CN101900945B - Overlay error compensation method - Google Patents

Overlay error compensation method Download PDF

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CN101900945B
CN101900945B CN2009100521898A CN200910052189A CN101900945B CN 101900945 B CN101900945 B CN 101900945B CN 2009100521898 A CN2009100521898 A CN 2009100521898A CN 200910052189 A CN200910052189 A CN 200910052189A CN 101900945 B CN101900945 B CN 101900945B
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wafer
data
stack
exposure
error
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CN2009100521898A
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CN101900945A (en
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张岩
彭震君
朱萍花
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中芯国际集成电路制造(上海)有限公司
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Abstract

The invention discloses an overlay error compensation method which is applied to a double-platform exposure machine bench. The difference between the overlay compensation values of two working platforms of the exposure machine bench is used for compensating the working platform with great overlay error. Thus, the overlay control difference between the two working platforms is reduced, and simultaneously, the overlay error of the working platforms is controlled within a required range; the performance and the qualification rate of semiconductors are improved.

Description

叠对误差补偿方法 Overlay error compensation method

技术领域 FIELD

[0001] 本发明涉及半导体制造领域,特别是涉及双一种用于双站(twin stage)曝光机台的叠对(overlay)误差补偿方法。 [0001] The present invention relates to the field of semiconductor manufacturing, and more particularly to an exposure method of error compensation stack machine for a dual station double (twin stage) to (overlay).

背景技术 Background technique

[0002] 半导体器件是通过产生一连串的图案化材料层及非图案化材料层而被制造,其中图案化材料层的特征在空间上是彼此相关联的。 [0002] The semiconductor device is manufactured by producing a series of patterned material layer and the non-patterned material layer, wherein the patterned material layer is characterized in spatially associated with each other. 因此,在制造过程中,每一个图案化的材料层皆需对准其前一个图案化的材料层。 Thus, in the manufacturing process, a patterned layer of material of each of the alignment units are required before a layer of material which is patterned. 于是,在半导体制造过程中,必须考虑到半导体基材(例如,晶圆)上材料层之间的相对准,即叠对(overlay)。 Thus, in a semiconductor manufacturing process, it must be considered a semiconductor substrate (e.g., wafer) is aligned between the material layer, i.e. the overlay (overlay). 因为,如果叠对误差比较大,将直接影响半导体器件的性能,甚至会因为连接层未对准所导致的短路而造成器件失效。 Because, if the overlay error is relatively large, it will directly affect the performance of semiconductor devices, because even a short-circuit connection layer caused by misalignment caused by device failure.

[0003] 随着半导体器件特征尺寸的逐渐缩小、材料层数的不断增加。 [0003] As the feature size of the semiconductor device is gradually reduced, increasing the number of layers of material. 传统显微镜判断层对层之间的叠对,已远远不能满足要求。 Analyzing conventional microscopes layer laminated between the layers, we can not meet the requirements. 为求更高精确度,必须借助比肉眼更精密的光学自动判断系统、自动侦测控制工作平台来完成叠对控制。 For the sake of greater precision, more precise than necessary by means of an optical eye automatic determination system, to automatically detect the completion of the work platform controls overlay control. 例如,利用微影设备中的曝光机台(包括扫描式(scanner)和步进式(stepper))来控制层对层之间的叠对。 For example, using a lithography exposure tool apparatus (including scanning (Scanner), and stepping (Stepper)) to control the layer laminated between the layers.

[0004] 在保证器件性能的同时,人们在不断追求器件的出产效率,于是,具有双平台(twin stage)的曝光机台便应用而生,这种曝光机台在空间上被划分为两个部分——测量端(measurement side)与曝光端(exposure side):测量端负责晶圆对准(alignment)、调平(leveling)与测量(晶圆图,wafer map),曝光端负责曝光(exposure)。 Exposure Machine [0004] In the same time ensures that the device performance, people continue to pursue the production efficiency of the device, thus, the platform having a double (twin stage) is then applied born, this exposure machine is divided into two spatially part - measuring terminal (measurement side) and the end of exposure (exposure side): measuring end is responsible for wafer alignment (alignment), leveling (leveling) with the measured (FIG wafer, wafer map), the exposure is responsible for exposing the end (exposure ). 其工作过程如下: The working process is as follows:

[0005] 假设最初状态是第一平台在测量端,第二平台在曝光端。 [0005] Suppose the initial state of the measuring platform is a first end, a second end of the exposure platform. 开始处理一批晶圆时,第一平台接到第一片晶圆,则先在测量端进行对准与测量;得到结果后,与第二平台一起移动到中间交换位置;第一平台被换到曝光端,用刚刚测量得到的结果对第一片晶圆进行曝光; 此时,第二平台被换到测量端,其接到第二片晶圆,对其进行对准与测量;等到第一片晶圆完成曝光后,第一平台与第二平台换位,将第一片晶圆传回,同时准备接第三片晶圆;而第二平台则对第二片晶圆进行曝光处理,而后依次重复。 Processing a batch of wafers at the beginning of the first platform to the first wafer, the first alignment measurement and the measurement end; the results obtained, together with a second intermediate platform is moved to the exchange position; the platform is a first transducer to the end of the exposure, the first wafer is exposed with the results just measured; At this time, the second end of the platform is measured to the transducer, which is connected to a second wafer, subjected to the alignment and measurement; wait for the first after the exposure of one wafer is completed, the first platform and second platform transposition, the first wafer returned, while preparing a third wafer bonding; the second platform and the second exposure processing of wafers and then sequentially repeated. 如此便可以减少晶圆的等待时间,而提高出产效率。 So it can reduce the waiting time of the wafer, and improve production efficiency. 然而,两个平台的叠对控制表现不可避免的存在差异,而对半导体器件的出产良率造成影响。 However, two overlapping platforms inevitable differences in the performance of the control, while the impact on the production yield of the semiconductor device.

发明内容 SUMMARY

[0006] 本发明所要解决的技术问题是减少双平台(twin stage)曝光机台两个工作平台之间的叠对控制差异,同时利用这个差异将叠对误差控制在一个所需的范围内,以提高半导体器件的性能及良率。 [0006] The invention solves this technical problem is to reduce the internet bis (twin stage) overlay exposure machine control difference between the two work platforms, while taking advantage of the difference between the overlay error controlled within a desired, to improve the performance and yield of the semiconductor device.

[0007] 为解决以上技术问题,本发明提供一种叠对误差补偿方法,用于双平台曝光机台中,该方法利用所述曝光机台的两个工作平台的叠对补偿值之差补偿其中叠对误差较大的工作平台。 [0007] In order to solve the above technical problem, the present invention provides an overlay error compensation method for double exposure machine station platform, the method utilizes two work platforms of the exposure machine overlay difference compensating value compensating wherein large working platform stack error.

[0008] 进一步的,所述曝光机台的两个工作平台的叠对补偿值之差是通过以下步骤获得:线上测量晶圆叠对情况,获得原始数据;根据所述原始数据,计算得到叠对误差建模数据;将所述叠对误差建模数据分为分别对应于两个工作平台的两组数据;根据所述两组数据得到所述两个工作平台的叠对补偿值之差。 [0008] Further, the exposure of the two work platform machine stack difference compensation value is obtained by the steps of: measuring the wafer overlay line, the original data is obtained; according to the raw data, is calculated stack data modeling error; the stack is divided into two work platforms respectively corresponding to two sets of data error modeling data; stack obtained compensation value of the difference between the two working platforms, according to the two sets of data .

[0009] 进一步的,所述叠对误差建模数据包括10组数据,其中6组对应于晶圆,另外4组对应于曝光场。 [0009] Further, the overlay error modeling data includes 10 sets of data groups corresponding to the wafer 6, and 4 by corresponding to the exposure field.

[0010] 进一步的,所述对应于晶圆的6组数据包括:晶圆在X和Y方向上的平移量、晶圆在X和Y方向上的扩张量、晶圆旋转量、晶圆非正交情况。 [0010] Further, the wafer 6 corresponding to the set of data includes: the shift amount of the wafer in the X and Y directions, the amount of expansion of the wafer in the X and Y directions, the amount of rotation of the wafer, the wafer non- orthogonal situation.

[0011] 进一步的,所述对应于曝光场的4组数据包括:由晶圆以上模块产生的曝光场旋转量、曝光场扩张量、曝光场不对称旋转量、曝光场不对称扩张量。 4 sets of data [0011] Further, corresponding to the exposure field comprising: a rotating field generated by the exposure amount of the wafer more modules, the amount of expansion of the exposure field of the exposure field asymmetrical rotation amount, the amount of expansion of the exposure field asymmetry.

[0012] 进一步的,所述补偿工作平台是通过该工作平台的卡盘实现的。 [0012] Further, the compensation work platform by the chuck of the working platform implementation.

[0013] 可见,以上叠对误差补偿方法利用两个工作平台的叠对补偿值之差来补偿其中叠对误差较大的工作平台。 [0013] visible, above the overlay error compensation method using a stack of two work platforms of the compensation value to compensate for the difference between the overlay error in which a large work platform. 如此,在减小两个工作平台之间的叠对控制差异的同时,将工作平台的叠对误差控制在一个所需的范围内,提高了半导体器件的性能以及出产良率。 Thus, the reduced overlay difference while controlling the work platform of the overlay error is controlled within a desired range between the two work platform improves the performance of the semiconductor device and the production yield.

附图说明 BRIEF DESCRIPTION

[0014] 图1为本发明一实施例所提供的叠对误差补偿方法的流程示意图; [0014] FIG. 1 stacked flow error compensation method according to the present embodiment provides a schematic diagram of the invention;

[0015] 图2为未采用本发明所提供的方法进行补偿时晶圆在X方向上的平移量(wafer translation X)的箱线图(box plot); When [0015] FIG. 2 is a method of compensation provided by the invention do not utilize shift amount in the X direction of the wafer (wafer translation X) boxplot (box plot);

[0016] 图3为采用本发明所提供的方法进行补偿后晶圆在X方向上的平移量(wafer translation X)的箱线图(box plot)。 [0016] FIG. 3 is a method of the present invention provides a post translational compensation amount in the X direction of the wafer (wafer translation X) boxplot (box plot).

具体实施方式 detailed description

[0017] 为使本发明的技术特征更明显易懂,下面结合附图与实施例,对本发明做进一步的描述。 [0017] For the technical features of the present invention are more apparent from the accompanying drawings and the following embodiments, the present invention is further described.

[0018] 本发明的发明人在对双平台(twin stage)曝光机台的测试过程中发现,两个工作平台的叠对控制表现能力存在差异,为了减小这种差异,发明人利用两个工作平台的叠对补偿值之差来补偿其中一个平台,以使得他们的叠对控制能力相当。 [0018] The inventors of the present invention in the course of the test platform bis (twin stage) exposure tool found that differences in the stack control performance capabilities of the two work platforms, in order to reduce this difference, the inventors using two working platform overlay compensation value to compensate for the difference between one of the platform, so that their ability to control considerable overlap. 进而考虑到叠对误差对于器件性能的重要性,在补偿过程中,希望两个工作平台的叠对误差都尽可能小,以提高生产良率,为此利用两个工作平台的叠对补偿值之差来补偿其中叠对误差较大的工作平台。 Further taking into account the importance of the overlay error of device performance, the compensation process, it is desirable two working platforms overlay error as small as possible, in order to improve production yield, using the overlay for this compensation value the two work platforms wherein the difference between the overlay error to compensate for the larger working platform. 如此,在减小两个工作平台之间的叠对控制差异的同时,将工作平台的叠对误差控制在一个所需的范围内,提高了半导体器件的性能以及出产良率。 Thus, the reduced overlay difference while controlling the work platform of the overlay error is controlled within a desired range between the two work platform improves the performance of the semiconductor device and the production yield.

[0019] 另外,将此补偿方法用于某一层的曝光过程中,不仅可以改善叠对误差的影响,同时不需要设备更新任何参数。 [0019] Further, this method of compensating for a layer in the exposure process, the stack can not only improve the impact error, while not requiring any apparatus to update parameters. 从而不会对其它层或其他产品造成影响。 So as not to affect other layers or other products.

[0020] 具体,请参考图1,其给出了本发明一实施例所提供的叠对误差补偿方法的流程示意图。 [0020] Specifically, referring to FIG 1, which gives a schematic flow chart of a stack error compensation method according to an embodiment of the present invention is provided. 如图所示,包括如下步骤: As shown, comprising the steps of:

[0021] Sl :线上测量晶圆叠对情况,获得原始数据,当然这里所需测量的晶圆是所有在平台上处理的晶圆,包括第一工作平台与第二工作平台上的晶圆; [0021] Sl: online measurement of the wafer stack, the original data is obtained, of course, required here is that all measurements of the wafer on wafer processing platform, comprising a first working platform and a second wafer on the work platform ;

[0022] S2 :根据测量得到的原始数据,计算得到叠对误差建模数据; [0022] S2: The raw data measured, calculated modeling error data stack;

[0023] S3 :将叠对误差建模数据分为分别对应于两个工作平台的两组数据;[0024] S4:根据所述两组数据得到两个工作平台的叠对补偿值,进而得到两个工作平台的叠对补偿值之差; [0023] S3: The stack is divided into two work platforms respectively corresponding to the two sets of data for error modeling data; [0024] S4: to obtain two working platforms overlay compensation value based on the two sets of data, and thus to give fold difference in the compensation value of the two work platforms;

[0025] S5 :利用所述叠对补偿值之差补偿叠对误差较大的工作平台,即补偿叠对补偿值较大的工作平台。 [0025] S5: using the overlay difference compensation value to compensate a large overlay error working platform, i.e. the stack to compensate for the larger working platform compensation value.

[0026] 将以上方法应用到机台的自动控制上,便可以减小两个工作平台之间的叠对控制差异,同时,将工作平台的叠对误差控制在一个所需的范围内。 [0026] The above method is applied to the automatic control of the machine, it is possible to reduce overlap between the two work platforms of the control difference, while the stack of working platforms, the error is controlled within a desired range. 具体而言,通过以上方法获得一个补偿值(即步骤4中所获得的补偿值之差),并在曝光机台上设置一个接口,来接收这个补偿值,通过控制机台的自动化程序,在生成曝光机的任务(job)的时候,把获得的补偿值传递给所需补偿的工作平台。 Specifically, to obtain a compensation value (i.e. compensation value of the difference obtained in step 4) by the above method, and an exposure machine interface is provided a stage to receive the compensation value by controlling the automatic machine program, exposure machine generated task (Job), when the compensation value obtained by passing the required compensation to a working platform.

[0027] 将以上方法编写加入到机台的自动化程序中,在生成曝光机台的job的时候,把补偿值(即步骤4中所获得的补偿值之差)传递给所需补偿的工作平台。 [0027] The preparation of the above method was added to the machine automation program, when generating a job exposure machine, the compensation value (i.e. compensation value of the difference obtained in step 4) to the required compensation work platform .

[0028] 在步骤S2中,所述叠对误差建模数据包括10组数据,其中6组为对应于晶圆(wafer)的数据,包括:晶圆平移量(包括X和Y两个方向上的平移量)(wafer translation X,Y)、晶圆扩张量(包括X和Y两个方向上的扩张量)(waferexpansion)、晶圆旋转量(wafer rotation)、晶圆非正交情况(wafernon-orthogonality);另外四组为对应于曝光场(shot)的数据,包括:由晶圆以上模块产生的曝光场旋转量(intra field shot rotation)、曝光场扩张量(shotmagnification)、曝光场不对称旋转量(shot asymmetric rotation)、曝光场不对禾尔扩张量(shot asymmetric magnification)。 [0028] In step S2, the overlay error modeling data includes 10 sets of data, wherein data corresponding to a group 6 of the wafer (the wafer), comprising: a wafer shift amount (including the X and Y directions the shift amount) (wafer translation X, Y), the amount of expansion of the wafer (including the amount of expansion in the two directions X and Y) (waferexpansion), the amount of rotation of the wafer (wafer rotation), the wafer non-orthogonal case (wafernon -orthogonality); other four data sets corresponding to the exposure field (SHOT), comprising: a rotation amount (intra field shot rotation) of the wafer exposure field generated by the above module, the amount of expansion of the exposure field (shotmagnification), the exposure field asymmetry the amount of rotation (shot asymmetric rotation), Wo Er exposure field does not expand the amount (shot asymmetric magnification).

[0029] 将所得到的这些建模数据与工作平台对应起来,这样便得到对应于两个工作平台的两组建模数据,分别进行建模,得到叠对误差补偿值。 [0029] The data obtained with these modeling work platform association, thus obtained corresponding to the two sets of working platforms modeling data were modeled to obtain the overlay error compensation value. 在传统工艺上,利用所得到的补偿值分别对所有的工作平台统一进行叠对补偿。 In the traditional process, using the compensation values ​​obtained are uniform for all the work platform to compensate for the overlay. 而本发明利用两个工作平台的叠对补偿值之差来补偿叠对误差较大的工作平台,在减小两个工作平台之间的叠对控制差异的同时,不影响其他产品情况下将所需产品所需层的工作平台的叠对误差控制在一个所需的范围内, 提高了半导体器件的性能以及出产良率。 The present invention utilizes the two working platforms overlay compensation value to compensate for the difference between the overlay error greater work platform, while controlling to reduce the overlay differences between the two does not affect the other work platform products case the desired product of the desired working platform layer overlay error is controlled within a desired range, to improve the production and performance of the semiconductor device yield. 另外,由于工作平台往往利用卡盘(Chuck)来固定晶圆,故补偿工作平台是通过该工作平台的卡盘来实现的。 Further, since the work platform is often a chuck (Chuck) is fixed to the wafer, so that the working platform is compensated by the chuck of the work platform to achieve.

[0030] 下面,请参考图2至图3,其分别为未采用以上方法进行补偿以及采用以上方法进行补偿后晶圆在X方向上的平移量(wafer translation X)的箱线图(boxplot)。 [0030] Next, please refer to FIG. 2 to FIG. 3, which are not compensated using the above method and using the above method after compensating the shift amount of the wafer (wafer translation X) in the X direction boxplot (Boxplot) . 其中, 横坐标EPAFS02代表设备编号,后缀“_1”与“_2”代表卡盘编号,即EPAFS02_1代表第一工作平台的卡盘,EPAFS02_2代表第二工作平台的卡盘;纵坐标代表晶圆在X方向上的平移量。 Wherein the abscissa represents the device number EPAFS02 suffix "_1" and "_2" number representative of the chuck, i.e. EPAFS02_1 work platform representing the first chuck, the second working platform on behalf EPAFS02_2 chuck; wafer ordinate represents X direction shift amount. 从图2可以看出,未进行补偿时,第二工作平台的卡盘(EPAFS02_2)X方向上的平移量(wafer translation X) _0. 8122nm 高于第一工作平台的卡盘(EPAFS02_1)-1. 807nm, 且第一工作平台的卡盘(EPAFS02_1)X方向上的平移量-1.807nm不符合所需要求(不低于-1.5nm)。 As can be seen from Figure 2, compensation is not performed, the shift amount (wafer translation X) _0. In the X direction of the second working platform chuck (EPAFS02_2) 8122nm higher than the first work platform chuck (EPAFS02_1) -1 shift amount in the X direction. 807nm, and the first work platform chuck (EPAFS02_1) -1.807nm does not meet the necessary requirements (no less than -1.5nm). 而补偿后,第二工作平台的卡盘(EPAFS02_2)X方向上的平移量-1.255nm与第一工作平台的卡盘(EPAFS02_l)-0. 6259nm符合所需要求(在-1. 5nm以上),可见,本发明所提供的叠对误差补偿方法在减小两个工作平台之间的叠对控制差异的同时,将工作平台的叠对误差控制在一个所需的范围内,提高了半导体器件的性能以及出产良率以上仅为举例,并非用以限定本发明,本发明的保护范围应当以权利要求书所涵盖的范围为准。 After the compensation, the shift amount on the second working platform chuck (EPAFS02_2) X direction -1.255nm -0. 6259nm work platform in line with the first chuck (EPAFS02_l) necessary requirements (at -1. 5nm above) seen, the overlay error compensation method for reducing the difference while controlling the overlay, the overlay error of the work platform controlled within a desired between two work platforms, improved semiconductor device of the present invention provides performance and production yield more than merely an example, not intended to limit the present invention, the scope of the present invention should be encompassed by the scope of the claims and their equivalents.

Claims (5)

1. 一种叠对误差补偿方法,用于双平台曝光机台中,其特征是,包括:利用所述曝光机台的两个工作平台的叠对补偿值之差补偿其中叠对误差较大的工作平台,其中,所述曝光机台的两个工作平台的叠对补偿值之差是通过以下步骤获得:线上测量晶圆叠对情况,获得原始数据;根据所述原始数据,计算得到叠对误差建模数据;将所述叠对误差建模数据分为分别对应于两个工作平台的两组数据;根据所述两组数据得到所述两个工作平台的叠对补偿值之差。 An overlay error compensation method for double exposure machine station platform, characterized in that, comprising: two exposure using the work platform machine stack difference of the compensation value to compensate a large overlay error wherein working platform, wherein the exposure of the two work platform machine stack difference compensation value is obtained by the steps of: measuring the wafer overlay line, the original data is obtained; according to the raw data, the calculated bundle error modeling data; the stack is divided into two work platforms respectively corresponding to two sets of data error modeling data; stack obtained compensation value of the difference between the two working platforms, according to the two sets of data.
2.根据权利要求1所述的叠对误差补偿方法,其特征是,所述叠对误差建模数据包括10组数据,其中6组对应于晶圆,另外4组对应于曝光场。 The stack of claim 1, said error compensation method, wherein the modeling data stack 10 comprises a set of data error, wherein the group corresponding to the wafer 6, and 4 by corresponding to the exposure field.
3.根据权利要求2所述的叠对误差补偿方法,其特征是,所述对应于晶圆的6组数据包括:晶圆在X和Y方向上的平移量、晶圆在X和Y方向上的扩张量、晶圆旋转量、晶圆非正交情况。 3. overlay error compensation method according to claim 2, characterized in that the wafer 6 corresponding to the set of data includes: the shift amount of the wafer in the X and Y directions, the wafer in the X and Y directions the amount of expansion, the amount of rotation of the wafer, the wafer non-orthogonal case.
4.根据权利要求2所述的叠对误差补偿方法,其特征是,所述对应于曝光场的4组数据包括:由晶圆以上模块产生的曝光场旋转量、曝光场扩张量、曝光场不对称旋转量、曝光场不对称扩张量。 4. stack error compensation method according to claim 2, characterized in that, corresponding to the four sets of data to the exposure field comprising: a rotating field generated by the exposure amount of the wafer more modules, the amount of expansion of the exposure field of the exposure field asymmetric rotation amount, the amount of expansion of the exposure field asymmetry.
5.根据权利要求1所述的叠对误差补偿方法,其特征是,所述补偿工作平台是通过该工作平台的卡盘实现的。 The stack according to claim 1, the error compensation method, wherein the compensation is achieved by a working platform of the working platform of the chuck.
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