CN100443248C - 用于二极管加工焊接的碳精石墨焊接板 - Google Patents
用于二极管加工焊接的碳精石墨焊接板 Download PDFInfo
- Publication number
- CN100443248C CN100443248C CNB2005100239070A CN200510023907A CN100443248C CN 100443248 C CN100443248 C CN 100443248C CN B2005100239070 A CNB2005100239070 A CN B2005100239070A CN 200510023907 A CN200510023907 A CN 200510023907A CN 100443248 C CN100443248 C CN 100443248C
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- CN
- China
- Prior art keywords
- welding
- board
- carbon graphite
- welded plate
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 238000003466 welding Methods 0.000 title claims abstract description 30
- 229910052799 carbon Inorganic materials 0.000 title claims abstract description 20
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 20
- 239000010439 graphite Substances 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title abstract description 10
- 238000003754 machining Methods 0.000 title abstract 2
- 210000004508 polar body Anatomy 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010009 beating Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Led Device Packages (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100239070A CN100443248C (zh) | 2005-02-07 | 2005-02-07 | 用于二极管加工焊接的碳精石墨焊接板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100239070A CN100443248C (zh) | 2005-02-07 | 2005-02-07 | 用于二极管加工焊接的碳精石墨焊接板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1817537A CN1817537A (zh) | 2006-08-16 |
CN100443248C true CN100443248C (zh) | 2008-12-17 |
Family
ID=36917844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100239070A Expired - Fee Related CN100443248C (zh) | 2005-02-07 | 2005-02-07 | 用于二极管加工焊接的碳精石墨焊接板 |
Country Status (1)
Country | Link |
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CN (1) | CN100443248C (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101913046B (zh) * | 2010-05-21 | 2013-05-01 | 苏州固锝电子股份有限公司 | 一种用于二极管焊接的焊接装置 |
CN102259247A (zh) * | 2011-06-14 | 2011-11-30 | 许行彪 | 电子元件一孔焊接模及焊接工艺 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01253263A (ja) * | 1988-04-01 | 1989-10-09 | Stanley Electric Co Ltd | ヒューズダイオードの製造方法 |
CN1092207A (zh) * | 1993-01-11 | 1994-09-14 | 黄素玲 | 表面粘着式二极体的制造方法 |
CN1122517A (zh) * | 1994-10-31 | 1996-05-15 | 戴超智 | 以片状材料层叠结构的半导体二极管制造方法 |
-
2005
- 2005-02-07 CN CNB2005100239070A patent/CN100443248C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01253263A (ja) * | 1988-04-01 | 1989-10-09 | Stanley Electric Co Ltd | ヒューズダイオードの製造方法 |
CN1092207A (zh) * | 1993-01-11 | 1994-09-14 | 黄素玲 | 表面粘着式二极体的制造方法 |
CN1122517A (zh) * | 1994-10-31 | 1996-05-15 | 戴超智 | 以片状材料层叠结构的半导体二极管制造方法 |
Non-Patent Citations (4)
Title |
---|
玻璃钝化二极管的一体化焊接工艺. 孙维德.半导体技术,第3期. 1990 |
玻璃钝化二极管的一体化焊接工艺. 孙维德.半导体技术,第3期. 1990 * |
玻璃钝化硅快恢复整流二极管. 罗文江.半导体技术,第1期. 1995 |
玻璃钝化硅快恢复整流二极管. 罗文江.半导体技术,第1期. 1995 * |
Also Published As
Publication number | Publication date |
---|---|
CN1817537A (zh) | 2006-08-16 |
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C06 | Publication | ||
PB01 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SHANGHAI JINKE SEMICONDUCTOR + EQUIPMENT CO., LTD. Free format text: FORMER OWNER: LIN MAOCHANG Effective date: 20110701 |
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Free format text: CORRECT: ADDRESS; FROM: 201102 NO. 280, TANGGUANG GARDEN, CHANGXI ROAD, SONGJIANG DISTRICT, SHANGHAI TO: 201108 NO. 135 (AREA B, BUILDING 1), LANE 1421, ZHUANXING ROAD, MINHANG DISTRICT, SHANGHAI |
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TR01 | Transfer of patent right |
Effective date of registration: 20110701 Address after: 201108 Shanghai city Minhang District Zhuan Hing Road 1421 Lane 135 (1 B) Patentee after: Shanghai Jinke Semiconductor & Equipment Co.,Ltd. Address before: 201102 No. 280 garden light, Garden Road, Songjiang District, Shanghai Patentee before: Lin Maochang |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20170207 |
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CF01 | Termination of patent right due to non-payment of annual fee |