CN100424859C - 电子装置及其制造方法 - Google Patents

电子装置及其制造方法 Download PDF

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Publication number
CN100424859C
CN100424859C CNB2004100287455A CN200410028745A CN100424859C CN 100424859 C CN100424859 C CN 100424859C CN B2004100287455 A CNB2004100287455 A CN B2004100287455A CN 200410028745 A CN200410028745 A CN 200410028745A CN 100424859 C CN100424859 C CN 100424859C
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electronic installation
chip part
insulation division
substrate
electrode
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CN1531069A (zh
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桥元伸晃
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Seiko Epson Corp
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Seiko Epson Corp
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Abstract

一种电子装置，包括形成有布线图案(22)的基板(20)、具有形成了电极(14)的第一面(12)以及其相反侧的第二面(18)并按照与其第二面(18)相向那样搭载在基板(20)上的芯片部件(10)、设置在芯片部件(10)的邻近而由树脂构成绝缘部(30)、从电极(14)上通过绝缘部(30)上到达布线图案(22)上所形成的布线(34)。这样，可以降低对基板的耐热性要求，减少半导体芯片产生的应力疲劳，可以使用通用基板。

Description

电子装置及其制造方法
技术领域
本发明涉及一种电子装置及其制造方法。
背景技术
以往，在COB(Chip On Board；板上芯片)安装中，由于进行加热，要求基板具有耐热性，因而不能使用热可塑性基板，廉价基板也很难使用。另外，由于对半导体芯片加热和施加机械外力，因而难以消除由于产生应力疲劳而出现的不良。进一步，在适用引线接合时，由于对引线长度有限制，不能使用通用的基板。或者，在适用面朝下接合时，由于需要使用与半导体芯片的电极排列相应的专用基板，也不能使用通用的基板。
发明内容
本发明的目的在于降低对基板的耐热性要求，减少半导体芯片产生的应力疲劳，可以使用通用基板。
本发明的第1发明中的电子装置，具备：基板，其上形成有布线图案；芯片部件，其具有形成了电极的第一面、和与所述第一面相反侧的第二面，按照与第二面相向那样搭载在所述基板上；绝缘部，其设置在所述芯片部件的侧面，具有从所述芯片部件向外方向朝下的倾斜面；和布线，其形成为从所述电极上紧贴着所述绝缘部的所述倾斜面达到所述布线图案。
本发明的第2发明中的电子装置中，所述芯片部件，在其端部具有阶梯。
本发明的第3发明中的电子装置中，所述绝缘部，由树脂构成。
本发明的第4发明中的电子装置中，所述倾斜面是凹面。
本发明的第5发明中的电子装置中，所述倾斜面是凸面。
本发明的第6发明中的电子装置中，所述绝缘部形成为其一部分搭载在所述第一面上。
本发明的第7发明中的电子装置中，所述绝缘部形成为其一部分不搭载在所述第一面上。
本发明的第8发明中的电子装置中，所述绝缘部具有与所述芯片部件邻接的、从所述第一面鼓起的部分。
本发明的第9发明中的电子装置中，进一步具有将所述芯片部件和所述基板粘接的粘接层。
本发明的第10发明中的电子装置中，所述粘接层，由与所述绝缘部相同的材料形成。
本发明的第11发明中的电子装置中，所述粘接层，由与所述绝缘部不同的材料形成。
本发明的第12中的电子装置的制造方法，具备：在已形成布线图案的基板上，将具有电极的芯片部件，按照与形成有所述电极的第一面相反侧的第二面和所述基板相向那样进行搭载的工艺；在所述芯片部件的侧面，形成具有从所述芯片部件向外方向朝下的倾斜面的绝缘部的工艺；和从所述电极紧贴着所述绝缘部的所述倾斜面达到所述布线图案而形成布线的工艺。
本发明的第13发明中的电子装置的制造方法中，所述绝缘部，由树脂形成。
本发明的第14发明中的电子装置的制造方法中，由含有导电性微粒子的分散液来形成所述布线。
本发明的第15发明中的电子装置的制造方法中，形成所述布线的工艺，包括将包含所述导电性微粒子的所述分散液喷出到所述电极、所述绝缘部及所述布线图案上的工艺。
本发明的第16发明中的电子装置的制造方法中，在所述基板上搭载所述芯片部件的工艺，包括将粘接剂置于所述基板及所述芯片部件之间的工艺。
本发明的第17发明中的电子装置的制造方法中，作为所述粘接剂使用绝缘性粘接剂；将所述粘接剂从所述基板和所述芯片部件之间挤出到所述芯片部件了邻近，由所述粘接剂形成所述绝缘部。
本发明的第18发明中的电子装置的制造方法中，所述绝缘部的形成工艺，包括设置与所述粘接剂不同的、用来形成所述绝缘部的材料的工艺。
附图说明
图1表示图2的I-I线剖面图。
图2表示有关本发明实施方式的电子装置的说明图。
图3A～图3C表示有关本发明的电子装置的制造方法的说明图。
图4表示有关本发明实施方式的电子装置的变形例的说明图。
图5表示有关本发明实施方式的电子装置的变形例的说明图。
图6表示有关本发明实施方式的电子装置的变形例的说明图。
图7表示有关本发明实施方式的电子装置的变形例的说明图。
图8表示有关本发明实施方式的电子装置的变形例的说明图。
图9A～图9B表示图8所示芯片部件的制造方法的说明图。
图10表示有关本发明实施方式的电子装置的变形例的说明图。
图11表示有关本发明实施方式的电子装置的变形例的说明图。
图12表示有关本发明实施方式的电子装置的变形例的说明图。
图13表示有关本发明实施方式的电子装置的变形例的说明图。
图14表示安装了有关本实施方式的电子装置的电路基板的图。
图15表示安装了有关本实施方式的电子装置的电子机器的图。
图16表示安装了有关本实施方式的电子装置的电子机器的图。
具体实施方式
下面参照附图说明本发明的实施方式。
图1表示有关本发明实施方式的电子装置的图，是图2的I-I线剖面图。图2表示有关本发明实施方式的电子装置的平面图。
电子装置具有芯片部件10。芯片部件10也可以是半导体部件(例如半导体芯片)等有源部件(例如集成电路部件等)。在芯片部件10上，也可以形成图中未画出的集成电路。当芯片部件10是半导体芯片时，电子装置可称为半导体装置。芯片部件10也可以是无源部件(电阻器、电容器、电感器等)。
在芯片部件10的第一面12上，形成有多个电极14。第一面12可以是四边形(例如矩形)。多个电极14也可以形成在第一面12的周缘部(端部)。例如，多个电极14可以沿第一面12的四边排列配置，也可以沿两边排列配置。也可以将至少1个电极14配置在第一面12的中央部。
在第一面12上，也可以形成由至少1层构成的钝化膜16。钝化膜16是电绝缘膜。钝化膜16也可以只用非树脂材料(例如SiO2或SiN)，在其上也可以进一步包含树脂(例如聚铣亚胺树脂)构成的膜。在钝化膜16上形成有让电极14的至少一部分(比如中央部)露出的开口。即，钝化膜16避开电极14的至少中央部形成。也可以在电极14的端部搭载钝化膜16。钝化膜16也可以将第一面12的整个周缘部覆盖。
在芯片部件10的第二面(与第一面相反侧的面)18上不形成电极。第二面18与图中未画出的集成电路可以电连接，也可以不连接。在第二面18上可以形成钝化膜(电绝缘膜)，也可以不形成。第二面18也可以由半导体(或者导体)形成。在芯片部件10的侧面(除第一面及第二面12、18之外的面)上可以形成钝化膜(电绝缘膜)，也可以不形成。在芯片部件10的侧面上不形成电极。芯片部件10的侧面也可以由半导体(或导体)形成。
电子装置具有基板20。在基板20上形成有布线图案22。布线图案22包含让基板20的一面露出的露出部24。在露出部24上，设计有用于将芯片部件10与布线图案22之间电连接的布线34。露出部24也可以具有图中未画出的焊盘(比引线宽的部分)。
已形成布线图案22的基板20可称为布线基板。布线基板可以是多层基板(包括双面基板)。多层基板包括多层(两层及以上)的导体图案。在这种情况下，布线图案22也可以包括与露出部24露出的面相反侧的第二面露出的第二露出部26。而且，布线图案22也可以包含内置在基板20内的导体图案28。布线基板也可以是部件内置型布线基板。详细讲，在基板20内部也可以将电阻器、电容器、电感器等无源部件或集成电路等有源部件与导体图案28电连接。或者也可以通过用高电阻值的材料形成导体图案28的一部分，由此形成电阻器。
在基板20上搭载着芯片部件10。芯片部件10的第二面18与基板20(仔细说就是露出部分24所在的面)相向。芯片部件10与基板20之间可以介入粘接层29。粘接层29可以由粘接剂形成。粘接层29如果具有导电性，就能够使露出部24与芯片部件10的第二面18电连接。而且，粘接层29如果具有电绝缘性，就可以使露出部24与芯片部件10的第二面18电绝缘。粘接层29也可以由包含导电粒子的电绝缘性分散剂形成。
电子装置具有绝缘部30。绝缘部30由具有电绝缘性的材料(例如树脂)形成。绝缘部30可以由与粘接层29不同的材料形成。绝缘部30在芯片部件10的邻近设计。绝缘部30也可以设计成包围芯片部件10，也可以设计成只在芯片部件10的电极14附近。即，绝缘部30与芯片部件10之间可以不形成间隙。在图1所示例中，绝缘部30被设计成不超过芯片部件10的高度。绝缘部30的上端可以与芯片部件10的上面(钝化膜16的表面)同样高度。这种情况下，绝缘部30与芯片部件10之间没有段差。也可以用绝缘部30只覆盖芯片部件10侧面中由半导体或导体构成的部分。这种情况下，绝缘部30的上端比钝化膜16的上面低。
绝缘部30具有从芯片部件向外方向朝下倾斜的倾斜面32。让绝缘部30的最厚部分位于距芯片部件10最近的位置，让最薄部分位于距芯片部件10最远的位置。绝缘部30也可以只在布线图案22(详细讲其露出部24)的一部分上形成。
电子装置具有布线34。布线34的一部分在电极14上形成。布线34也可以通过钝化膜16上面。布线34通过绝缘部30上面。绝缘部30由树脂形成时，绝缘部30与布线34之间的密接性要比钝化膜16与布线34之间的密接性高。如果芯片部件10(例如其钝化膜16)与绝缘部30之间的段差小，可以防止布线34断线。布线34按照达到布线图案22(详细讲其露出部24)上形成。即，布线34将电极14与布线图案22电连接。
电子装置也可以具有多个外部端子36。外部端子36可以设计在布线图案22(详细讲第二露出部26)上。外部端子36可以由焊料形成。焊料是具有导电性的金属(例如合金)，将其溶解后实现电连接。焊料可以使用软焊料(soft solder)、或者硬焊料(hard solder)的任一种。焊料可以使用不含铅的焊锡(以下称无铅焊锡)。无铅焊锡可以使用锡-银(Sn-Ag)系、锡-铋(Sn-Bi)系、锡-锌(Sn-Zn)系或是锡-铜(Sn-Cu)系的合金，也可以向这些合金中进一步添加银、铋、锌、铜中的至少一种。
周知具有外部端子36的BGA(Ball Grid Array：球栅阵列)型封装和CSP(Chip Size Package：芯片尺寸封装)等。也周知不设置外部端子36，由布线图案22的一部分(例如第二露出部26)成为与外部的电连接部的LGA(Land GridArray：面栅阵列)型部件。
电子装置也可以具有封装部件38。封装部件38至少将布线34与电极14的电连接部、和布线34与布线图案22的电连接部密封。封装部件38也可以将芯片部件10密封。
图3A～图3C表示有关本发明的电子装置的制造方法的说明图。如图3A所示，在基板20上搭载着芯片部件10。详细讲，将芯片部件10按照其第二面18与基板20相向进行搭载。也可以让粘接剂介入在芯片部件10与基板20之间，形成粘接层29。
如图3B所示，在芯片部件10的邻近形成绝缘部30。绝缘部30可以由与形成粘接层29的粘接剂不同的材料形成。绝缘部30也可以使用聚铣亚胺树脂、硅变性聚铣亚胺树脂、环氧树脂、硅变性环氧树脂、苯并环丁烯(BCB：benzocyclobutene)、聚苯并草唑(PBO：polybenzoxazole)等树脂形成。绝缘部30可以用液状树脂浇注形成，也可以通过凝固干膜形成。绝缘部30形成为具有从芯片部件10向外方向朝下倾斜的倾斜面32。绝缘部30可以按照与芯片部件10的侧面接触而形成。
如图3C所示，形成布线34。布线34是从电极14上通过绝缘部30上面一直达到布线图案22(例如露出部24)而形成。也可以由含有导电性微粒子的分散液来形成布线34。例如可以适用喷墨法。详细讲，可以将含导电性微粒子的分散液喷出到电极14、绝缘部30及布线图案22(例如露出部24)上，从而形成布线34。在布线34的形成工艺中，可以将含导电性微粒子的分散液干燥去除分散媒。在布线34的形成工艺中，也可以包含对覆盖导电性微粒子的覆盖材料加热分解的过程。导电微粒子可以是纳米粒子。这种情况下，能够降低分散液的体积电阻率。
如图1所示，可以设计封装部件38。封装部件38能够使用传递成型或者浇注方式形成。也可以省略封装部件38。
根据本实施方式，在将电极14与布线图案22电连接时，能够避免引线接合或者面朝下接合时进行的高温加热。因此，能够降低对基板20的耐热性的要求，减少芯片部件10的发生应力疲劳。而且，作为基板20能够使用通用基板，能够根据芯片部件10(其电极14的排列配置等)引绕布线34。这种的情况下，根据芯片部件的10的种类，在布线图案22的不同部分上连接布线34。
图4～图13表示有关本发明实施方式的电子装置的变形例。
在图4中，绝缘部40，按照其一部分载置在芯片部件10的第一面12(详细讲是钝化膜16)上形成。绝缘部40的一部分载置在芯片部件10的电极14的周缘部侧的部分上。为防止电极14被绝缘部40覆盖，可以在离电极14有一段距离的位置(电极周缘部的位置)，止住绝缘部40。或者，也可以与从电极14的钝化膜16的露出部邻连形成。这种情况下，布线42不载置在与其密接性低的钝化膜16上。绝缘部40具有一部分与芯片部件10邻接，并从第一面12上鼓起。其他构成，与图1所示电子装置相同的内容相当。
在图5中，绝缘部44，按照其一部分不载置在芯片部件10的第一面12上形成。绝缘部44具有一部分与芯片部件10邻接，从第一面12上鼓起。绝缘部44还有一部分在芯片部件10相反侧上呈阶梯状。其他构成，与图1所示电子装置相同的内容相当。
在图6上，绝缘部50与粘接层52一体化形成。粘接层52采用和绝缘部50相同材料形成。也可以在基板20和芯片部件10之间设置绝缘性的粘接剂，对基板20和芯片部件10施加按压力，让粘接剂从芯片部件10周围被挤出来，而由粘接剂形成绝缘部50及粘接层52。绝缘部50的倾斜面54是凹面(例如，由与第一面12相垂直的截面来描绘曲线的凹面)。其他构成，与图1所示电子装置相同的内容相当。另外，图6所示方式也可以适用于其他实施方式或变形例。
在图7中，绝缘部60与粘接层62一体化形成。粘接层62采用和绝缘部60相同材料形成。也可以在基板20和芯片部件10之间设置绝缘性的粘接剂，对基板20和芯片部件10施加按压力，让粘接剂从芯片部件10周围被挤出来，而由粘接剂形成绝缘部60及粘接层62。绝缘部60的倾斜面64是凸面(例如，由与第一面12相垂直的截面来描绘曲线的凸面)。其他构成，与图1所示电子装置相同的内容相当。另外，图7所示方式也可以适用于其他实施方式或变形例。
在图8中，芯片部件70，具有从第一面(形成电极14的面)72的向外方向朝下倾斜的侧面74。由于侧面74倾斜，在其上容易将绝缘部75设计成倾斜面。芯片部件70也可以包含和与第一个面72相反侧的第二面76垂直的侧面78。侧面74、78也可以连接。其他构成，与图1所示电子装置相同的内容相当。另外，图8所示方式也可以适用于其他实施方式或变形例。
侧面74，如图9A所示，可以在切割晶圆(例如半导体晶圆)80时形成。详细讲，就是使用象角铣刀那样双刃的角型的刀具(例如切割锯)82，在晶圆80上形成具有倾斜面的槽(例如V槽)，由倾斜面形成侧面74。槽形成后，如图9B所示，使用外侧有刃的刀具(例如切割锯)84进行切断。这样做之后，就能够形成与第二面76垂直的侧面78。
在图10中，芯片部件90的侧面94，从第一面(形成电极14的面)92向外方朝下倾斜。侧面94也从与第一面92相反侧的第二面96倾斜。其他构成，与图1所示电子装置相同的内容相当。另外，图10所示方式也可以适用于其他实施方式或变形例。
在图11中，芯片部件100在其端部具有阶梯102。阶梯102包括：从第一面(形成电极14的面)104向下(例如垂直向下)的面、与第一面104相反侧的第二面106向上(例如垂直向上)的面、及为连接这些面而向横方向(与第一和第二面104、106平行的方向)延伸的面。其他构成，与图1所示电子装置相同的内容相当。另外，图11所示方式也可以适用于其他实施方式或变形例。
在图12中，在基板20上，与搭载芯片部件10的面相反侧的面上，还搭载第二芯片部件110。第二芯片部件110与布线图案22(详细讲是第二露出部26)电连接。第二芯片部件110的安装方式可以是面朝下接合、或者面朝上接合的任一种。在面朝下接合中，第二芯片部件110的电极(焊盘)和布线图案22相向进行电连接。在面朝上接合中，可以在电连接中使用引线。其他构成，与图1所示电子装置相同的内容相当。另外，图12所示方式也可以适用于其他实施方式或变形例。
在图13中，在基板20上，在搭载芯片部件10的面上搭载第二芯片部件120。例如，在芯片部件10的上方(或者覆盖芯片部件10)配置第二芯片部件120。第二芯片部件120与布线图案22(详细讲是露出部24)电连接。第二芯片部件120的安装方式可以是面朝下接合、或者面朝上接合的任一种。在面朝下接合中，第二芯片部件120的电极(焊盘)和布线图案22相向进行电连接。在面朝上接合中，可以在电连接中使用引线。其他构成，与图1所示电子装置相同的内容相当。另外，图13所示方式也可以适用于其他实施方式或变形例。
在图14中表示安装了在上述实施方式中说明的电子装置1的电路基板1000。作为具有该电子装置的电子机器，在图15中表示笔记本型个人电脑2000，在图16中表示移动电话机3000。
本发明并不限定于上述实施方式，可以进行各种变形。例如，本发明包括与在实施方式中说明的构成实质上相同的构成(例如，性能、方法和结果相同的构成、或者目的及结果相同的构成)。另外，本发明包括置换了在实施方式中说明的构成中非本质部分的构成。而且，本发明还包括与在实施方式中说明的构成达到相同作用效果的构成，或者达到相同目的的构成。另外，本发明包括在实施方式中说明的构成上附加了公知技术后的构成。

Claims (18)

1. 一种电子装置，其特征在于，具备：
基板，其上形成有布线图案；
芯片部件，其具有形成了电极的第一面、和与所述第一面相反侧的第二面，按照与第二面相向那样搭载在所述基板上；
绝缘部，其设置在所述芯片部件的侧面，具有从所述芯片部件向外方向朝下的倾斜面；和
布线，其形成为从所述电极上紧贴着所述绝缘部的所述倾斜面达到所述布线图案。
2. 根据权利要求1所述的电子装置，其特征在于，所述芯片部件，在其端部具有阶梯。
3. 根据权利要求1所述的电子装置，其特征在于，所述绝缘部，由树脂构成。
4. 根据权利要求1所述的电子装置，其特征在于，
所述倾斜面是凹面。
5. 根据权利要求1所述的电子装置，其特征在于，
所述倾斜面是凸面。
6. 根据权利要求1至5中任一项所述的电子装置，其特征在于，
所述绝缘部形成为其一部分搭载在所述第一面上。
7. 根据权利要求1至5中任一项所述的电子装置，其特征在于，
所述绝缘部形成为其一部分不搭载在所述第一面上。
8. 根据权利要求1至5中任一项所述的电子装置，其特征在于，
所述绝缘部具有与所述芯片部件邻接的、从所述第一面鼓起的部分。
9. 根据权利要求1至5中任一项所述的电子装置，其特征在于，
进一步具有将所述芯片部件和所述基板粘接的粘接层。
10. 根据权利要求9所述的电子装置，其特征在于，
所述粘接层，由与所述绝缘部相同的材料形成。
11. 根据权利要求9所述的电子装置，其特征在于，
所述粘接层，由与所述绝缘部不同的材料形成。
12. 一种电子装置的制造方法，其特征在于，具备：
在已形成布线图案的基板上，将具有电极的芯片部件，按照与形成有所述电极的第一面相反侧的第二面和所述基板相向那样进行搭载的工艺；
在所述芯片部件的侧面，形成具有从所述芯片部件向外方向朝下的倾斜面的绝缘部的工艺；和
从所述电极紧贴着所述绝缘部的所述倾斜面达到所述布线图案而形成布线的工艺。
13. 根据权利要求12所述的电子装置的制造方法，其特征在于，所述绝缘部，由树脂形成。
14. 根据权利要求12所述的电子装置的制造方法，其特征在于，
由含有导电性微粒子的分散液来形成所述布线。
15. 根据权利要求14所述的电子装置的制造方法，其特征在于，
形成所述布线的工艺，包括将包含所述导电性微粒子的所述分散液喷出到所述电极、所述绝缘部及所述布线图案上的工艺。
16. 根据权利要求12至15中任一项所述的电子装置的制造方法，其特征在于，
在所述基板上搭载所述芯片部件的工艺，包括将粘接剂置于所述基板及所述芯片部件之间的工艺。
17. 根据权利要求16所述的电子装置的制造方法，其特征在于，
作为所述粘接剂使用绝缘性粘接剂；
将所述粘接剂从所述基板和所述芯片部件之间挤出到所述芯片部件邻近，由所述粘接剂形成所述绝缘部。
18. 根据权利要求16所述的电子装置的制造方法，其特征在于，所述绝缘部的形成工艺，包括设置与所述粘接剂不同的、用来形成所述绝缘部的材料的工艺。
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