CN100423298C - 发光二极管晶片封装体及其封装方法 - Google Patents
发光二极管晶片封装体及其封装方法 Download PDFInfo
- Publication number
- CN100423298C CN100423298C CNB2004100072203A CN200410007220A CN100423298C CN 100423298 C CN100423298 C CN 100423298C CN B2004100072203 A CNB2004100072203 A CN B2004100072203A CN 200410007220 A CN200410007220 A CN 200410007220A CN 100423298 C CN100423298 C CN 100423298C
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- Prior art keywords
- led wafer
- pad
- packaging body
- metal level
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title claims description 147
- 238000005538 encapsulation Methods 0.000 title abstract description 28
- 238000009434 installation Methods 0.000 claims abstract description 217
- 238000000034 method Methods 0.000 claims abstract description 72
- 238000003466 welding Methods 0.000 claims abstract description 29
- 239000010410 layer Substances 0.000 claims description 188
- 229910052751 metal Inorganic materials 0.000 claims description 173
- 239000002184 metal Substances 0.000 claims description 173
- 239000000758 substrate Substances 0.000 claims description 92
- 238000012856 packing Methods 0.000 claims description 67
- 230000004888 barrier function Effects 0.000 claims description 58
- 238000000576 coating method Methods 0.000 claims description 52
- 239000011248 coating agent Substances 0.000 claims description 50
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 46
- 239000000463 material Substances 0.000 claims description 40
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 39
- 239000010931 gold Substances 0.000 claims description 39
- 229910052737 gold Inorganic materials 0.000 claims description 39
- 239000004020 conductor Substances 0.000 claims description 35
- 239000012774 insulation material Substances 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 25
- 229910052759 nickel Inorganic materials 0.000 claims description 23
- 238000009413 insulation Methods 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 12
- 239000006071 cream Substances 0.000 claims description 12
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 6
- 239000012212 insulator Substances 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims description 6
- 230000001681 protective effect Effects 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract 2
- 239000011247 coating layer Substances 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 217
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 239000004642 Polyimide Substances 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 230000018109 developmental process Effects 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000007769 metal material Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 244000145841 kine Species 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Images
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- Packaging Frangible Articles (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (111)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100072203A CN100423298C (zh) | 2004-02-27 | 2004-02-27 | 发光二极管晶片封装体及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100072203A CN100423298C (zh) | 2004-02-27 | 2004-02-27 | 发光二极管晶片封装体及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1661821A CN1661821A (zh) | 2005-08-31 |
CN100423298C true CN100423298C (zh) | 2008-10-01 |
Family
ID=35010993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100072203A Expired - Fee Related CN100423298C (zh) | 2004-02-27 | 2004-02-27 | 发光二极管晶片封装体及其封装方法 |
Country Status (1)
Country | Link |
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CN (1) | CN100423298C (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100341160C (zh) * | 2004-02-27 | 2007-10-03 | 沈育浓 | 发光二极管晶片封装体及其封装方法 |
CN101894891B (zh) * | 2009-05-21 | 2013-03-13 | 长春藤控股有限公司 | 发光二极管晶元封装体及使用它的照明装置 |
TWI575761B (zh) * | 2016-04-27 | 2017-03-21 | 南茂科技股份有限公司 | 光電晶片封裝體及光電晶片封裝製程 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11161197A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
JP2002057373A (ja) * | 2000-08-08 | 2002-02-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
CN1421936A (zh) * | 2001-11-28 | 2003-06-04 | 国联光电科技股份有限公司 | 具有透明基板覆晶式发光二极体晶粒的高亮度发光二极体 |
US6614172B2 (en) * | 2000-02-02 | 2003-09-02 | Industrial Technology Research Institute | High efficiency white light emitting diode |
CN1661822A (zh) * | 2004-02-27 | 2005-08-31 | 沈育浓 | 发光二极管晶片封装体及其封装方法 |
-
2004
- 2004-02-27 CN CNB2004100072203A patent/CN100423298C/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11161197A (ja) * | 1997-11-25 | 1999-06-18 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
US6614172B2 (en) * | 2000-02-02 | 2003-09-02 | Industrial Technology Research Institute | High efficiency white light emitting diode |
JP2002057373A (ja) * | 2000-08-08 | 2002-02-22 | Matsushita Electric Ind Co Ltd | 半導体発光装置 |
US6455878B1 (en) * | 2001-05-15 | 2002-09-24 | Lumileds Lighting U.S., Llc | Semiconductor LED flip-chip having low refractive index underfill |
CN1421936A (zh) * | 2001-11-28 | 2003-06-04 | 国联光电科技股份有限公司 | 具有透明基板覆晶式发光二极体晶粒的高亮度发光二极体 |
CN1661822A (zh) * | 2004-02-27 | 2005-08-31 | 沈育浓 | 发光二极管晶片封装体及其封装方法 |
Also Published As
Publication number | Publication date |
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CN1661821A (zh) | 2005-08-31 |
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GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SUZHOU INDUSTRY PARK DONEY OPTOELECTRONICS TECHNOL Free format text: FORMER OWNER: SHEN YUNONG Effective date: 20100811 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIPEI CITY, TAIWAN, CHINA TO: 215122 A1501, NO.18, ZHANYE ROAD, SUZHOU INDUSTRIAL PARK, JIANGSU PROVINCE |
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TR01 | Transfer of patent right |
Effective date of registration: 20100811 Address after: 215122, A1501, 18 industrial road, Suzhou Industrial Park, Jiangsu Province Patentee after: Suzhou Industrial Park Anthony Photoelectric Technology Co. Ltd. Address before: Taipei City, Taiwan, China Patentee before: Shen Yunong |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081001 Termination date: 20200227 |
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CF01 | Termination of patent right due to non-payment of annual fee |