CN100440436C - 气相生长方法 - Google Patents
气相生长方法 Download PDFInfo
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- CN100440436C CN100440436C CNB2005800051337A CN200580005133A CN100440436C CN 100440436 C CN100440436 C CN 100440436C CN B2005800051337 A CNB2005800051337 A CN B2005800051337A CN 200580005133 A CN200580005133 A CN 200580005133A CN 100440436 C CN100440436 C CN 100440436C
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- substrate
- temperature
- resistivity
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02658—Pretreatments
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02387—Group 13/15 materials
- H01L21/02392—Phosphides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02543—Phosphides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/02546—Arsenides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004039177 | 2004-02-17 | ||
JP039177/2004 | 2004-02-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1922716A CN1922716A (zh) | 2007-02-28 |
CN100440436C true CN100440436C (zh) | 2008-12-03 |
Family
ID=34857838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800051337A Active CN100440436C (zh) | 2004-02-17 | 2005-02-15 | 气相生长方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US7883998B2 (zh) |
EP (1) | EP1717846B1 (zh) |
JP (1) | JP4838587B2 (zh) |
KR (1) | KR101071623B1 (zh) |
CN (1) | CN100440436C (zh) |
CA (1) | CA2556824C (zh) |
TW (1) | TW200528589A (zh) |
WO (1) | WO2005078780A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5515162B2 (ja) * | 2007-03-23 | 2014-06-11 | 住友電気工業株式会社 | 半導体ウエハの製造方法 |
JP5012554B2 (ja) * | 2008-02-19 | 2012-08-29 | 株式会社Sumco | エピタキシャルウェーハの製造方法 |
US9076827B2 (en) | 2010-09-14 | 2015-07-07 | Applied Materials, Inc. | Transfer chamber metrology for improved device yield |
US20120118225A1 (en) * | 2010-09-16 | 2012-05-17 | Applied Materials, Inc. | Epitaxial growth temperature control in led manufacture |
KR101684433B1 (ko) | 2015-12-22 | 2016-12-08 | 주식회사 송이산업 | 산호와 송이를 이용한 타블렛 화장품 조성물의 제조방법 |
CN115424921B (zh) * | 2022-11-07 | 2023-03-24 | 苏州长光华芯光电技术股份有限公司 | 一种生长半绝缘掺铁InP外延层的方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574820A (ja) * | 1991-09-12 | 1993-03-26 | Sharp Corp | トランジスタ及び結晶成長方法 |
JPH0557849U (ja) * | 1991-12-27 | 1993-07-30 | 株式会社島津製作所 | 基板ホルダ |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4357180A (en) * | 1981-01-26 | 1982-11-02 | The United States Of America As Represented By The Secretary Of The Navy | Annealing of ion-implanted GaAs and InP semiconductors |
US4999315A (en) * | 1984-06-15 | 1991-03-12 | At&T Bell Laboratories | Method of controlling dopant incorporation in high resistivity In-based compound Group III-V epitaxial layers |
US4673446A (en) * | 1985-12-12 | 1987-06-16 | The United States Of America As Represented By The Secretary Of The Navy | Method of forming thermally stable high resistivity regions in n-type indium phosphide by oxygen implantation |
US5219632A (en) * | 1988-02-24 | 1993-06-15 | Haruhito Shimakura | Compound semiconductor single crystals and the method for making the crystals, and semiconductor devices employing the crystals |
US4929564A (en) * | 1988-10-21 | 1990-05-29 | Nippon Mining Co., Ltd. | Method for producing compound semiconductor single crystals and method for producing compound semiconductor devices |
US5164359A (en) * | 1990-04-20 | 1992-11-17 | Eaton Corporation | Monolithic integrated circuit having compound semiconductor layer epitaxially grown on ceramic substrate |
US5603765A (en) * | 1993-12-01 | 1997-02-18 | Hughes Aircraft Company | Method of growing high breakdown voltage allnas layers in InP devices by low temperature molecular beam epitaxy |
JP2809216B2 (ja) * | 1996-11-11 | 1998-10-08 | 日本電気株式会社 | 非線形光導波路 |
JPH11238688A (ja) * | 1998-02-23 | 1999-08-31 | Shin Etsu Handotai Co Ltd | 薄膜の製造方法 |
US6022749A (en) * | 1998-02-25 | 2000-02-08 | Advanced Micro Devices, Inc. | Using a superlattice to determine the temperature of a semiconductor fabrication process |
JP4022997B2 (ja) * | 1998-07-29 | 2007-12-19 | 住友電気工業株式会社 | 3−5族化合物半導体結晶へのZn拡散方法及び拡散装置 |
US6239354B1 (en) * | 1998-10-09 | 2001-05-29 | Midwest Research Institute | Electrical isolation of component cells in monolithically interconnected modules |
EP1043764A4 (en) * | 1998-10-29 | 2004-05-26 | Shinetsu Handotai Kk | SEMICONDUCTOR DISC AND PRODUCTION METHOD |
JP2000138168A (ja) * | 1998-10-29 | 2000-05-16 | Shin Etsu Handotai Co Ltd | 半導体ウェーハ及び気相成長装置 |
JP2002154896A (ja) | 2000-11-13 | 2002-05-28 | Shin Etsu Handotai Co Ltd | Gaドープシリコン単結晶の製造方法 |
US6773504B2 (en) * | 2001-04-12 | 2004-08-10 | Sumitomo Electric Industries, Ltd. | Oxygen doping method to gallium nitride single crystal substrate and oxygen-doped N-type gallium nitride freestanding single crystal substrate |
JP4072937B2 (ja) | 2001-05-11 | 2008-04-09 | 日本電信電話株式会社 | 半導体光素子 |
US6517235B2 (en) * | 2001-05-31 | 2003-02-11 | Chartered Semiconductor Manufacturing Ltd. | Using refractory metal silicidation phase transition temperature points to control and/or calibrate RTP low temperature operation |
KR100456037B1 (ko) * | 2001-10-24 | 2004-11-15 | 한국과학기술원 | 컬렉터의 역방향 선택적 식각을 이용한 이종접합 바이폴라 트랜지스터 제조방법 |
JP2003218033A (ja) | 2002-01-21 | 2003-07-31 | Nikko Materials Co Ltd | エピタキシャル成長方法 |
JP4172184B2 (ja) * | 2002-02-26 | 2008-10-29 | 住友電気工業株式会社 | 半導体基板への亜鉛拡散方法、半導体基板の加熱方法。 |
KR100486877B1 (ko) * | 2002-10-15 | 2005-05-03 | 주식회사 실트론 | 저융점 도판트 주입관이 설치된 실리콘 단결정 성장 장치및 저융점 도판트 주입 방법 |
JP4499444B2 (ja) * | 2004-02-17 | 2010-07-07 | 日鉱金属株式会社 | 気相成長方法 |
-
2005
- 2005-02-02 TW TW094103233A patent/TW200528589A/zh unknown
- 2005-02-15 EP EP05719124.9A patent/EP1717846B1/en active Active
- 2005-02-15 CA CA2556824A patent/CA2556824C/en active Active
- 2005-02-15 CN CNB2005800051337A patent/CN100440436C/zh active Active
- 2005-02-15 KR KR1020067016450A patent/KR101071623B1/ko active IP Right Grant
- 2005-02-15 US US10/589,733 patent/US7883998B2/en active Active
- 2005-02-15 WO PCT/JP2005/002222 patent/WO2005078780A1/ja active Application Filing
- 2005-02-15 JP JP2005518011A patent/JP4838587B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0574820A (ja) * | 1991-09-12 | 1993-03-26 | Sharp Corp | トランジスタ及び結晶成長方法 |
JPH0557849U (ja) * | 1991-12-27 | 1993-07-30 | 株式会社島津製作所 | 基板ホルダ |
Also Published As
Publication number | Publication date |
---|---|
CA2556824C (en) | 2013-12-10 |
WO2005078780A1 (ja) | 2005-08-25 |
EP1717846B1 (en) | 2014-11-19 |
KR20060123560A (ko) | 2006-12-01 |
US20070190757A1 (en) | 2007-08-16 |
TWI333516B (zh) | 2010-11-21 |
KR101071623B1 (ko) | 2011-10-10 |
EP1717846A1 (en) | 2006-11-02 |
CN1922716A (zh) | 2007-02-28 |
JPWO2005078780A1 (ja) | 2007-10-18 |
JP4838587B2 (ja) | 2011-12-14 |
EP1717846A4 (en) | 2009-05-27 |
TW200528589A (en) | 2005-09-01 |
CA2556824A1 (en) | 2005-08-25 |
US7883998B2 (en) | 2011-02-08 |
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Legal Events
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: JX NIPPON MINING + METALS CORPORATION Free format text: FORMER NAME: NIPPON MINING + METALS CO., LTD. |
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CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX Nippon Mining & Metals Corporation Address before: Tokyo, Japan, Japan Patentee before: Nippon Mining & Metals Co., Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Tokyo, Japan, Japan Patentee after: JX NIPPON MINING & METALS CORPORATION Address before: Tokyo, Japan, Japan Patentee before: JX Nippon Mining & Metals Corporation |