station and a wafer stage positioning unit of the pre-processing workstation running on the wafer stage positioning unit, each wafer stage positioning unit comprises a wafer supporting means, motion positioning detectors, x-direction guide, a linear grating, each of the wafer supporting means is mounted on the rail, the upper rail y x, may be the guide rail, the guide rail is mounted to the x y in the y direction along the guide rail and along the x-direction guide rail, two x-guide rail stations can be docked, the upper rail are attached to a linear grating, motion detecting means for positioning the exposure station and exposing pre-processing workstation silicon wafer alignment position measurement and feedback, characterized in that: there is provided a pre-processing workstation x is set to the guide rails, the exposure station has two x-guide rails.

作为对本发明的改进,在所述每个硅片承载装置上分别设置有线缆台,线缆台通过线缆台导轨可在总基台两侧运动。 As an improvement of the invention, in each of the wafer supporting units are provided with a cable, the cable station through the cable guide table can be moved on both sides of the total base. 所述线缆台包括x向滑块、设置在x向滑块内的y向滑块,驱动x向滑块运动的x向驱动装置和驱动y向滑块运动的y向驱动装置。 The cable station comprises a slider to x, y to x is disposed in the slider to slide, the drive slide movement in the x-x to y drive means to drive the movement of the slider and a drive y.

作为对本发明的改进,所述每个硅片承载装置与导轨的连接采用气浮轴承,可采用真空预载的气浮轴承或永磁预载气浮轴承之一。 As an improvement of the invention, each of the wafer supporting means is connected to the guide rail using air bearing, may be employed is a vacuum preloaded air bearing or air bearing one permanent preload.

作为对本发明的改进,所述运动定位检测装置采用激光干涉仪系统, 分别设置于硅片台定位单元互相垂直的两侧。 As an improvement of the invention, the positioning motion detection device using a laser interferometer system, each wafer stage positioning unit disposed in the mutually perpendicular sides.

作为对本发明的改进,每个硅片承载装置负载于x向直线导轨上, 并可沿x向导轨作无摩擦的步进运动,x向导轨的两侧有与之成H型的y 向直线导轨,x向导轨承载硅片承载装置可在y向导轨上作无摩擦的步进运动。 As an improvement of the present invention, each of the wafer supporting means supported on the x linear guide, friction may be a stepping motion along the x-rails, the rail on both sides of the x-direction has to be H-shaped with the straight line y rails, x-direction guide means carrying the wafer carrier may be made without friction the stepping motion to the upper rail in y.

作为对本发明的改进,每个x向导轨和两侧的y向导轨上均有线性光栅,用于硅片台的定位位置反馈。 As an improvement of the present invention, each x has a linear grating onto the rail and the rail on both sides of y, the position of the wafer stage for positioning feedback.

本发明与现有技术相比的有益效果是:由于曝光位增设一个导轨,不 Beneficial effects compared with the prior art of the present invention: since the exposure position one additional rail, not

仅可以实现两承载装置的交换,同时极大地减少了曝光位的交换台的耗时,交换过程变得简单,成本得到有效控制。 Only two switching can be realized carrying device, while significantly reducing the time consuming exposure level switch station exchange process becomes simple, cost-effective control. 另外,采用两个工位:曝光工位和曝光前的预处理工位,实现了两个工位的并行工作,减少了每个硅片曝光的时间,系统可在保持单台硅片台定位系统的运动速度和加速度不变的情况下提高生产效率;另外,本发明简单的结构使得工作空间上消除了重叠区域,两工位工作不再干涉,因而不必采用额外的防碰撞的装置, 简化了系统,降低了成本,有效地提高了可靠性。 Further, the use of two stations: exposure station and the pre-processing workstation before the exposure, to achieve the two stations in parallel, reducing the exposure time per wafer, the system can be maintained in a single wafer stage positioning increase productivity case where the speed and acceleration of movement of the same; Further, the present invention is a simple structure such that the upper working space eliminates the overlap region, two work stations not interfere, it is unnecessary to use additional anti-collision device, simplification the system, reducing the cost and effectively improves the reliability. 附图说明 BRIEF DESCRIPTION

图1为单硅片台定位系统的光刻机结构示意图; 图2为单硅片台曝光循环示意图; FIG 1 is a single wafer stage lithography machine positioning system schematic structure; FIG. 2 is a schematic view of a single wafer stage exposure cycle;

图3为现有的双硅片台定位系统的光刻机结构示意图; 3 is a schematic structure of a conventional dual wafer stage lithography machine positioning system;

图4为对应图3的双硅片台曝光循环示意图; 4 is a corresponding view of a dual wafer stage 3 is a schematic view of an exposure cycle;

图5为本发明双硅片台定位系统的结构示意图; Structure of FIG. 5 of the present invention dual wafer stage positioning system schematic;

图6为本发明的双硅片台轮换流程图; FIG dual wafer stage 6 of the present invention, rotation of a flow chart;

图7~图12为一个工作流程的动态工作示意图。 7 to FIG. 12 is a schematic diagram of a dynamic operating workflow.

l-基台 l- base

2、 2a、 21>~均指硅片台运动定位系统 2, 2a, 21> ~ refer motion wafer stage positioning system

13- 调焦调平及对准装置 13- leveling and alignment means focusing

14- 投影物镜系统 14- projection lens system

15- 掩模台运动定位系统 Mask table positioning system 15 moving

16- 照明系统200-硅片500-掩模10a、 10b、 llb为x向导轨单元 The illumination system 500 16- 200- silicon mask 10a, 10b, llb of the rail unit x

20a、 21a、 20b、 21b为y向直线导轨面 20a, 21a, 20b, 21b of the linear guide surface y

30a、 30b为线缆台 30a, 30b for the cable station

39a、 39b为线缆台导轨 39a, 39b for the cable rail station

40a、 49a、 40b、 41b、 49b为线形光栅 40a, 49a, 40b, 41b, 49b is a linear grating

50a、 51a、 50b、 51b为双频激光干涉仪具体实施方式 50a, 51a, 50b, 51b is a dual-frequency laser interferometer DETAILED DESCRIPTION

以下结合附图和具体实施例对本发明作详细说明。 Hereinafter, the present invention is described in detail in conjunction with accompanying drawings and specific embodiments. 图5显示了本发明双硅片台定位系统处于工作时的状态,其结构包括总基台1、设置在总基台上并运行于曝光工位的硅片台定位单元和运行于预处理工位的硅片台定位单元,每个硅片台定位单元包括硅片承载装置2a (预处理工位的硅片承载装置)、2b (曝光工位的硅片承载装置)、运动定位检测装置50a、 51a、 50b、 51b; x向导轨10a、或10b、 lib; y向导轨20a、 21a或20b、 21b,每个硅片承载装置安装于x向导轨上,可沿x 向导轨运动,x向导轨安装在y向导轨上并可沿y向导轨运动,两个工位的x向导轨可进行对接,导轨上均安装有线性光栅40a、 49a或40b、 41b、 49b,运动定位检测装置用于曝光工位硅片曝光位置和预处理工位硅片对准位置的位置测量和反馈,预处理工位设置的x向导轨为10a,从图7-13 看,曝光工位上下两个x向导轨分别为10b、 llb。 5 shows a state where the double-wafer stage positioning in the working system of the invention, which comprises a total base structure 1, and provided the total submount exposure workstation running on wafer stage positioning unit and the pre-processing workstation running wafer stage positioning unit, each wafer stage positioning unit comprises a wafer supporting means 2a (pre-processing workstation wafer supporting means), 2B (exposure station wafer supporting means), a motion positioning detectors 50a , 51a, 50b, 51b; x-direction guide 10a, or 10b, lib; y-direction guide bars 20a, 21a or 20b, 21b, each of the wafer supporting means is mounted on the x-guide rails, the guide rail may be, along the x-x y-guide rail is mounted on the guide rail and the guide rail, two stations may be x-rail along the butt y, are attached to a linear grating 40a, 49a or 40b on the guide rail, 41b, 49b, the positioning motion detection means for feedback position measurement and exposure stations wafer exposure position and the alignment of the silicon wafer pre-processing workstation position, x pretreatment station is set to the guide rails 10a, seen from Figures 7-13, both upper and lower exposure station to x rail respectively 10b, llb. 除此,还包括线缆台30a、 30b、,其经过设置于总基台两侧的线缆台导轨39a、 39b运动。 In addition, station further includes a cable 30a, 30b ,, which is provided through both sides of the base station to the total cable holder guide rails 39a, 39b movement.

如图5,此时可对接的x向直线导轨10a和硅片承载装置2a在预处理工位进行设定的工作,x向直线导轨10b和另一个硅片承载装置2b在曝光工位进行设定的曝光工作,其中X向直线导轨lib在硅片台的边缘位 5, x 2a at this time can be docked in the pre-set working station to the linear guide 10a and the wafer supporting means, x be provided in the exposure station to the linear guide rail 10b and the other wafer supporting 2b given exposure work, the linear guide lib wherein X in the edge positions of the wafer stage

置,不与曝光的台产生干涉,暂时处于闲置状态。 Position, does not interfere with the exposure station, temporarily idle. 线缆台30a、 30b由设置于其内部的驱动装置驱动,使硅片承载装置上的线缆保持与硅片承载装置2a、 2b同步运动。 Cable station 30a, 30b is provided driving means inside thereof by the cable on the silicon wafer and the holding device carrier 2a, 2b wafer supporting synchronous movement.

本发明硅片承载装置2a、 2b与导轨10a、 10b、 llb,导轨10a、 10b、 11b与导轨20a、 21a、 20b、 21b之间采用了无摩擦的气浮轴承,某些部位采用了真空预载作为空气轴承的预载方式,视需要也可以采用永磁预载。 The present invention is a silicon wafer carrying device 2a, 2b and the guide rails 10a, 10b, llb, the guide rails 10a, 10b, 11b and the guide rails 20a, 21a, 20b, using the friction between the air bearing 21b, some parts using the vacuum pre as a way of carrying preloaded air bearing, a permanent magnet may be optionally preloaded employed.

本发明的导轨上均分别装有线性光栅40a、 49a、 40b、 41b、 4%,光栅40a、 40b、 41b可作为两个硅片承载装置2a、 2b沿x方向的位置反馈装置,线性光栅49a、 49b则可作为硅片承载装置2a、 2b沿y方向的位置反馈装置。 The position of the upper rail of the present invention are respectively provided with a linear grating 40a, 49a, 40b, 41b, 4%, gratings 40a, 40b, 41b as two wafer supporting means 2a, 2b in the x direction of the feedback device, linear gratings 49a , 49b may act as a wafer supporting means 2a, 2b in the y-direction the position feedback device. 对曝光工位的中心曝光位置和预处理工位的对准位置,采用激光干涉仪检测系统50a、 51a、 50b、 51b作为位置测量反馈装置。 Alignment position to the exposure position and the center of the pre-processing workstation exposure station, the detection system using a laser interferometer 50a, 51a, 50b, 51b as the position measurement feedback means. 两个台交换过程的位置另外还采用辅助传感器加以控制。 Position two-stage exchange process additionally be controlled using an auxiliary sensor.

图6显示了双硅片台工作的流程,在光刻过程中,根据当前实践所得,硅片的上下片和对准时间及其硅片的曝光区域形貌检测时间要少于曝光整个硅片所需要的时间,因此,双台工作的流程可优化为流程图所示的步骤,详细的结构布局可见图7-图12。 Figure 6 shows a dual wafer stage working process, in lithographic processes, according to the current topography of the exposure area detection time resulting practice, the upper and lower sheets and the wafer and wafer alignment time to less than expose the entire wafer time required, and therefore, the flow dual stage can be optimized to work steps shown in the flowchart, a detailed structural layout can be seen in FIG. 7 to 12.

图中将暂预处理工位的台称为2a,曝光工位的台称为2b。 FIG temporarily in the pre-processing workstation called station 2a, an exposure station called station 2b. 在操作开始,见步骤200,两个台都没有硅片,此时,2b处于闲置状态,2a台移动到上下片位置上片,后进行对准和调焦调平的数据采集,详细见图7。 In operation starts, see step 200, two sets of wafers are not, at this time, 2b is idle, 2a stage is moved to the vertical position of the sheet topsheet, the data acquisition and alignment of the focus leveling, detailed see 7. 位置检测由线性光栅40a、 49a和激光干涉仪50a、 51a反馈。 Position is detected by the linear grating 40a, 49a and the laser interferometer 50a, 51a feedback. 步骤210,详见图8,硅片承载装置2a的硅片预处理完成后,移动到交换位置,此时曝光工位的两个导轨和硅片承载装置2b也移动到交换位置,实现导轨10a与导轨lib的对接,位置由线性光栅和传感器检测控制。 Step 210, see Figure 8, the silicon wafer carrying device 2a of the pretreatment, is moved to the exchange position where the exposure stations and two wafer supporting rails 2b also moves to the switching position, the guide rail 10a to realize lib docking guide rail, the linear grating and controlled by the position sensor.

步骤220,详见图9,随后,直线电机驱动硅片承载装置2a从预处理工位移动到曝光工位,完成已预处理的硅片台的交换。 Step 220, see Figure 9, then, the linear motor driving means 2a is moved from the wafer carrier pre-treatment station to the exposure station, to complete the exchange of preprocessed wafer stage.

步骤230,详见图10,预处理工位的导轨快速移动到曝光工位中已经完成曝光的硅片台2b所在的位置,实现导轨10a与导轨10b的对接,以引导硅片承载装置2b从曝光位置移动到预处理工位。 Step 230, see FIG. 10, the rail pretreatment station to quickly move to a position in the exposure station has completed exposure where wafer stage 2b, to achieve docking guide rails 10a and 10b to guide the wafer supporting 2b exposing position to the pre-processing workstation.

步骤240,详见图ll,硅片承载装置2b在直线电机驱动下,从曝光工位移动到预处理工位。 Step 240, see FIG. Ll, 2b in the wafer supporting linear motor drive, moved from the exposure station to the pre-processing workstation. 两台轮换完成动作。 Two rotation to complete the action.

步骤250,详见图12,硅片承载装置2b移动到预对准工位的上下片位置,将曝光完毕的硅片移出,并上载新硅片,后移动到对准位置,进行一系列的设定动作;同时,硅片承载装置2a由导轨llb驱动,在曝光位进行曝光动作,导轨10b移动到边缘位置暂时处于闲置状态。 Step 250, see Figure 12, is moved to the wafer supporting 2b prealignment station vertical slice position, the exposed wafer is completed is removed, and upload the new wafer, after moving to the aligning position, a series of setting operation; at the same time, driven by a wafer supporting rails 2a LLB, the exposure position in the exposure operation, the guide rail 10b moves to the position of the edge is temporarily idle.

步骤260,硅片承载装置2a的硅片曝光完毕,移动到交换位置;同时,已经预处理完毕的2b也移动到交换位置,实现导轨10a与10b的对接,并由直线电机驱动,2b从预处理工位移动到曝光工位。 Step 260, the wafer was exposed wafer supporting structure 2a is completed, is moved to the switching position; the same time, has completed the pretreatment 2b also moves to the switching position, to achieve the rails 10a and 10b abutting, driven by a linear motor, from a pre-2b the processing station is moved to the exposure station. 详细图形说明类似于图7中的台交换位置图8-9。 Detailed graphical illustration similar to FIG exchange station 78-9 in the position of FIG.

步骤270,预处理工位的导轨10a引导硅片承载装置2b移动到曝光工位后,快速移动到基台另一端,与导轨llb实现对接。 Step 270, the pre-processing workstation rail guide 10a is moved to the wafer supporting 2b after exposure station, move quickly to the other end of the base, the guide rail achieve docking llb. 此时硅片承载装置2b等候曝光。 At this time, wafer supporting 2b waiting exposure. 详细图形说明类似于图10。 A graphical illustration similar to Figure 10 in detail.

步骤280,直线电机驱动硅片承载装置2a从曝光工位移动到预处理工位,后可以进行一系列的下上片、对准和调焦调平测量等设定工作;硅片承载装置2b在导轨10b的驱动下进行曝光动作。 Step 280, the linear motor driving means 2a is moved from the carrier wafer exposure station to the pre-processing workstation, the topsheet may be performed at a series of alignment and focus leveling measurement setting action; wafer supporting means 2b the exposure operation at the drive rail 10b. 详细图形说明类似于图11-图12。 Detailed graphical illustration similar to FIGS. 11 to 12.

步骤290, 2a台预处理完毕后等待2b台的硅片曝光,当2b台曝光完毕,就分别移动到交换位置,预处理工位的导轨10a与曝光工位的暂时闲置导轨llb对接,进行台的移动交换。 Step 290, after waiting for completion of the pretreatment station 2a 2b wafer exposure station, the exposure station 2b when finished, moves to the switching position respectively, the rail 10a and the pre-processing workstation exposure station temporarily idle guide llb docking station for the mobile exchange. 重复步骤220,以此循环,完成连续的硅片曝光动作。 Repeat step 220, this cycle, the completion of the continuous exposure operation of the wafer.

以上己描述了本发明的具体实施方式,但本发明不局限用于半导体光刻中硅片的运动定位,具体的说,可以用于任何需要精确定位,并实现两台交换可并行工作的装置或系统。 Have described above specific embodiments of the present invention, but the present invention is not limited to the movement of positioning a semiconductor wafer in lithography, specifically, it may be used in any desired precise positioning, and two switching means can be implemented in parallel or system. 因此,虽然已公开了本发明的优选实施例,但本领域技术人员将会意识到,在不背离权利要求书中公开的本发明的范围的情况下,任何各种修改、添加和替换均属于本发明的保护范围。 Thus, while the present invention has been disclosed preferred embodiments, those skilled in the art will appreciate that, in the scope of the present invention without departing from the claims of the disclosure, any of various modifications, additions and substitutions belong the scope of the present invention.

Claims (9)

1. 一种步进扫描光刻机双台交换定位系统,包括总基台、设置在总基台上并运行于曝光工位的硅片台定位单元和运行于预处理工位的硅片台定位单元,每个硅片台定位单元包括硅片承载装置、运动定位检测装置、x向导轨、y向导轨、线性光栅,每个硅片承载装置安装于x向导轨上,可沿x向导轨运动,x向导轨安装在y向导轨上并可沿y向导轨运动,两个工位的x向导轨可进行对接,x向导轨与y向导轨上均安装有线性光栅,运动定位检测装置用于曝光工位硅片曝光位置和预处理工位硅片对准位置的位置测量和反馈,其特征在于:预处理工位设置有一个x向导轨,曝光工位设置有两个x向导轨。 A step and scan lithography switching dual stage positioning system, comprising a total base wafer stage, and provided a total submount run an exposure station and a wafer stage positioning unit of the pre-processing workstation running positioning means, each wafer stage positioning unit comprises a wafer supporting means, the motion positioning detectors, x-guide rail, the linear grating, each of the wafer supporting means is mounted on the x-guide rails, along the x-direction guide rails, y movement, in x-y-guide rail is mounted on the guide rail and the guide rail, two stations may be x-rail along the butt y, x and y-direction guide rails are mounted on linear grating, the positioning motion detection device measurement and feedback to a wafer exposure position of the exposure station and the pre-processing workstation wafer position alignment position, characterized in that: there is provided a pre-processing workstation x is set to the guide rails, the exposure station has two x-guide rails.
2. 如权利要求1所述的双台交换定位系统,其特征在于:在所述每个硅片承载装置上分别设置有线缆台,线缆台通过线缆台导轨可在总基台两侧运动。 2. A dual-stage exchange of the location system as claimed in claim 1, wherein: each respectively provided on the wafer supporting a cable station, station cable through the cable guide may be a total station two base side movement.
3. 如权利要求2所述的双台交换定位系统,其特征在于:所述线缆台包括x向滑块、设置在x向滑块内的y向滑块,驱动x向滑块运动的x向驱动装置和驱动y向滑块运动的y向驱动装置。 The dual-stage exchange of the location system of claim 2, wherein: the cable station comprises a slider to x, y to x is disposed in the slider to slide, the slide movement of the drive x x-y movement of the slider to the drive means to the drive means and a drive y.
4. 如权利要求1所述的双台交换定位系统,其特征在于:所述每个硅片承载装置与导轨的连接采用气浮轴承。 4. The dual-stage exchange of the location system of claim 1, wherein: each of said wafer supporting connection with the guide rail using air bearing.
5. 如权利要求4所述的双台交换定位系统,其特征在于:所述气浮轴承采用真空预载的气浮轴承或永磁预载的气浮轴承。 5. The dual-stage exchange of the positioning system as claimed in claim 4, wherein: said air bearing vacuum preloaded air bearing or air bearing permanent preload.
6. 如权利要求1所述的双台交换定位系统,其特征在于:所述运动定位检测装置采用双频激光干涉仪系统,分别设置于硅片台定位单元相垂直的两侧。 Switching the dual stage positioning system as claimed in claim 1, wherein: said motion positioning detectors dual-frequency laser interferometer system are provided on the wafer stage positioning unit with vertical sides.
7. 如权利要求1所述的双台交换定位系统,其特征在于:所述硅片承载装置沿X向导轨作无摩擦步进运动。 The dual-stage exchange of the location system of claim 1, wherein: said wafer supporting means in the X-direction guide for the stepping movement without friction.
8. 如权利要求1所述的双台交换定位系统,其特征在于:所述X向导轨与其两侧的y向直线导轨成H型。 8. The dual-stage exchange of the location system of claim 1, wherein: said X-type H to guide into the linear guide y sides thereto.
9. 如权利要求1或8所述的双台交换定位系统,其特征在于:所述x向导轨承载着硅片承载装置在y向导轨上可作无摩擦步进运动。 9. A dual stage or the switching of claims 1-8 positioning system, characterized in that: the x-direction guide bars carries the wafer supporting rails may be made without friction the stepping movement in y.
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