CN100460478C - 磁盘用研磨液组合物 - Google Patents

磁盘用研磨液组合物 Download PDF

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Publication number
CN100460478C
CN100460478C CNB2004100562306A CN200410056230A CN100460478C CN 100460478 C CN100460478 C CN 100460478C CN B2004100562306 A CNB2004100562306 A CN B2004100562306A CN 200410056230 A CN200410056230 A CN 200410056230A CN 100460478 C CN100460478 C CN 100460478C
Authority
CN
China
Prior art keywords
acid
substrate
liquid composition
grinding
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100562306A
Other languages
English (en)
Chinese (zh)
Other versions
CN1580173A (zh
Inventor
北山博昭
藤井滋夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of CN1580173A publication Critical patent/CN1580173A/zh
Application granted granted Critical
Publication of CN100460478C publication Critical patent/CN100460478C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CNB2004100562306A 2003-08-08 2004-08-05 磁盘用研磨液组合物 Expired - Fee Related CN100460478C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP290690/2003 2003-08-08
JP2003290690A JP4206313B2 (ja) 2003-08-08 2003-08-08 磁気ディスク用研磨液組成物

Publications (2)

Publication Number Publication Date
CN1580173A CN1580173A (zh) 2005-02-16
CN100460478C true CN100460478C (zh) 2009-02-11

Family

ID=32906131

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100562306A Expired - Fee Related CN100460478C (zh) 2003-08-08 2004-08-05 磁盘用研磨液组合物

Country Status (6)

Country Link
US (2) US20050032463A1 (ja)
JP (1) JP4206313B2 (ja)
CN (1) CN100460478C (ja)
GB (1) GB2404921B (ja)
MY (1) MY139590A (ja)
TW (1) TWI343943B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2433515B (en) * 2005-12-22 2011-05-04 Kao Corp Polishing composition for hard disk substrate
US8247326B2 (en) * 2008-07-10 2012-08-21 Cabot Microelectronics Corporation Method of polishing nickel-phosphorous
US9039914B2 (en) 2012-05-23 2015-05-26 Cabot Microelectronics Corporation Polishing composition for nickel-phosphorous-coated memory disks
JP6366308B2 (ja) * 2014-03-12 2018-08-01 株式会社ディスコ 加工方法
US10144850B2 (en) * 2015-09-25 2018-12-04 Versum Materials Us, Llc Stop-on silicon containing layer additive

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6015506A (en) * 1996-11-26 2000-01-18 Cabot Corporation Composition and method for polishing rigid disks
US6316366B1 (en) * 1996-09-24 2001-11-13 Cabot Microelectronics Corporation Method of polishing using multi-oxidizer slurry
US20010049913A1 (en) * 2000-04-17 2001-12-13 Norihiko Miyata Composition for polishing magnetic disk substrate
WO2001098201A2 (en) * 2000-06-16 2001-12-27 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
US20020098701A1 (en) * 2000-11-30 2002-07-25 Jsr Corporation Polishing method
US20020102923A1 (en) * 2000-11-29 2002-08-01 Fujimi Incorporated Polishing composition and polishing method for polishing a substrate to be used for a memory hard disk employing it
US20020194789A1 (en) * 2001-04-27 2002-12-26 Kao Corporation Polishing composition
US6569216B1 (en) * 1998-11-27 2003-05-27 Kao Corporation Abrasive fluid compositions
US20030110710A1 (en) * 2001-08-21 2003-06-19 Yoshiaki Oshima Polishing composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6149696A (en) * 1997-11-06 2000-11-21 Komag, Inc. Colloidal silica slurry for NiP plated disk polishing
JP2000212776A (ja) * 1999-01-18 2000-08-02 Jsr Corp 化学機械研磨用水系分散体
KR20010087485A (ko) * 2000-03-07 2001-09-21 김순택 플라즈마 표시패널의 구동방법
CN100378145C (zh) * 2001-06-21 2008-04-02 花王株式会社 研磨液组合物
JP2003151928A (ja) * 2001-11-12 2003-05-23 Sumitomo Bakelite Co Ltd 研磨用組成物
KR100449614B1 (ko) * 2001-12-28 2004-09-22 제일모직주식회사 침식현상이 개선된 금속배선 연마용 슬러리 조성물
JP2003218071A (ja) * 2002-01-28 2003-07-31 Sumitomo Bakelite Co Ltd 研磨用組成物
US7147682B2 (en) * 2002-12-26 2006-12-12 Kao Corporation Polishing composition

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316366B1 (en) * 1996-09-24 2001-11-13 Cabot Microelectronics Corporation Method of polishing using multi-oxidizer slurry
US6015506A (en) * 1996-11-26 2000-01-18 Cabot Corporation Composition and method for polishing rigid disks
US6569216B1 (en) * 1998-11-27 2003-05-27 Kao Corporation Abrasive fluid compositions
US20010049913A1 (en) * 2000-04-17 2001-12-13 Norihiko Miyata Composition for polishing magnetic disk substrate
WO2001098201A2 (en) * 2000-06-16 2001-12-27 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with a phosphate ion-containing polishing system
US20020102923A1 (en) * 2000-11-29 2002-08-01 Fujimi Incorporated Polishing composition and polishing method for polishing a substrate to be used for a memory hard disk employing it
US20020098701A1 (en) * 2000-11-30 2002-07-25 Jsr Corporation Polishing method
US20020194789A1 (en) * 2001-04-27 2002-12-26 Kao Corporation Polishing composition
US20030110710A1 (en) * 2001-08-21 2003-06-19 Yoshiaki Oshima Polishing composition

Also Published As

Publication number Publication date
TW200517479A (en) 2005-06-01
US20050136807A1 (en) 2005-06-23
JP4206313B2 (ja) 2009-01-07
GB2404921A (en) 2005-02-16
GB2404921B (en) 2007-09-12
MY139590A (en) 2009-10-30
GB0415976D0 (en) 2004-08-18
US20050032463A1 (en) 2005-02-10
TWI343943B (en) 2011-06-21
CN1580173A (zh) 2005-02-16
JP2005063531A (ja) 2005-03-10

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CF01 Termination of patent right due to non-payment of annual fee
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Granted publication date: 20090211

Termination date: 20180805