CN100440497C - 集成半导体结构 - Google Patents

集成半导体结构 Download PDF

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Publication number
CN100440497C
CN100440497C CNB038157144A CN03815714A CN100440497C CN 100440497 C CN100440497 C CN 100440497C CN B038157144 A CNB038157144 A CN B038157144A CN 03815714 A CN03815714 A CN 03815714A CN 100440497 C CN100440497 C CN 100440497C
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CN
China
Prior art keywords
metal
semiconductor structure
interconnection
pad metal
top layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038157144A
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English (en)
Chinese (zh)
Other versions
CN1666336A (zh
Inventor
R·鲍尔
W·厄特勒
T·弗罗赫米勒
B·戈尔勒
R·格雷德尔
O·纳格勒
O·施梅克比尔
W·斯塔德勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of CN1666336A publication Critical patent/CN1666336A/zh
Application granted granted Critical
Publication of CN100440497C publication Critical patent/CN100440497C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H10W72/9232—Bond pads having multiple stacked layers with additional elements interposed between layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/934—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/981—Auxiliary members, e.g. spacers
    • H10W72/983—Reinforcing structures, e.g. collars

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
CNB038157144A 2002-07-01 2003-06-12 集成半导体结构 Expired - Fee Related CN100440497C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10229493A DE10229493B4 (de) 2002-07-01 2002-07-01 Integrierte Halbleiterstruktur
DE10229493.3 2002-07-01

Publications (2)

Publication Number Publication Date
CN1666336A CN1666336A (zh) 2005-09-07
CN100440497C true CN100440497C (zh) 2008-12-03

Family

ID=29796063

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038157144A Expired - Fee Related CN100440497C (zh) 2002-07-01 2003-06-12 集成半导体结构

Country Status (7)

Country Link
US (1) US7190077B2 (https=)
EP (1) EP1518272B1 (https=)
JP (1) JP4065876B2 (https=)
CN (1) CN100440497C (https=)
DE (2) DE10229493B4 (https=)
TW (1) TWI237890B (https=)
WO (1) WO2004004002A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006108329A (ja) * 2004-10-04 2006-04-20 Fujitsu Ltd 半導体装置
CN100413066C (zh) * 2005-11-30 2008-08-20 中芯国际集成电路制造(上海)有限公司 低k介电材料的接合焊盘和用于制造半导体器件的方法
JP5353313B2 (ja) * 2009-03-06 2013-11-27 富士通セミコンダクター株式会社 半導体装置
KR101823677B1 (ko) 2011-04-21 2018-01-30 엘지이노텍 주식회사 엘이디 조명장치
US20130154099A1 (en) * 2011-12-16 2013-06-20 Semiconductor Components Industries, Llc Pad over interconnect pad structure design
CN102571135B (zh) * 2012-02-15 2014-05-14 京信通信系统（中国）有限公司 射频半集成应用装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751065A (en) * 1993-08-05 1998-05-12 Lucent Technologies Inc. Integrated circuit with active devices under bond pads
EP1143513A1 (en) * 2000-04-03 2001-10-10 Nec Corporation Semiconductor device and method of fabricating the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2598328B2 (ja) * 1989-10-17 1997-04-09 三菱電機株式会社 半導体装置およびその製造方法
KR100267105B1 (ko) * 1997-12-09 2000-11-01 윤종용 다층패드를구비한반도체소자및그제조방법
US5986343A (en) * 1998-05-04 1999-11-16 Lucent Technologies Inc. Bond pad design for integrated circuits
US6232662B1 (en) * 1998-07-14 2001-05-15 Texas Instruments Incorporated System and method for bonding over active integrated circuits
US6087732A (en) * 1998-09-28 2000-07-11 Lucent Technologies, Inc. Bond pad for a flip-chip package
JP2000183104A (ja) * 1998-12-15 2000-06-30 Texas Instr Inc <Ti> 集積回路上でボンディングするためのシステム及び方法
TW430935B (en) * 1999-03-19 2001-04-21 Ind Tech Res Inst Frame type bonding pad structure having a low parasitic capacitance
US7201784B2 (en) * 2003-06-30 2007-04-10 Intel Corporation Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5751065A (en) * 1993-08-05 1998-05-12 Lucent Technologies Inc. Integrated circuit with active devices under bond pads
EP1143513A1 (en) * 2000-04-03 2001-10-10 Nec Corporation Semiconductor device and method of fabricating the same

Also Published As

Publication number Publication date
DE50311482D1 (https=) 2009-06-10
TWI237890B (en) 2005-08-11
DE10229493A1 (de) 2004-01-29
TW200402863A (en) 2004-02-16
US7190077B2 (en) 2007-03-13
JP2006502561A (ja) 2006-01-19
EP1518272A1 (de) 2005-03-30
US20050242374A1 (en) 2005-11-03
WO2004004002A1 (de) 2004-01-08
EP1518272B1 (de) 2009-04-29
CN1666336A (zh) 2005-09-07
DE10229493B4 (de) 2007-03-29
JP4065876B2 (ja) 2008-03-26

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20081203

Termination date: 20180612