CN100413153C - 堆叠sfp连接器和壳体组件 - Google Patents

堆叠sfp连接器和壳体组件 Download PDF

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CN100413153C
CN100413153C CNB2004800315190A CN200480031519A CN100413153C CN 100413153 C CN100413153 C CN 100413153C CN B2004800315190 A CNB2004800315190 A CN B2004800315190A CN 200480031519 A CN200480031519 A CN 200480031519A CN 100413153 C CN100413153 C CN 100413153C
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terminal
module
circuit board
shell
wall
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CN1871748A (zh
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兰德尔·R·亨利
迈克尔·J·菲利普斯
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TE Connectivity Corp
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    • HELECTRICITY
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    • H05K9/00Screening of apparatus or components against electric or magnetic fields
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
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    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
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    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
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    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
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    • H01R13/514Bases; Cases composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
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Abstract

本发明公开一种电连接器组件,其包括屏蔽壳体(4),该屏蔽壳体包括上壁(10),下壁(12),侧壁(14,16),后壁(18)和中间壁(10),其限定排列成行和列的多个模块接收端口(8)。所述下壁和所述中间壁在各个所述列的各所述模块接收端口之间形成连通开口。电连接器设置在各所述连通开口中。各所述电连接器包括带有电路板安装面和前配合面的绝缘外壳。所述前配合面包括上部和下部电路板接收槽,该上部和下部电路板接收槽水平地横过前配合面延伸,并且定位成一个在另一个之上以与各所述列的相应的上和下模块接收端口对准。

Description

堆叠SFP连接器和壳体组件
技术领域
本发明一般地涉及电连接器系统,并且更特别地涉及用于可插入式电子模块的小轮廓连接器系统,例如用于高速光纤和铜通信的收发器模块。
背景技术
所公知的是提供了一种具有多个端口的金属壳体,每个端口可以容纳例如在美国专利6,517,382中所公开的可插入式模块。实际上,已经介绍了几种可插入式模块设计和标准,其中,可插入式模块插入到与主电路板电连接的插座中。例如,由工业协会所开发的公知类型的收发器公知为千兆位接口转换器(GBIC)或串行光学转换器(SOC),并且提供计算机和例如以太网或光纤通道的数据通信网络之间的接口。这些标准提供了广为工业所接收的一般稳固设计(robust design)。
虽然,在过去这些传统的插入式设计已经获得成功,但是他们趋向不能达到工业上持续的小型化的目标。所期望的是,使收发器小型化以增加与例如配电箱、电缆接线板、布线室和计算机输入/输出(I/O)的网络连接相关联的端口密度。最近,公布了新标准,并且在此称作小形状系数可插入式(SFP)标准,该标准规定了9.8mm的外壳高度、13.5mm的宽度和最小20个电I/O连接。除了使模块小型化之外,还希望增加工作频率。例如,实际应用可以迅速从千兆位以下的范围移动到大大超过一千兆位。传统的可插入式模块构造不能够满足这些参数需要。还希望增加端口密度并使SFP模块的连接接口优化。
在保持或甚至增加其运行速度的同时而使模块最小化造成了许多设计问题,特别是在例如范围为1-10Gbs(千兆位/秒)的数据传递速率较高的应用中。最特别关注的是减小电磁干涉(EMI)辐射。由于政府的规定,不仅需要使模块的EMI辐射最小化,而且还需要抑制模块安装在其中的主系统的EMI的辐射,不管模块是否插入到插座之中。
美国专利6276963示出传统设计,其中EMI屏蔽通过采用导电弹性承载门(conductive spring-loaded door)来实现,该导电弹性承载门能够在模块拆卸时摆动地关闭并且关闭插座。传统的插座还具有弹簧夹以使插座与主系统的底座开口(bezel opening)接地。为在插座上的弹性承载门和弹簧夹提供空间如果在小型化构造中不是不可能的话,其往往会造成问题。另外,小型化构型会造成如下问题,即从模块中散热的问题,以及将用于弹出和保持模块以及将模块与主电路板电连接的传统机构结合到其中的问题。此外,在处理必须装配到小型化结构中的非常小的元件时,存在着内在的困难
因此,需要一种连接系统,其在使EMI辐射最小化的同时还符合SFP标准尺寸,从而增加了端口的密度并且提供了传统的可插入式操作,并且可以在没有过分困难的情况下装配。
发明内容
上述问题通过一种电连接器组件来解决,该电连接组件包括其包括屏蔽壳体,该屏蔽壳体包括上壁,下壁,侧壁,后壁和中间壁,这些壁限定出排列成行和列的多个模块接收端口。所述下壁和所述中间壁在各个所述列的各所述模块接收端口之间形成连通开口。电连接器设置在各所述连通开口中。每个所述电连接器包括带有电路板安装面和前配合面的绝缘外壳。所述前配合面包括上部和下部电路板接收槽,该上部和下部电路板接收槽水平地横过前配合面延伸,并且定位成一个在另一个之上以与各所述列的相应的上和下模块接收端口对准。每个所述电连接器包括多个布置成阵列的终端,所述终端包括上和下终端对。所述上终端对具有位于所述上部电路板接收槽的侧面的悬壁梁触头,并且所述下终端对具有位于所述下电路板接收槽的侧面的悬壁梁触头。每个所述终端排列包括冲压成的引线框,该引线框由塑料材料腹板包裹成型。锁定接头包裹成型在所述塑料材料腹板上,并且所述锁定接头从所述腹板的前边缘向外延伸并且接合于所述外壳的槽中。
附图说明
参考附图,现在将通过实例来说明本发明,其中:
图1是电连接器组件的下侧的透视图,该电连接器组件包括根据本发明的壳体和电连接器;
图2是图1的组件的仰视图;
图3是图1中缺少连接器时壳体的正视图;
图4是图3的壳体的下侧透视图;
图5是在图1中所示的一种连接器的透视图;
图6是在图5中所示的连接器的侧视平面图;
图7是沿图6中的线7-7的剖视图;
图8是图5中的连接器的正视图;
图9是沿图8的线9-9的剖视图;
图10是冲压成形的引线框的顶视图,其为图5的外壳提供了邻接的触头;
图11是示出了包裹成型在图10的引线框上的绝缘材料网的示图;
图12A和12B示出了从图11的引线框拆卸的终端分组件;
图13是沿图11的线13-13的剖视图;
图14是沿图12A的线14-14的剖视图;
图15是沿图12B的线15-15的剖视图;
图16是组合连接器的正视图;
图17是沿图16的线17-17的局部剖视图;
图18是图16的组合连接器的下部平面图;
图19是正视图,其示出了位于壳体内适当位置的连接器;
图20和21示出了模块的俯视图和仰视图,该模块可插入到图1的壳体中并且与连接器可配合。
具体实施方式
首先参考图1和图2,电连接器组件2包括冲压成形的屏蔽壳体4,该壳体具有多个定位其中的连接器组件6。
从图1中可以理解,连接器组件用于布置在母板上并且包括多个模块接收端口8,如将在下面描述的那样。
参考图3和4,其示出了缺少电连接器6的屏蔽壳体4,所示出的屏蔽壳体4具有上壁10、下壁12、侧壁14和16以及后壁18,这些壁共同限定出壳体4的总的外壳。中间壁20将壳体4细分成行,所述中间壁具有前面22,该前面带有上壁24(图3)和下壁26(图4)。同时,竖直延伸的分隔壁30将壳体4细分成列。中间壁20由接头34保持在适当的位置,该接头从上和下壁24、26的的侧边缘延伸出来,并且延伸穿过侧壁14、16,这在图1和3中清楚地示出。竖直分隔壁30由延伸穿过下壁12上的孔的印刷电路板尖头38(图4)和延伸穿过上壁10上的孔的弯曲接头部40(图3)定位和保持在壳体中。
壳体4具有许多使其能够与母板和/或其他面板接地的部件。在图4中很好地示出,除了印刷电路板尖头38之外,壳体的周边包括多个在44的印刷电路板尖头,这些尖头用于机械地将壳体保持在母板上,还使壳体与母板接地。弹性舌状部46也从下壁12中锻造出来并且提供壳体与母板的接地。绕壳体的周边朝向壳体的前边缘处,其包括多个弹性舌状部50,其成型为与壳体所插入的开口结合。上和下壁24、26包括邻近于其前边缘的接地接头52,该接地接头用于将插入其中的模块接地。最后,接地突出部具有锁定开口,这将在以下进行更充分的说明。
现在参考图3,壳体4还包括:连通开口,其总地由附图标记60表示并且由延伸穿过下壁12(图3)的开口62、延伸穿过上壁24(图3)的开口64、以及延伸穿过下壁26(未示出)的相应类似开口形成。连通开口60设置在壳体4的后侧用于接近连接器构件6,这会做更加详细地说明。
最后,参考图3和图4,壳体还包括模块弹出弹簧70,各模块弹出弹簧由冲压成形材料的反向弯曲环形成,该反向弯曲环形成向前指向的弹簧。
现在参考图5至9,将进一步详细地说明连接器6。在图5中很好地示出,连接器6包括:外壳80,该外壳由具有侧壁84、86的直立主体部分82、电路安装面88、以及配合面90限定。上和下延伸部92和94从主体部分82延伸出来以形成配合面90。凹入面96形成在主体部分前面、上和下延伸部92、94之间。最后,如图8中很好的示出,电路板接收槽100和102从配合面90开始并且穿过上和下延伸部92、94向内延伸到外壳80中。
现在参考图7至9,将对外壳80的内部进行更详细的说明。如图9所示,槽100和102向后延伸进入其各自延伸部92、94中,延伸到各中间壁104、106处,从而在上和下延伸部中限定上和下终端接收通道108-111。应该注意的是,图9是如图8所示的的外壳的交错剖视图。如图9所示,通道108-111分别与槽112-115对齐,槽112-115位于槽100、102的侧面并且向前面90敞开。如图9所示,延伸部92和94从限定内表面的前壁120延伸。外壳80还包括限定内表面126的顶壁部124。此外,如图7中清楚的示出,侧壁84和86限定内表面130和132。因此,后部腔140形成在外壳80中、前壁120的后部处,由表面122、126、130和132围绕。该腔140接收终端模块,该终端模块将要做更详细地说明。
对于终端模块,外壳80包括多个锁定槽150,其延伸穿过凹入面96,如图5和图8中清楚示出的,并且该多个锁定槽经由前壁120向内延伸到内表面122,如图7和9中清楚所示。此外,如图7所示,外壳80包括多个沿内表面126形成的用于将模块定位的燕尾槽152,这将在以下说明。外壳80还包括定位在外壳的相对拐角处的定位柱154和锁定构件156。锁定构件156构型成可滑动地接收在分隔壁30的边缘上和侧壁14和16的边缘上,这在以下做更详细地说明。
现在参考图10至12B,将对终端模块做更详细地说明。如图12A和12B所述,两个终端模块200和300各自包括由塑料材料的腹板(web)204和304包裹成型(overmolded)的终端引线框202和302。如图10清楚示出的,引线框202和302由普通材料板冲压而成,由载带206、306承载。每个引线框202、302由四个终端组成,其包括一对上终端210、212;310、312,以及一对下终端214、216;314、316。如图20所示,上和下对的终端由竖直间距Y分开,并且保持接头220、320分别定位在该竖直间距中并且由载带部222、322保持在适当的位置。
终端对中的每一对基本上相同,但彼此成镜像,这将要在此说明。终端210包括悬臂梁部210a,其形成与终端前端邻近的前接触部。终端210还包括锁定接头部210c。终端210还包括中间倾斜部210n,其使终端从水平过渡到竖直取向,并且在210d处过渡到细长延伸部210e,该细长延伸部补偿水平间距Y并且与柔顺引脚部(compliant pin portion)210f互连。如图10所示,各终端具有大致等同的部件,虽然终端214和216具有远短于终端210、212的等同细长延伸部210e、210f的细长延伸部214e、216e。终端214、216还具有倾斜中间部214h、216h以及柔顺引脚部214f、216。
如图10所示,终端引线框302几乎与引线框202相同,除了每个终端包括弯曲腿部310g-316g之外,这些弯曲腿部310g-316g使柔顺引脚部310f-316f分别相对于相应的柔顺引脚部210f-216f向后大致形成梯级状。
现在参考图11,利用如图10所示和所述的引线框,模制腹板(moldedweb)204、304在引线框的一部分上镶嵌造型,使得各终端的悬臂部分分别从模制腹板的前边缘240、340向前延伸。类似地,柔顺引脚部210f-216f从模制腹板的下边缘242、342向下延伸。如图10和11所示,各接头部220、320包括孔眼部221、321,其邻近于前边缘240、340包裹成型,但接头220、320的前部从前边缘向外延伸。当包裹成型的腹板204、304放置在图11中的位置时,可以将引线框206、306和222、322从引线框中冲压下来,从而形成分别如图12A和12B所示的完整插入件200和300。
现在参考图13,更详细地示出了悬臂终端214a和216a的结构。如图所示,各终端在214h和216h弯曲以使得悬臂部214a和216a错开。此外,如图13所示,腹板204包括侧表面250、252,而模制插入件304包括侧表面350、352(图12B,15)。如图14和15清楚示出的,模制插入件的顶部边缘还构造成相配合的燕尾部,以使得当模制插入件204、304以堆叠关系定位,插入件204的表面252抵靠在插入件304的表面350上定位时,两个轮廓254和354提供了燕尾舌状外形。应该理解的是,该舌状外形形成燕尾槽152,如图7所示。利用上述部件,现在将对连接器组件的组装以及连接器组件组装到壳体上予以说明。
如上所述,各终端分组件200、300定位成彼此堆叠,模制插入件304的表面350抵靠在模制插入件204的表面252上而定位。这些模制插入件现在可插入到外壳80的腔140中,以使得单独的终端与各通道108-111对准。插入件连续地移动到外壳中使得终端定位在各槽112-115(图9)内。连续作用力使得锁定接头220、320插入到槽150中,从而将插入件锁定在合适的位置,且模制插入件的前边缘240将模制插入件204、304充分定位在腔内,表面240、340靠在外壳80的内表面上。也如上所述,燕尾构型254、354允许各个阵列与燕尾槽152对齐。悬臂梁定位在壳体80中,从而接头部(例如210c)干涉配合在各通道108中,并且接头部210c作用为支点,且悬臂梁部210a向前延伸、梁210a的一部分位于槽212中并且触点210b延伸到接收槽100中。可以理解的是,各悬臂梁如此位于其各自的通道和槽中。由此,连接器6的完全组装构造示出在图16和18中。
经由下壁12至在图1、2和19中示出的位置,现在可以将连接器6定位在壳体4中。如图2清楚示出的,各连接器夹在壳体上,由此在连接器的相对拐角处的锁定构件156夹在外壁14、16或内分隔壁30上。如图2清楚示出的,由于锁定构件156的交错构型,连接器外壳80可以以紧密排成阵列的方式定位。还有,如图19清楚示出的,各印刷电路板接收槽100、102定位在相应的其中一个模块接收端口8内,以接收模块。
最后,如图20和21所示,其示出了小形状系数可插入式(SFP)模块400,该模块具有在其一端402处的电路板,该电路板用于互连到槽100、102中并且与多个电终端互连。模块400还包括在该模块内与端部404的接口的电互连,例如,以标准模块化插口方式的铜接口;或该模块内与光纤连接器的电互连,以进一步连接。该模块还包括接地接头404、408和凸起部410(图21)。该凸出部锁定到接地接头52的三角形开口54(图1)中。由于可以从壳体的前端接近接地接头,所以这使模块400可以容易地取出。这些SFP模块类似于公知为Tyco零件号1367251的模块和示出在美国专利号6,517,382中的模块,在此通过引用结合到本文中。
有利地,整个电连接器组件的装配通过使用连接器6得以简化,该连接器具有两个印刷电路板接收槽100、102,该印刷电路板接收槽进一步增加了端口密度和整个系统的效率。

Claims (3)

1. 一种电连接器组件,其包括屏蔽壳体(4),该壳体具有上壁(10)、下壁(12)、侧壁(14,16)、后壁(18)和中间壁(20),其限定排列成行和列的多个模块接收端口(8),
所述下壁和所述中间壁在各个所述列的各所述模块接收端口之间形成连通开口(60);以及
电连接器(6)设置在每个所述连通开口中,各所述电连接器包括带有电路板安装面(88)和前配合面(90)的绝缘外壳(80),并且所述前配合面包括上部和下部电路板接收槽(100,102),该上部和下部电路板接收槽水平地横过前配合面延伸,并且定位成一个在另一个之上以与各所述列中的相应的上和下模块接收端口对准,
其中,各所述电连接器包括多个终端阵列,所述多个终端阵列包括上(210,212;310,312)和下(214,216;314,316)终端对,所述上终端对具有位于所述上部电路板接收槽的侧面的悬壁梁触头(210a,212a),并且所述下终端对具有位于所述下电路板接收槽的侧面的悬壁梁触头(214a,216a),该电连接器组件的特征在于:
所述终端阵列包括冲压成的引线框(202,302),该引线框由塑料材料腹板(204,304)包裹成型,锁定接头(220,320)包裹成型在所述塑料材料腹板上,并且所述锁定接头从所述腹板的前边缘(240,340)向外延伸并且接合于所述外壳的槽(150)中。
2. 如权利要求1所述的电连接器组件,其中,所述外壳包括上和下延伸部(92,94),所述上和下延伸部从所述外壳的主体部分向所述前配合面延伸,并且所述上部和下部电路板接收槽定位在相应的所述上和下延伸部中。
3. 如权利要求1所述的电连接器组件,其中,多个所述终端阵列并排地设置在所述外壳中的腔中。
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US7070446B2 (en) 2006-07-04
WO2005022698A1 (en) 2005-03-10
DE602004004408T2 (de) 2007-10-25
WO2005022698A8 (en) 2005-11-03
CN1871748A (zh) 2006-11-29
DE602004004408D1 (de) 2007-03-08
EP1658659A1 (en) 2006-05-24

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