CN100440426C - 重量轻的键合头组件 - Google Patents

重量轻的键合头组件 Download PDF

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Publication number
CN100440426C
CN100440426C CNB2006101408244A CN200610140824A CN100440426C CN 100440426 C CN100440426 C CN 100440426C CN B2006101408244 A CNB2006101408244 A CN B2006101408244A CN 200610140824 A CN200610140824 A CN 200610140824A CN 100440426 C CN100440426 C CN 100440426C
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CN
China
Prior art keywords
plane
bonding
flexible
motor
bondhead assembly
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CNB2006101408244A
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English (en)
Chinese (zh)
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CN1956144A (zh
Inventor
高内加·阿吉特
湋多森·盖瑞·彼得
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ASMPT Singapore Pte Ltd
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ASM Technology Singapore Pte Ltd
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Publication of CN1956144A publication Critical patent/CN1956144A/zh
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Publication of CN100440426C publication Critical patent/CN100440426C/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

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  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
CNB2006101408244A 2005-10-14 2006-10-11 重量轻的键合头组件 Active CN100440426C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/250,270 US7303111B2 (en) 2005-10-14 2005-10-14 Lightweight bondhead assembly
US11/250,270 2005-10-14

Publications (2)

Publication Number Publication Date
CN1956144A CN1956144A (zh) 2007-05-02
CN100440426C true CN100440426C (zh) 2008-12-03

Family

ID=37433618

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006101408244A Active CN100440426C (zh) 2005-10-14 2006-10-11 重量轻的键合头组件

Country Status (6)

Country Link
US (1) US7303111B2 (https=)
EP (1) EP1775753A3 (https=)
JP (1) JP4689571B2 (https=)
CN (1) CN100440426C (https=)
MY (1) MY138793A (https=)
SG (1) SG131882A1 (https=)

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EP1424884A1 (de) * 2002-11-29 2004-06-02 Leica Geosystems AG Verfahren zur Montage miniaturisierter Bauteile auf einer Trägerplatte
US8293043B2 (en) * 2006-07-24 2012-10-23 Asm Assembly Automation Ltd Automatic level adjustment for die bonder
US8215648B2 (en) * 2008-04-21 2012-07-10 Asm Assembly Automation Ltd Collet mounting assembly for a die bonder
CN101635267B (zh) * 2008-07-21 2015-03-25 旺矽科技股份有限公司 取放晶粒的装置及方法
US8651159B2 (en) * 2009-06-12 2014-02-18 Asm Assembly Automation Ltd Die bonder providing a large bonding force
KR200460026Y1 (ko) 2010-02-03 2012-04-27 리드텍(주) 비접촉 구동 모터를 이용한 다이본딩 장치
CN102343477B (zh) * 2010-08-02 2014-02-19 北京中电科电子装备有限公司 一种键合头装置
CN102343476B (zh) * 2010-08-02 2015-06-03 北京中电科电子装备有限公司 键合头装置
CN102157409A (zh) * 2011-03-17 2011-08-17 南通富士通微电子股份有限公司 键合机
JP5813432B2 (ja) * 2011-09-19 2015-11-17 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
US20130127193A1 (en) * 2011-11-18 2013-05-23 Nike, Inc. Manufacturing Vacuum Tool
US8858744B2 (en) 2011-11-18 2014-10-14 Nike, Inc. Multi-functional manufacturing tool
US9010827B2 (en) 2011-11-18 2015-04-21 Nike, Inc. Switchable plate manufacturing vacuum tool
US8849620B2 (en) 2011-11-18 2014-09-30 Nike, Inc. Automated 3-D modeling of shoe parts
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
CN105762099B (zh) * 2014-12-17 2019-07-09 北京中电科电子装备有限公司 一种芯片供送机构及粘片机
CN105789101B (zh) * 2014-12-25 2020-05-05 北京中电科电子装备有限公司 一种芯片供送机构及粘片机
CN106964889A (zh) * 2017-04-28 2017-07-21 菲斯达排放控制装置（苏州）有限公司 便于深腔结构焊接的点焊装置
CN111573266B (zh) * 2019-02-18 2022-01-11 宁波舜宇光电信息有限公司 载具拼板上下料设备及自动扣料机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1344016A (zh) * 2000-09-12 2002-04-10 Esec贸易公司 半导体芯片的安装方法和安装设备
US6474529B2 (en) * 2000-11-29 2002-11-05 Nec Corporation Wire bonding apparatus
CN1505122A (zh) * 2002-11-29 2004-06-16 ESECó�׹�˾ 一种从箔片上拾取半导体芯片的方法
CN1670906A (zh) * 2004-03-15 2005-09-21 先进科技新加坡有限公司 使用线性马达的晶粒分离系统

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US3209447A (en) * 1962-03-12 1965-10-05 Aeroprojects Inc Transducer coupling system
JP3749330B2 (ja) * 1997-02-28 2006-02-22 芝浦メカトロニクス株式会社 ペレットボンディング装置
DE19724732A1 (de) * 1997-06-12 1998-12-17 Heidenhain Gmbh Dr Johannes Längenmeßsystem mit modular aufgebautem Maßstab
WO2004073914A1 (en) * 1999-11-10 2004-09-02 Asm Technology Singapore Pte Ltd. Force sensing apparatus
US6640423B1 (en) * 2000-07-18 2003-11-04 Endwave Corporation Apparatus and method for the placement and bonding of a die on a substrate
US6813225B2 (en) * 2001-08-20 2004-11-02 Asm Assembly Automation Limited Linear motor driven mechanism using flexure bearings for opto-mechanical devices
KR20050092765A (ko) * 2003-01-16 2005-09-22 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 칩 반송 방법 및 장치
US7202956B2 (en) * 2004-10-08 2007-04-10 Asm Technology Singapore Pte Ltd. Translation mechanism for opto-mechanical inspection

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1344016A (zh) * 2000-09-12 2002-04-10 Esec贸易公司 半导体芯片的安装方法和安装设备
US6474529B2 (en) * 2000-11-29 2002-11-05 Nec Corporation Wire bonding apparatus
CN1505122A (zh) * 2002-11-29 2004-06-16 ESECó�׹�˾ 一种从箔片上拾取半导体芯片的方法
CN1670906A (zh) * 2004-03-15 2005-09-21 先进科技新加坡有限公司 使用线性马达的晶粒分离系统

Also Published As

Publication number Publication date
EP1775753A2 (en) 2007-04-18
EP1775753A3 (en) 2009-01-07
JP4689571B2 (ja) 2011-05-25
SG131882A1 (en) 2007-05-28
CN1956144A (zh) 2007-05-02
US20070084901A1 (en) 2007-04-19
MY138793A (en) 2009-07-31
JP2007110136A (ja) 2007-04-26
US7303111B2 (en) 2007-12-04

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