US20130094153A1 - Electromagnetic radiation shielding on a pci express card - Google Patents
Electromagnetic radiation shielding on a pci express card Download PDFInfo
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- US20130094153A1 US20130094153A1 US13/651,245 US201213651245A US2013094153A1 US 20130094153 A1 US20130094153 A1 US 20130094153A1 US 201213651245 A US201213651245 A US 201213651245A US 2013094153 A1 US2013094153 A1 US 2013094153A1
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- emr
- opening
- shield
- transceiver modules
- bezel
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
Definitions
- EMR electromagnetic radiation
- Electronic modules such as electronic or optoelectronic transceiver or transponder modules, are increasingly used in electronic and optoelectronic communication.
- Electronic modules typically communicate with a host device by transmitting electrical signals to the host device and receiving electrical signals from the host device. These electrical signals can then be transmitted by the electronic module outside the host device as optical and/or electrical signals.
- EMR electromagnetic radiation
- An example embodiment includes an electromagnetic radiation (EMR) shield.
- the EMR shield is configured to reduce EMR escaping from a host device.
- the EMR shield includes a structure, two or more module-grounding tabs, and a plurality of fingers.
- the structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel.
- the two or more module-grounding tabs extend from the structure.
- Each of the module-grounding tabs is configured to contact one of the transceiver modules.
- the fingers extend from the structure and are configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
- PCIe peripheral component interconnect express
- the PCIe card includes a bezel, two or more adjacent transceiver modules, a printed circuit board (PCB), and an EMR shield.
- the bezel defines an opening.
- the two or more adjacent transceiver modules are positioned in the opening.
- the PCB is mechanically coupled to the bezel and to the transceiver modules.
- the EMR shield is configured to reduce EMR that escapes through the opening from a host device into which the PCIe card is received.
- the EMR shield includes a structure defining an enclosure configured to at least partially enclose the transceiver modules.
- the EMR shield further includes a plurality of fingers extending from the structure, which is configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
- the PCIe card includes a bezel, two or more adjacent transceiver modules, a PCB, and an EMR shield.
- the bezel defines an opening.
- the two or more adjacent transceiver modules are positioned in the opening.
- the PCB is mechanically coupled to the bezel and to the transceiver module.
- the EMR shield is configured to reduce EMR that escapes through the opening from a host device into which the PCIe card is received.
- the EMR shield includes a structure that substantially surrounds the transceiver modules.
- the EMR shield further includes a plurality of ridges defined in the structure. The ridges are configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
- FIGS. 1A-1C are an example peripheral component interconnect express (PCIe) card
- FIGS. 2A-2C are an example electromagnetic radiation (EMR) shield that can be implemented in the PCIe card of FIGS. 1A-1C ;
- EMR electromagnetic radiation
- FIG. 3 is a partial, sectional view of the PCIe card of FIGS. 1A-1C including the EMR shield of FIGS. 2A-2C ;
- FIGS. 4A and 4B are an example of an alternative PCIe card
- FIGS. 5A-5C are a second example EMR shield that may be implemented in the PCIe card of FIGS. 1A-1C ;
- FIG. 6 is a partial sectional view of the PCIe card of FIGS. 1A-1C including the second example EMR shield of FIGS. 5A-5C ;
- FIG. 7 is a third example EMR shield that may be implemented in the PCIe card of FIGS. 1A-1C ;
- FIG. 8 is a partial, sectional view of the PCIe card of FIGS. 1A-1C including the third example EMR shield of FIG. 7 .
- Example embodiments of the invention relate to electromagnetic radiation (EMR) shields for use in connection with optical transceiver modules, such as those employed in a peripheral component interconnect express (PCIe) card.
- EMR electromagnetic radiation
- PCIe peripheral component interconnect express
- the EMR shields disclosed herein effectively maintain EMR emitted from a host device at acceptable levels to avoid electromagnetic interference (EMI) in surrounding devices.
- EMI electromagnetic interference
- FIGS. 1A-1C disclose some aspects of an example PCIe card 100 .
- FIG. 1A depicts a top-perspective view of the PCIe card 100
- FIG. 1B depicts a bottom-perspective view of the PCIe card 100
- FIG. 1C depicts a top exploded view of the PCIe card 100 .
- the PCIe card 100 represents one example operating environment in which embodiments of the invention disclosed herein may be implemented. It should be appreciated that one or more embodiments disclosed herein may be implemented in the PCIe card 100 as well as other environments.
- the PCIe card 100 may be used in transmitting and receiving optical signals in connection with a host device (not shown) into which the PCIe card 100 is received.
- the PCIe card 100 includes one or more optoelectronic transceiver modules (modules) 104 .
- the PCIe card 100 includes four modules 104 ; however, this is not meant to be limiting. In some embodiments, the PCIe card 100 may include three or fewer modules 104 or five or more modules 104 .
- the modules 104 may be mechanically coupled to a printed circuit board (PCB) 106 included in the PCIe card 100 .
- the PCB 106 may include multiple pin openings 116 . Note that only three of the multiple pin openings 116 are explicitly labeled in FIG. 1C , but the PCB 106 includes seventeen pin openings 116 .
- the number and configuration of the pin openings 116 may vary depending on the number of modules 104 and the configuration of an EMR shield (described below) included in the PCIe card 100 .
- each of the modules 104 may include module pins 120 configured to be received by some of the pin openings 116 defined in the PCB 106 .
- the module pins 120 may be soldered or otherwise secured to the PCB 106 , thereby mechanically coupling the modules 104 to the PCB 106 . Note that only one of the module pins 120 is explicitly labeled in FIG. 1B , but FIG. 1B includes eight module pins 120 received in some of the pin openings 116 .
- the modules 104 may be in electronic communication with the PCB 106 .
- the electrical communication between the PCB 106 and the modules 104 enables optical signals received by one or more of the modules 104 via optical fibers (not shown) that are plugged into the front of the modules 104 to be communicated via the PCB 106 to the host device.
- electrical signals originating at the host device may be communicated via the PCB 106 to one or more of the modules 104 .
- the modules 104 may transduce the electrical signals to optical signals and transmit the optical signals via optical fibers (not shown) that are plugged into the front of the modules 104 .
- Each of the modules 104 may be configured for optical signal transmission and reception at a variety of per-second data rates including, but not limited to, 1 gigabit (G), 2 G, 2.5 G, 4 G, 8 G, 10 G, 10.7 G, or higher.
- the modules 104 may also be configured for optical signal transmission and reception at one or more wavelengths including, but not limited to, 850 nanometers (nm), 1310 nm, 1470 nm, 1490 nm, 1510 nm, 1530 nm, 1550 nm, 1570 nm, 1590 nm, or 1610 nm.
- the modules 104 may be configured to support various transmission standards including, but not limited to, Optical Fast Ethernet, Optical G Ethernet, 10 G Ethernet, 40 G Ethernet, 100 G Ethernet, 1x, 2x, 4x, 8x, 10x, and 16x Fibre Channel, SONET OC-3, OC-12, OC-48, OC-192, OC-768, 10 Gigabit Fibre Channel, 10 G Ethernet, 100 BASE-T, and PON. Further, the modules 104 can be configured to operate properly with a case temperature range of ⁇ 40° C. to 85° C.
- the modules 104 may have a form factor that is substantially compliant with any of a variety of public standards such as the SFP+MSA, the SFF MSA, the SFP MSA, the CFP MSA, or the CXP MSA, or any proprietary standard. However, the modules 104 are not necessarily compliant with a standard and may be customized for a particular application.
- Each of the modules 104 depicted in FIGS. 1A-1C include an LC transmit port and an LC receive port configured to send and receive optical signals over optical fibers (not shown) that are plugged into the front of the modules 104 .
- the modules 104 may include a top surface 122 ( FIGS. 1A and 1C ), a bottom surface 128 ( FIG. 1B ), a rear surface 126 ( FIG. 1C ), and two side surfaces 124 .
- One of the side surfaces 124 is visible in FIGS. 1A and 1C and a second of the side surfaces 124 is visible in FIG. 1B .
- the modules 104 are positioned adjacent to one another in an opening 110 defined in a bezel 102 .
- the bezel 102 generally frames the modules 104 and may enable the PCIe card 100 to be mounted within the host device.
- a PCIe card tab 114 may engage a corresponding structure in the host device to secure the PCIe card 100 to the host device.
- the bezel 102 may also be mechanically coupled to the PCB 106 .
- the bezel 102 may include a bezel connector 112 defining an opening that corresponds to bezel receiving opening 118 ( FIG. 1C ) defined in the PCB 106 .
- a fastener (not shown) or an equivalent mechanism may be implemented to mechanically couple the bezel 102 to the PCB 106 .
- the bezel connector 112 may also electrically ground the bezel 102 to the PCB 106 .
- the opening 110 (best illustrated in FIG. 1C ) defined in the bezel 102 is substantially rectangular to correspond to the modules 104 positioned therein. However, the opening 110 may not be precisely sized to fit the modules 104 .
- EMR may escape from the bezel 102 through the opening 110 .
- EMR from components (not shown) located on the PCB 106 may escape from the host device through the opening 110 by radiating above, beneath, to the side of, and/or between the adjacent modules 104 .
- the EMR may cause EMI, which may cause problems in other electronic systems in the vicinity of the PCIe card 100 .
- the PCIe card 100 may include an EMR shield 200 ( FIGS. 1A and 1C ).
- the EMR shield 200 may be composed of electrically-conductive material to shield against some of the EMR produced in the host device. Additionally, the EMR shield 200 may substantially surround and/or at least partially enclose the modules 104 positioned in the opening 110 and contact the bezel 102 at contact areas that surround the opening 110 . The EMR shield 200 may therefore fill some of the gaps between the modules 104 and between the bezel 102 and/or fill the gaps between the modules 104 to block EMR from escaping through the opening 110 . Additionally, the contact between the EMR shield 200 and the bezel 102 may ground the EMR shield 200 to further reduce EMR escaping from the host devices.
- FIGS. 2A-2C illustrate some additional details of the EMR shield 200 .
- the EMR shield 200 includes a structure 202 .
- the structure 202 refers to the portion of the EMR shield 200 which is configured to substantially surround and/or at least partially enclose modules such as the modules 104 of FIGS. 1A-1C .
- the structure 202 includes an upper wall 218 ( FIGS. 2A-2B ), a lower wall 222 , two side walls 220 A/ 220 B, and a rear wall 224 .
- Each of the upper wall 218 , the lower wall 222 , and the two side walls 220 A/ 220 B are configured to be positioned parallel to one of the surfaces (i.e., surface 122 , 124 , 126 , or 128 ) of the modules 104 .
- the upper wall 218 may be configured to be positioned parallel to the top surface 122 of the modules 104 .
- the lower wall 222 may be configured to be positioned parallel to the bottom surface 128 of the modules 104 .
- the two side walls 220 A/ 220 B may be configured to be positioned parallel to side surfaces 124 of the modules 104 .
- the rear wall 224 may be configured to be positioned parallel to a rear surface 126 of the module 104 .
- the structure 202 defines an enclosure 216 within which the modules 104 are at least partially enclosed.
- the term “surrounds” refers to a relationship between the modules 104 and the upper wall 218 , the lower wall 222 , and the two side walls 220 A/ 220 B. That is, the upper wall 218 , the lower wall 222 , and the two side walls 220 A/ 220 B create a band that borders and/or otherwise contacts the modules 104 along the top surface 122 , the bottom surface 128 , and the two side surfaces 124 without bordering or otherwise contacting the front of the modules 104 or a rear surface 126 of the modules 104 .
- the term “enclosed” refers to a relationship between the enclosure 216 and the modules 104 . That is, the enclosure 216 borders and/or otherwise contacts the modules 104 on the top surface 122 , the bottom surface 128 , the rear surface 126 , and the two side surfaces 124 .
- the structure 202 may be generally constructed from an upper piece 204 and a lower piece 206 .
- the upper piece 204 is shown separate from the lower piece 206 .
- the upper piece 204 is shown assembled with the lower piece 206 .
- the upper piece 204 may include the upper wall 218 , the rear wall 224 , and upper portions of the side walls 228 A/ 228 B.
- the lower piece 206 may include the lower wall 222 and lower portions of the side walls 226 A/ 226 B. The upper portions of the side walls 228 A/ 228 B may engage with the lower portions of the side walls 226 A/ 226 B to secure the upper piece 204 to the lower piece 206 .
- the EMR shield 200 may be mechanically coupled to the PCB 106 .
- the lower piece 206 may be positioned and/or secured between the modules 104 and the PCB 106 when assembled in the PCIe card 100 .
- the upper piece 204 can then be positioned onto the modules 104 and secured to the lower piece 206 .
- the lower piece 206 may include connectors 230 and/or the upper piece may include connectors 232 .
- the connectors 232 and 230 may be used to secure the upper piece 204 and/or the lower piece 206 to the PCB 106 .
- the connectors 232 included on the upper piece 204 may extend from the rear wall 224 to be received in one or more of the pin openings 116 defined in the PCB 106 .
- the connectors 230 extend from the lower piece 206 and may be received in one or more of the pin openings 116 defined in the PCB 106 .
- the connectors 230 and 232 may be soldered or otherwise secured to the PCB 106 to mechanically and/or electrically couple the EMR shield 200 to the PCB 106 .
- module-grounding tabs 212 may also extend from the structure 202 .
- the structure 202 includes two module-grounding tabs 212 .
- One of the module-grounding tabs 212 is visible in FIGS. 2A and 2B and a second module-grounding tab 212 is visible in FIG. 2C .
- the module-grounding tabs 212 extend from the side walls 220 A/ 220 B to contact modules, such as one of the modules 104 of FIGS. 1A-1C , positioned in the structure 202 .
- the module-grounding tabs 212 may provide a chassis ground for the modules. For example, an electric ground may be transferred from a shell of a module 104 to the structure 202 , via the module-grounding tabs 212 , and then to one or more of the connectors 230 and/or 232 .
- the structure 202 also includes an outer edge 208 .
- the outer edge may include an edge of the structure 202 opposite the rear wall 224 .
- the outer edge 208 may be defined along the upper wall 218 , the lower wall 222 , and the two side walls 220 A/ 220 B. In the depicted embodiment, along the side walls 220 A/ 220 B, the outer edge 208 is defined along the upper piece 204 (i.e., the upper portions of the side walls 228 A/ 228 B), and the outer edge 208 may not be defined along the lower piece 206 (i.e., the lower portions of the side walls 226 A/ 226 B).
- Fingers 210 may extend from the outer edge 208 .
- the fingers 210 may be configured to contact a bezel around an opening.
- the fingers 210 may be configured to contact the bezel 102 around the opening 110 .
- the fingers 210 that extend from the upper piece 204 , that is, along a portion of the outer edge 208 defined along the upper wall 218 and the two side walls 220 A/ 220 B, may be curved.
- the fingers 210 that extend from the lower piece 206 , that is, along a portion of the outer edge 208 defined along the lower wall 222 may additionally be curved.
- the fingers 210 may be substantially evenly spaced along the outer edge 208 and thus substantially evenly spaced around an opening contacted by the fingers 210 .
- this is not meant to be limiting.
- the fingers 210 may be unevenly spaced along the outer edge 208 and thus unevenly spaced around an opening contacted by the fingers 210 .
- the EMR shield 200 includes a bezel coupling structure 214 extending substantially perpendicular from the rear wall 224 .
- the bezel coupling structure 214 may define an opening configured to receive a fastener (not shown) to secure a bezel, such as the bezel 102 of FIGS. 1A-1C , to the EMR shield 200 .
- Some additional details of the bezel coupling structure 214 are provided with reference to FIGS. 4A and 4B .
- FIG. 3 illustrates a partial, sectional view of the PCIe card 100 of FIGS. 1A-1C including the EMR shield 200 described with reference to FIGS. 1A-2C .
- the module 104 , the bezel 102 , and the PCB 106 described with reference to FIGS. 1A-1C and the EMR shield 200 described with reference to FIGS. 1A-2C are included in FIG. 3 .
- the EMR shield 200 is depicted mechanically coupled to the PCB 106 though connectors 230 and 232 received in the PCB 106 .
- FIG. 3 depicts the modules 104 mechanically coupled to the PCB 106 through the module pin 120 received in the PCB 106 .
- the modules 104 are at least partially enclosed by the EMR shield 200 .
- the upper wall 218 borders the top surface 122
- the rear wall 224 borders the rear surface 126
- the lower wall 222 borders the bottom surface 128 .
- FIG. 3 depicts an EMR source 304 , which may be electronic components (not shown) on the PCB 106 or other electronic components within a host device (not shown) from which EMR may be emitted.
- the EMR shield 200 reduces EMR escaping from the opening 110 by the fingers 210 contacting the bezel 102 around the opening 110 at one or more contact areas 302 .
- the contact areas 302 substantially surround the opening 110 and thereby shield at least a portion of the EMR emitted by the EMR source 304 .
- FIGS. 4A and 4B illustrate an example of an alternative PCIe card 100 A.
- the alternative PCIe card 100 A is substantially similar to the PCIe card 100 described with reference to FIGS. 1A-1C .
- the alternative PCIe card 100 A includes an alternative bezel 102 A.
- the alternative bezel 102 A is substantially similar to the bezel 102 described with reference to FIGS. 1A-1C other than the alternative bezel 102 A may include an EMR shield coupling structure 404 and a fastener 402 .
- the EMR shield coupling structure 404 and the fastener 402 are configured to mechanically couple the alternative bezel 102 A to the EMR shield 200 .
- the EMR shield coupling structure 404 extends over the bezel coupling structure 214 , described above with reference to FIGS. 2A-2C .
- the EMR shield coupling structure 404 is secured to the bezel coupling structure 214 using the fastener 402 .
- the fingers 210 extending from the EMR shield 200 contact the alternative bezel 102 A.
- the fingers 210 are substantially evenly spaced around the opening 110 .
- the EMR shield 200 is also shown mechanically coupled to the PCB 106 by the connectors 232 and 230 being received by the PCB 106 .
- the modules 104 (visible in FIG. 4A ) are shown mechanically coupled to PCB 106 by the module pins 120 being received in the PCB 106 .
- the module-grounding tab 212 described with respect to FIGS. 2A-2C , is depicted contacting the side surface 124 .
- FIGS. 5A-5C illustrate a second example EMR shield 500 that may be implemented in the PCIe card 100 of FIGS. 1A-1C .
- the second EMR shield 500 includes some similar features to the EMR shield 200 described with reference to FIGS. 1A-2C .
- the EMR shield 500 may include a structure 502 .
- the structure 502 refers to the portion of the second EMR shield 500 which is configured to substantially surround and/or at least partially enclose modules, such as the modules 104 of FIGS. 1A-1C .
- the structure 502 includes an upper wall 504 ( FIGS. 5A and 5B ), a lower wall 508 , two side walls 506 A/ 506 B, and a rear wall 524 which may be configured to be positioned parallel to the surfaces (i.e., surfaces 122 , 124 , 126 , and 128 of FIGS. 1A-1C ) of the modules 104 .
- the structure 502 defines an enclosure 520 within which modules 104 are at least partially enclosed.
- the structure 502 may constitute an upper piece 526 and a lower piece 528 .
- the upper piece 526 is substantially similar to and may correspond to the upper piece 204 of the structure 202 of FIGS. 2A-2C .
- the lower piece 528 includes some dissimilar features described below.
- FIGS. 5B and 5C the upper piece 526 is shown separate from the lower piece 528 .
- FIG. 5A depicts the upper piece 526 assembled with the lower piece 528 .
- the upper piece 526 may include the upper wall 504 , the rear wall 524 , and upper portions of the side walls 530 A/ 530 B.
- the lower piece 528 may include the lower wall 508 and lower portions of the side walls 532 A/ 532 B ( 532 B not visible in FIG. 5A ).
- the upper portions of the side walls 530 A/ 530 B may engage with lower portions of the side walls 532 A/ 532 B to secure the upper piece 526 to the lower piece 528 .
- the upper piece 526 may include connectors 522 used to secure the upper piece 526 to the PCB 106 .
- the connectors 522 included on the upper piece 526 may extend from the rear wall 524 to be received in one or more of the pin openings 116 defined in the PCB 106 .
- the connectors 522 may be soldered or otherwise secured to the PCB 106 to mechanically and/or electrically couple the upper piece 526 to the PCB 106 .
- module-grounding tabs 518 A and 518 B may also extend from the structure 502 .
- the structure 502 includes a first type of module-grounding tab 518 A extending from the side walls 506 A/ 506 B.
- the first type of module-grounding tab 518 A is substantially similar to the module-grounding tabs 212 described with reference to FIGS. 2A-2C .
- a second type of module-grounding tab 518 B may extend from the lower wall 508 . Note only one of the second type of module-grounding tabs 518 B is labeled in FIGS. 5A-5C . Rather than contacting a side of a module as the first type of module-grounding tab 518 A, the second type of module-grounding tab 518 B contacts a bottom surface of a module.
- the module-grounding tabs 518 A and/or 518 B may provide a chassis ground for the modules.
- the structure 502 also includes an outer edge 516 opposite the rear wall 524 .
- the outer edge 516 is defined along the upper wall 504 , the lower wall 508 , and the two side walls 506 A/ 506 B.
- the outer edge 516 is defined along the upper piece 526 (i.e., the upper portions of the side walls 530 A/ 530 B) and not defined along the lower piece 528 (i.e., the lower portions of the side walls 532 A/ 532 B).
- Fingers 510 may extend from the outer edge 516 .
- the fingers 510 may be configured to contact a bezel around an opening. For example, with combined reference to FIGS.
- the fingers 510 may be configured to contact the bezel 102 around the opening 110 .
- the fingers 510 that extend from the upper piece 526 , that is, along a portion of the outer edge 516 defined along the upper wall 504 and the two side walls 506 A/ 506 B may be curved.
- each of the finger 510 that extends from a portion of the outer edge 516 defined along the lower wall 508 may be substantially straight.
- the fingers 510 may be substantially evenly spaced along the outer edge 516 and thus substantially evenly spaced around the opening.
- FIG. 6 illustrates a partial, sectional view of the PCIe card 100 of FIGS. 1A-1C including the second EMR shield 500 described with reference to FIGS. 5A-5C .
- the module 104 , the bezel 102 , and the PCB 106 described with reference to FIGS. 1A-1C and the second EMR shield 500 described with reference to FIGS. 5A-5C are included in FIG. 6 .
- the second EMR shield 500 is depicted mechanically coupled to the PCB 106 through the connectors 522 being received in the PCB 106 .
- the second type of module-grounding tabs 518 B is shown contacting the module 104 . Additionally, FIG.
- the modules 104 are mechanically coupled to the PCB 106 through the module pin 120 being received in the PCB 106 .
- the modules 104 are at least partially enclosed by the second EMR shield 500 .
- the upper wall 504 borders the top surface 122
- the rear wall 524 borders the rear surface 126
- the lower wall 508 borders the bottom surface 128 .
- FIG. 6 depicts an EMR source 604 .
- the second EMR shield 500 reduces EMR escaping from the opening 110 by the fingers 510 contacting the bezel 102 around the opening 110 at one or more contact areas 602 and 610 .
- the contact areas 602 and 610 substantially surround the opening 110 and thereby shield at least a portion of the EMR emitted by the EMR source 604 .
- the different shapes of the fingers 510 are clearly visible.
- the fingers 510 that extend from the upper wall 504 are curved, which may produce a first contact area 602 where the fingers 510 that are curved contact the bezel 102 .
- the fingers 510 that extend from the lower wall 508 which are substantially straight, may produce a second contact area 610 .
- the fingers 510 that are substantially straight may allow the bezel 102 to be positioned closer to the PCB 106 , for instance.
- FIG. 7 illustrates a third example EMR shield 700 that may be implemented in the PCIe card 100 of FIGS. 1A-1C .
- the third EMR shield 700 includes a structure 702 configured to substantially surround modules, such as the modules 104 of FIGS. 1A-1C .
- FIG. 7 depicts the third EMR shield 700 upside down when compared to the EMR shield 200 depicted in FIG. 2A and the second EMR shield 500 depicted in FIG. 5A .
- the structure 702 includes an upper wall 706 which may be configured to be positioned parallel to the top surface 122 , a lower wall 704 which may be configured to be positioned parallel to a bottom surface 128 , and two side walls 708 A and 708 B which may be configured to be positioned parallel to side surfaces 124 .
- the structure 702 also includes a front wall 722 .
- the upper wall 706 , the lower wall 704 , and the two side walls 708 A and 708 B may be substantially perpendicular to the front wall 722 .
- the front wall 722 may define at least one module opening 714 .
- One of the modules 104 may be positioned in each of the at least one module openings 714 .
- a vertical slat 712 may be positioned between the module openings 714 such that when modules 104 are positioned in the module openings 714 , the vertical slats 712 are positioned between adjacent modules 104 . Note that only one each of the module openings 714 and the vertical slats 712 are explicitly labeled in FIG. 7 .
- each of the upper wall 706 , the lower wall 704 , and the two side walls 708 A and 708 B include a first portion 718 and a second portion 720 .
- the first portion 718 may be configured to be positioned inside an opening, such as the opening 110 described herein.
- the second portion 720 may be configured to be positioned outside the opening.
- the first portion 718 and the second portion 720 may be connected by fingers 716 .
- the fingers 716 are substantially equivalent in structure and function to the fingers 510 and 210 described herein.
- the fingers 716 may be configured to contact a bezel at multiple contact areas (described below) substantially surrounding an opening.
- each of the fingers 716 may include a raised portion 724 configured to contact a bezel when the first portion 718 is positioned in an opening of the bezel.
- the structure 702 may also include module-grounding tabs 710 .
- the module-grounding tabs 710 may extend from the upper wall 706 .
- the module-grounding tabs 710 may contact a top surface of a module.
- the module-grounding tabs 710 may contact the top surface 122 of the modules 104 when the modules 104 are positioned in the opening 110 .
- FIG. 8 illustrates a sectional view of the PCIe card 100 of FIGS. 1A-1C including the third EMR shield 700 described with reference to FIG. 7 .
- the module 104 , the bezel 102 , and the PCB 106 described with reference to FIGS. 1A-1C and the third EMR shield 700 described with reference to FIG. 7 are included in FIG. 8 .
- the module-grounding tab 710 is shown engaging a recess 804 included in the module 104 .
- FIG. 8 depicts the modules 104 mechanically coupled to the PCB 106 through the module pins 120 being received in the PCB 106 .
- the modules 104 are substantially surrounded by the third EMR shield 700 .
- the upper wall 706 borders the top surface 122 and the lower wall 704 borders the bottom surface 128 .
- FIG. 8 further depicts an EMR source 808 which generates EMR that may escape the PCIe card 100 through the opening 110 .
- the third EMR shield 700 reduces EMR escaping from the opening 110 , by positioning the front wall 722 and/or the vertical slat 712 to block some EMR escaping from around the modules 104 . Additionally, the third EMR shield 700 reduces EMR escaping from the opening 110 by the fingers 716 contacting the bezel 102 around the opening 110 at one or more contact areas 802 . Specifically, when implementing the third EMR shield 700 , the contact areas 802 include an edge 806 of the opening 110 .
- the raised portions 724 of the fingers 716 contact the edge 806 of the opening 110 .
- the contact between the fingers 716 and the edge 806 of the opening 110 reduce the EMR escaping through the opening 110 .
Abstract
An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR from escaping a host device. The EMR shield includes a structure, two or more module-grounding tabs, and multiple fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at multiple contact areas substantially surrounding the opening.
Description
- This application claims priority to and the benefit of U.S. Provisional Patent Application Ser. No. 61/546,625, entitled “ELECTROMAGNETIC RADIATION SHIELDING AND MOUNTING FOR TRANSCEIVER MODULES ON A PCI EXPRESS CARD,” which was filed on Oct. 13, 2011, and which is incorporated herein by reference in its entirety.
- 1. Field
- Some embodiments described herein relate to electromagnetic radiation (EMR) shields for use in connection with optical transceiver modules.
- 2. Related Technology
- Electronic modules, such as electronic or optoelectronic transceiver or transponder modules, are increasingly used in electronic and optoelectronic communication. Electronic modules typically communicate with a host device by transmitting electrical signals to the host device and receiving electrical signals from the host device. These electrical signals can then be transmitted by the electronic module outside the host device as optical and/or electrical signals.
- One common difficulty associated with the operation of electronic modules is the generation of electromagnetic radiation (EMR). The generation of EMR during the operation of an electronic module is a matter of significant concern because such EMR can cause electromagnetic interference (EMI) with other systems and devices in the vicinity, which can seriously impair, if not prevent, the proper operation of those other systems and devices. Thus, the control of EMI effects is an important consideration in the design and use of electronic modules.
- The subject matter claimed herein is not limited to embodiments that solve any disadvantages or that operate only in environments such as those described above. Rather, this background is only provided to illustrate one exemplary technology area where some embodiments described herein may be practiced.
- This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or characteristics of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
- An example embodiment includes an electromagnetic radiation (EMR) shield. The EMR shield is configured to reduce EMR escaping from a host device. The EMR shield includes a structure, two or more module-grounding tabs, and a plurality of fingers. The structure is configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel. The two or more module-grounding tabs extend from the structure. Each of the module-grounding tabs is configured to contact one of the transceiver modules. The fingers extend from the structure and are configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
- Another example embodiment includes a peripheral component interconnect express (PCIe) card. The PCIe card includes a bezel, two or more adjacent transceiver modules, a printed circuit board (PCB), and an EMR shield. The bezel defines an opening. The two or more adjacent transceiver modules are positioned in the opening. The PCB is mechanically coupled to the bezel and to the transceiver modules. The EMR shield is configured to reduce EMR that escapes through the opening from a host device into which the PCIe card is received. The EMR shield includes a structure defining an enclosure configured to at least partially enclose the transceiver modules. The EMR shield further includes a plurality of fingers extending from the structure, which is configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
- Another example embodiment includes a PCIe card. The PCIe card includes a bezel, two or more adjacent transceiver modules, a PCB, and an EMR shield. The bezel defines an opening. The two or more adjacent transceiver modules are positioned in the opening. The PCB is mechanically coupled to the bezel and to the transceiver module. The EMR shield is configured to reduce EMR that escapes through the opening from a host device into which the PCIe card is received. The EMR shield includes a structure that substantially surrounds the transceiver modules. The EMR shield further includes a plurality of ridges defined in the structure. The ridges are configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
- Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The features and advantages of the invention may be realized and obtained by means of the instruments and combinations particularly pointed out in the appended claims. These and other features of the present invention will become more fully apparent from the following description and appended claims, or may be learned by the practice of the invention as set forth hereinafter.
- To further clarify certain aspects of the present invention, a more particular description of the invention will be rendered by reference to example embodiments thereof which are disclosed in the appended drawings. It is appreciated that these drawings depict only example embodiments of the invention and are therefore not to be considered limiting of its scope. Aspects of the invention will be described and explained with additional specificity and detail through the use of the accompanying drawings in which:
-
FIGS. 1A-1C are an example peripheral component interconnect express (PCIe) card; -
FIGS. 2A-2C are an example electromagnetic radiation (EMR) shield that can be implemented in the PCIe card ofFIGS. 1A-1C ; -
FIG. 3 is a partial, sectional view of the PCIe card ofFIGS. 1A-1C including the EMR shield ofFIGS. 2A-2C ; -
FIGS. 4A and 4B are an example of an alternative PCIe card; -
FIGS. 5A-5C are a second example EMR shield that may be implemented in the PCIe card ofFIGS. 1A-1C ; -
FIG. 6 is a partial sectional view of the PCIe card ofFIGS. 1A-1C including the second example EMR shield ofFIGS. 5A-5C ; -
FIG. 7 is a third example EMR shield that may be implemented in the PCIe card ofFIGS. 1A-1C ; and -
FIG. 8 is a partial, sectional view of the PCIe card ofFIGS. 1A-1C including the third example EMR shield ofFIG. 7 . - Example embodiments of the invention relate to electromagnetic radiation (EMR) shields for use in connection with optical transceiver modules, such as those employed in a peripheral component interconnect express (PCIe) card. The EMR shields disclosed herein effectively maintain EMR emitted from a host device at acceptable levels to avoid electromagnetic interference (EMI) in surrounding devices.
- Reference will now be made to the drawings to describe various aspects of example embodiments of the invention. It is to be understood that the drawings are diagrammatic and schematic representations of such example embodiments, and are not limiting of the present invention, nor are they necessarily drawn to scale.
- Reference is first made to
FIGS. 1A-1C which disclose some aspects of anexample PCIe card 100. Specifically,FIG. 1A depicts a top-perspective view of thePCIe card 100;FIG. 1B depicts a bottom-perspective view of thePCIe card 100; andFIG. 1C depicts a top exploded view of thePCIe card 100. ThePCIe card 100 represents one example operating environment in which embodiments of the invention disclosed herein may be implemented. It should be appreciated that one or more embodiments disclosed herein may be implemented in thePCIe card 100 as well as other environments. - The
PCIe card 100 may be used in transmitting and receiving optical signals in connection with a host device (not shown) into which thePCIe card 100 is received. ThePCIe card 100 includes one or more optoelectronic transceiver modules (modules) 104. ThePCIe card 100 includes fourmodules 104; however, this is not meant to be limiting. In some embodiments, thePCIe card 100 may include three orfewer modules 104 or five ormore modules 104. - The
modules 104 may be mechanically coupled to a printed circuit board (PCB) 106 included in thePCIe card 100. With specific reference toFIG. 1C , thePCB 106 may includemultiple pin openings 116. Note that only three of themultiple pin openings 116 are explicitly labeled inFIG. 1C , but thePCB 106 includes seventeenpin openings 116. The number and configuration of thepin openings 116 may vary depending on the number ofmodules 104 and the configuration of an EMR shield (described below) included in thePCIe card 100. - As best illustrated in
FIG. 1B , each of themodules 104 may include module pins 120 configured to be received by some of thepin openings 116 defined in thePCB 106. The module pins 120 may be soldered or otherwise secured to thePCB 106, thereby mechanically coupling themodules 104 to thePCB 106. Note that only one of the module pins 120 is explicitly labeled inFIG. 1B , butFIG. 1B includes eightmodule pins 120 received in some of thepin openings 116. - Referring back to all of
FIGS. 1A-1C , in addition to mechanically coupling themodules 104 to thePCB 106, themodules 104 may be in electronic communication with thePCB 106. The electrical communication between thePCB 106 and themodules 104 enables optical signals received by one or more of themodules 104 via optical fibers (not shown) that are plugged into the front of themodules 104 to be communicated via thePCB 106 to the host device. Additionally, electrical signals originating at the host device may be communicated via thePCB 106 to one or more of themodules 104. Themodules 104 may transduce the electrical signals to optical signals and transmit the optical signals via optical fibers (not shown) that are plugged into the front of themodules 104. - Each of the
modules 104 may be configured for optical signal transmission and reception at a variety of per-second data rates including, but not limited to, 1 gigabit (G), 2 G, 2.5 G, 4 G, 8 G, 10 G, 10.7 G, or higher. Themodules 104 may also be configured for optical signal transmission and reception at one or more wavelengths including, but not limited to, 850 nanometers (nm), 1310 nm, 1470 nm, 1490 nm, 1510 nm, 1530 nm, 1550 nm, 1570 nm, 1590 nm, or 1610 nm. Further, themodules 104 may be configured to support various transmission standards including, but not limited to, Optical Fast Ethernet, Optical G Ethernet, 10 G Ethernet, 40 G Ethernet, 100 G Ethernet, 1x, 2x, 4x, 8x, 10x, and 16x Fibre Channel, SONET OC-3, OC-12, OC-48, OC-192, OC-768, 10 Gigabit Fibre Channel, 10 G Ethernet, 100 BASE-T, and PON. Further, themodules 104 can be configured to operate properly with a case temperature range of −40° C. to 85° C. In addition, in some embodiments, themodules 104 may have a form factor that is substantially compliant with any of a variety of public standards such as the SFP+MSA, the SFF MSA, the SFP MSA, the CFP MSA, or the CXP MSA, or any proprietary standard. However, themodules 104 are not necessarily compliant with a standard and may be customized for a particular application. Each of themodules 104 depicted inFIGS. 1A-1C include an LC transmit port and an LC receive port configured to send and receive optical signals over optical fibers (not shown) that are plugged into the front of themodules 104. - The
modules 104 may include a top surface 122 (FIGS. 1A and 1C ), a bottom surface 128 (FIG. 1B ), a rear surface 126 (FIG. 1C ), and two side surfaces 124. One of the side surfaces 124 is visible inFIGS. 1A and 1C and a second of the side surfaces 124 is visible inFIG. 1B . Themodules 104 are positioned adjacent to one another in anopening 110 defined in abezel 102. Thebezel 102 generally frames themodules 104 and may enable thePCIe card 100 to be mounted within the host device. For example, aPCIe card tab 114 may engage a corresponding structure in the host device to secure thePCIe card 100 to the host device. - The
bezel 102 may also be mechanically coupled to thePCB 106. With specific reference toFIGS. 1B and 1C , thebezel 102 may include abezel connector 112 defining an opening that corresponds to bezel receiving opening 118 (FIG. 1C ) defined in thePCB 106. A fastener (not shown) or an equivalent mechanism may be implemented to mechanically couple thebezel 102 to thePCB 106. In some embodiments, thebezel connector 112 may also electrically ground thebezel 102 to thePCB 106. - The opening 110 (best illustrated in
FIG. 1C ) defined in thebezel 102 is substantially rectangular to correspond to themodules 104 positioned therein. However, theopening 110 may not be precisely sized to fit themodules 104. Thus, during operation ofPCIe card 100 and/or the host device, EMR may escape from thebezel 102 through theopening 110. For example, EMR from components (not shown) located on thePCB 106 may escape from the host device through theopening 110 by radiating above, beneath, to the side of, and/or between theadjacent modules 104. The EMR may cause EMI, which may cause problems in other electronic systems in the vicinity of thePCIe card 100. - To reduce the EMR escaping from the host device through the
opening 110, thePCIe card 100 may include an EMR shield 200 (FIGS. 1A and 1C ). TheEMR shield 200 may be composed of electrically-conductive material to shield against some of the EMR produced in the host device. Additionally, theEMR shield 200 may substantially surround and/or at least partially enclose themodules 104 positioned in theopening 110 and contact thebezel 102 at contact areas that surround theopening 110. TheEMR shield 200 may therefore fill some of the gaps between themodules 104 and between thebezel 102 and/or fill the gaps between themodules 104 to block EMR from escaping through theopening 110. Additionally, the contact between theEMR shield 200 and thebezel 102 may ground theEMR shield 200 to further reduce EMR escaping from the host devices. -
FIGS. 2A-2C illustrate some additional details of theEMR shield 200. TheEMR shield 200 includes astructure 202. Thestructure 202 refers to the portion of theEMR shield 200 which is configured to substantially surround and/or at least partially enclose modules such as themodules 104 ofFIGS. 1A-1C . - Specifically, with combined reference to
FIGS. 1A-1C and 2A-2C, thestructure 202 includes an upper wall 218 (FIGS. 2A-2B ), alower wall 222, twoside walls 220A/220B, and arear wall 224. Each of theupper wall 218, thelower wall 222, and the twoside walls 220A/220B are configured to be positioned parallel to one of the surfaces (i.e.,surface modules 104. For example, theupper wall 218 may be configured to be positioned parallel to thetop surface 122 of themodules 104. Thelower wall 222 may be configured to be positioned parallel to thebottom surface 128 of themodules 104. The twoside walls 220A/220B may be configured to be positioned parallel toside surfaces 124 of themodules 104. Therear wall 224 may be configured to be positioned parallel to arear surface 126 of themodule 104. Thus, thestructure 202 defines anenclosure 216 within which themodules 104 are at least partially enclosed. - As used herein with reference to the
structure 202 and other structures described elsewhere herein, the term “surrounds” refers to a relationship between themodules 104 and theupper wall 218, thelower wall 222, and the twoside walls 220A/220B. That is, theupper wall 218, thelower wall 222, and the twoside walls 220A/220B create a band that borders and/or otherwise contacts themodules 104 along thetop surface 122, thebottom surface 128, and the twoside surfaces 124 without bordering or otherwise contacting the front of themodules 104 or arear surface 126 of themodules 104. In contrast, as used herein with reference to thestructure 202 and other structures described elsewhere herein, the term “enclosed” refers to a relationship between theenclosure 216 and themodules 104. That is, theenclosure 216 borders and/or otherwise contacts themodules 104 on thetop surface 122, thebottom surface 128, therear surface 126, and the two side surfaces 124. - The
structure 202 may be generally constructed from anupper piece 204 and alower piece 206. InFIGS. 2B and 2C , theupper piece 204 is shown separate from thelower piece 206. InFIG. 2A , theupper piece 204 is shown assembled with thelower piece 206. Theupper piece 204 may include theupper wall 218, therear wall 224, and upper portions of theside walls 228A/228B. Thelower piece 206 may include thelower wall 222 and lower portions of theside walls 226A/226B. The upper portions of theside walls 228A/228B may engage with the lower portions of theside walls 226A/226B to secure theupper piece 204 to thelower piece 206. - With combined reference to
FIGS. 1B , 1C, and 2C, theEMR shield 200 may be mechanically coupled to thePCB 106. In some embodiments, thelower piece 206 may be positioned and/or secured between themodules 104 and thePCB 106 when assembled in thePCIe card 100. Theupper piece 204 can then be positioned onto themodules 104 and secured to thelower piece 206. In these and other embodiments, thelower piece 206 may includeconnectors 230 and/or the upper piece may includeconnectors 232. Theconnectors upper piece 204 and/or thelower piece 206 to thePCB 106. Theconnectors 232 included on theupper piece 204 may extend from therear wall 224 to be received in one or more of thepin openings 116 defined in thePCB 106. Theconnectors 230 extend from thelower piece 206 and may be received in one or more of thepin openings 116 defined in thePCB 106. Theconnectors PCB 106 to mechanically and/or electrically couple theEMR shield 200 to thePCB 106. - Referring back to
FIGS. 2A-2C , module-groundingtabs 212 may also extend from thestructure 202. Specifically, in the depicted embodiment, thestructure 202 includes two module-groundingtabs 212. One of the module-groundingtabs 212 is visible inFIGS. 2A and 2B and a second module-grounding tab 212 is visible inFIG. 2C . The module-groundingtabs 212 extend from theside walls 220A/220B to contact modules, such as one of themodules 104 ofFIGS. 1A-1C , positioned in thestructure 202. The module-groundingtabs 212 may provide a chassis ground for the modules. For example, an electric ground may be transferred from a shell of amodule 104 to thestructure 202, via the module-groundingtabs 212, and then to one or more of theconnectors 230 and/or 232. - The
structure 202 also includes anouter edge 208. The outer edge may include an edge of thestructure 202 opposite therear wall 224. Theouter edge 208 may be defined along theupper wall 218, thelower wall 222, and the twoside walls 220A/220B. In the depicted embodiment, along theside walls 220A/220B, theouter edge 208 is defined along the upper piece 204 (i.e., the upper portions of theside walls 228A/228B), and theouter edge 208 may not be defined along the lower piece 206 (i.e., the lower portions of theside walls 226A/226B).Fingers 210 may extend from theouter edge 208. Thefingers 210 may be configured to contact a bezel around an opening. For example, with combined reference to FIGS. 1C and 2A-2C, thefingers 210 may be configured to contact thebezel 102 around theopening 110. Thefingers 210 that extend from theupper piece 204, that is, along a portion of theouter edge 208 defined along theupper wall 218 and the twoside walls 220A/220B, may be curved. Thefingers 210 that extend from thelower piece 206, that is, along a portion of theouter edge 208 defined along thelower wall 222, may additionally be curved. - In this and other embodiments, the
fingers 210 may be substantially evenly spaced along theouter edge 208 and thus substantially evenly spaced around an opening contacted by thefingers 210. However, this is not meant to be limiting. In alternative embodiments, thefingers 210 may be unevenly spaced along theouter edge 208 and thus unevenly spaced around an opening contacted by thefingers 210. - Referring back to
FIGS. 2A-2C , in this and other embodiments, theEMR shield 200 includes abezel coupling structure 214 extending substantially perpendicular from therear wall 224. Thebezel coupling structure 214 may define an opening configured to receive a fastener (not shown) to secure a bezel, such as thebezel 102 ofFIGS. 1A-1C , to theEMR shield 200. Some additional details of thebezel coupling structure 214 are provided with reference toFIGS. 4A and 4B . -
FIG. 3 illustrates a partial, sectional view of thePCIe card 100 ofFIGS. 1A-1C including theEMR shield 200 described with reference toFIGS. 1A-2C . Themodule 104, thebezel 102, and thePCB 106 described with reference toFIGS. 1A-1C and theEMR shield 200 described with reference toFIGS. 1A-2C are included inFIG. 3 . TheEMR shield 200 is depicted mechanically coupled to thePCB 106 thoughconnectors PCB 106. Additionally,FIG. 3 depicts themodules 104 mechanically coupled to thePCB 106 through themodule pin 120 received in thePCB 106. In this configuration, themodules 104 are at least partially enclosed by theEMR shield 200. Specifically, theupper wall 218 borders thetop surface 122, therear wall 224 borders therear surface 126, and thelower wall 222 borders thebottom surface 128. - Additionally,
FIG. 3 depicts anEMR source 304, which may be electronic components (not shown) on thePCB 106 or other electronic components within a host device (not shown) from which EMR may be emitted. TheEMR shield 200 reduces EMR escaping from theopening 110 by thefingers 210 contacting thebezel 102 around theopening 110 at one ormore contact areas 302. Thecontact areas 302 substantially surround theopening 110 and thereby shield at least a portion of the EMR emitted by theEMR source 304. -
FIGS. 4A and 4B illustrate an example of analternative PCIe card 100A. Thealternative PCIe card 100A is substantially similar to thePCIe card 100 described with reference toFIGS. 1A-1C . However, thealternative PCIe card 100A includes analternative bezel 102A. Thealternative bezel 102A is substantially similar to thebezel 102 described with reference toFIGS. 1A-1C other than thealternative bezel 102A may include an EMRshield coupling structure 404 and afastener 402. The EMRshield coupling structure 404 and thefastener 402 are configured to mechanically couple thealternative bezel 102A to theEMR shield 200. - As depicted in
FIG. 4B , the EMRshield coupling structure 404 extends over thebezel coupling structure 214, described above with reference toFIGS. 2A-2C . The EMRshield coupling structure 404 is secured to thebezel coupling structure 214 using thefastener 402. - Additionally, as depicted in
FIG. 4B , thefingers 210 extending from theEMR shield 200 contact thealternative bezel 102A. Thefingers 210 are substantially evenly spaced around theopening 110. TheEMR shield 200 is also shown mechanically coupled to thePCB 106 by theconnectors PCB 106. The modules 104 (visible inFIG. 4A ) are shown mechanically coupled toPCB 106 by the module pins 120 being received in thePCB 106. Additionally, the module-grounding tab 212, described with respect toFIGS. 2A-2C , is depicted contacting theside surface 124. -
FIGS. 5A-5C illustrate a secondexample EMR shield 500 that may be implemented in thePCIe card 100 ofFIGS. 1A-1C . Thesecond EMR shield 500 includes some similar features to theEMR shield 200 described with reference toFIGS. 1A-2C . - The
EMR shield 500 may include astructure 502. Thestructure 502 refers to the portion of thesecond EMR shield 500 which is configured to substantially surround and/or at least partially enclose modules, such as themodules 104 ofFIGS. 1A-1C . Likestructure 202 described with reference toFIGS. 2A-2C , thestructure 502 includes an upper wall 504 (FIGS. 5A and 5B ), alower wall 508, twoside walls 506A/506B, and arear wall 524 which may be configured to be positioned parallel to the surfaces (i.e., surfaces 122, 124, 126, and 128 ofFIGS. 1A-1C ) of themodules 104. Thus, thestructure 502 defines anenclosure 520 within whichmodules 104 are at least partially enclosed. - The
structure 502 may constitute anupper piece 526 and alower piece 528. Theupper piece 526 is substantially similar to and may correspond to theupper piece 204 of thestructure 202 ofFIGS. 2A-2C . Thelower piece 528, however, includes some dissimilar features described below. - In
FIGS. 5B and 5C , theupper piece 526 is shown separate from thelower piece 528.FIG. 5A depicts theupper piece 526 assembled with thelower piece 528. Theupper piece 526 may include theupper wall 504, therear wall 524, and upper portions of theside walls 530A/530B. Thelower piece 528 may include thelower wall 508 and lower portions of theside walls 532A/532B (532B not visible inFIG. 5A ). The upper portions of theside walls 530A/530B may engage with lower portions of theside walls 532A/532B to secure theupper piece 526 to thelower piece 528. - With combined reference to FIGS. 1C and 5A-5C, in these and other embodiments, the
upper piece 526 may includeconnectors 522 used to secure theupper piece 526 to thePCB 106. Theconnectors 522 included on theupper piece 526 may extend from therear wall 524 to be received in one or more of thepin openings 116 defined in thePCB 106. Theconnectors 522 may be soldered or otherwise secured to thePCB 106 to mechanically and/or electrically couple theupper piece 526 to thePCB 106. - Referring back to
FIGS. 5A-5C , module-grounding tabs structure 502. Specifically, in the depicted embodiment, thestructure 502 includes a first type of module-grounding tab 518A extending from theside walls 506A/506B. The first type of module-grounding tab 518A is substantially similar to the module-groundingtabs 212 described with reference toFIGS. 2A-2C . - A second type of module-
grounding tab 518B may extend from thelower wall 508. Note only one of the second type of module-groundingtabs 518B is labeled inFIGS. 5A-5C . Rather than contacting a side of a module as the first type of module-grounding tab 518A, the second type of module-grounding tab 518B contacts a bottom surface of a module. The module-grounding tabs 518A and/or 518B may provide a chassis ground for the modules. - The
structure 502 also includes anouter edge 516 opposite therear wall 524. Theouter edge 516 is defined along theupper wall 504, thelower wall 508, and the twoside walls 506A/506B. In the depicted embodiment, along theside walls 506A/506B, theouter edge 516 is defined along the upper piece 526 (i.e., the upper portions of theside walls 530A/530B) and not defined along the lower piece 528 (i.e., the lower portions of theside walls 532A/532B).Fingers 510 may extend from theouter edge 516. Thefingers 510 may be configured to contact a bezel around an opening. For example, with combined reference to FIGS. 1C and 5A-5C, thefingers 510 may be configured to contact thebezel 102 around theopening 110. Thefingers 510 that extend from theupper piece 526, that is, along a portion of theouter edge 516 defined along theupper wall 504 and the twoside walls 506A/506B may be curved. However, each of thefinger 510 that extends from a portion of theouter edge 516 defined along thelower wall 508 may be substantially straight. Thefingers 510 may be substantially evenly spaced along theouter edge 516 and thus substantially evenly spaced around the opening. -
FIG. 6 illustrates a partial, sectional view of thePCIe card 100 ofFIGS. 1A-1C including thesecond EMR shield 500 described with reference toFIGS. 5A-5C . Themodule 104, thebezel 102, and thePCB 106 described with reference toFIGS. 1A-1C and thesecond EMR shield 500 described with reference toFIGS. 5A-5C are included inFIG. 6 . Thesecond EMR shield 500 is depicted mechanically coupled to thePCB 106 through theconnectors 522 being received in thePCB 106. The second type of module-groundingtabs 518B is shown contacting themodule 104. Additionally,FIG. 6 depicts themodules 104 mechanically coupled to thePCB 106 through themodule pin 120 being received in thePCB 106. In this configuration, themodules 104 are at least partially enclosed by thesecond EMR shield 500. Specifically, theupper wall 504 borders thetop surface 122, therear wall 524 borders therear surface 126, and thelower wall 508 borders thebottom surface 128. - Additionally,
FIG. 6 depicts anEMR source 604. Thesecond EMR shield 500 reduces EMR escaping from theopening 110 by thefingers 510 contacting thebezel 102 around theopening 110 at one ormore contact areas contact areas opening 110 and thereby shield at least a portion of the EMR emitted by theEMR source 604. - In the sectional view, the different shapes of the
fingers 510 are clearly visible. Thefingers 510 that extend from theupper wall 504 are curved, which may produce afirst contact area 602 where thefingers 510 that are curved contact thebezel 102. Additionally, thefingers 510 that extend from thelower wall 508, which are substantially straight, may produce asecond contact area 610. Thefingers 510 that are substantially straight may allow thebezel 102 to be positioned closer to thePCB 106, for instance. -
FIG. 7 illustrates a thirdexample EMR shield 700 that may be implemented in thePCIe card 100 ofFIGS. 1A-1C . Thethird EMR shield 700 includes astructure 702 configured to substantially surround modules, such as themodules 104 ofFIGS. 1A-1C .FIG. 7 depicts thethird EMR shield 700 upside down when compared to theEMR shield 200 depicted inFIG. 2A and thesecond EMR shield 500 depicted inFIG. 5A . - With combined reference to
FIGS. 1A-1C and 7, thestructure 702 includes anupper wall 706 which may be configured to be positioned parallel to thetop surface 122, alower wall 704 which may be configured to be positioned parallel to abottom surface 128, and twoside walls structure 702 also includes afront wall 722. Theupper wall 706, thelower wall 704, and the twoside walls front wall 722. Thefront wall 722 may define at least onemodule opening 714. One of themodules 104 may be positioned in each of the at least onemodule openings 714. Avertical slat 712 may be positioned between themodule openings 714 such that whenmodules 104 are positioned in themodule openings 714, thevertical slats 712 are positioned betweenadjacent modules 104. Note that only one each of themodule openings 714 and thevertical slats 712 are explicitly labeled inFIG. 7 . - Referring back to
FIG. 7 , each of theupper wall 706, thelower wall 704, and the twoside walls first portion 718 and asecond portion 720. Thefirst portion 718 may be configured to be positioned inside an opening, such as theopening 110 described herein. Thesecond portion 720 may be configured to be positioned outside the opening. Thefirst portion 718 and thesecond portion 720 may be connected byfingers 716. Thefingers 716 are substantially equivalent in structure and function to thefingers fingers 716 may be configured to contact a bezel at multiple contact areas (described below) substantially surrounding an opening. However, rather than extending from thestructure 702 as thefingers fingers 716 are formed integrally to thestructure 702 as ridges. Specifically, each of thefingers 716 may include a raisedportion 724 configured to contact a bezel when thefirst portion 718 is positioned in an opening of the bezel. - The
structure 702 may also include module-groundingtabs 710. The module-groundingtabs 710 may extend from theupper wall 706. The module-groundingtabs 710 may contact a top surface of a module. For example, with combined reference toFIGS. 1C and 7 , the module-groundingtabs 710 may contact thetop surface 122 of themodules 104 when themodules 104 are positioned in theopening 110. -
FIG. 8 illustrates a sectional view of thePCIe card 100 ofFIGS. 1A-1C including thethird EMR shield 700 described with reference toFIG. 7 . Themodule 104, thebezel 102, and thePCB 106 described with reference toFIGS. 1A-1C and thethird EMR shield 700 described with reference toFIG. 7 are included inFIG. 8 . The module-grounding tab 710 is shown engaging arecess 804 included in themodule 104. Additionally,FIG. 8 depicts themodules 104 mechanically coupled to thePCB 106 through the module pins 120 being received in thePCB 106. In this configuration, themodules 104 are substantially surrounded by thethird EMR shield 700. Specifically, theupper wall 706 borders thetop surface 122 and thelower wall 704 borders thebottom surface 128. -
FIG. 8 further depicts anEMR source 808 which generates EMR that may escape thePCIe card 100 through theopening 110. Thethird EMR shield 700 reduces EMR escaping from theopening 110, by positioning thefront wall 722 and/or thevertical slat 712 to block some EMR escaping from around themodules 104. Additionally, thethird EMR shield 700 reduces EMR escaping from theopening 110 by thefingers 716 contacting thebezel 102 around theopening 110 at one ormore contact areas 802. Specifically, when implementing thethird EMR shield 700, thecontact areas 802 include anedge 806 of theopening 110. For example, when thefirst portion 718 of thethird EMR shield 700 is positioned in theopening 110 and thesecond portion 720 is positioned outside theopening 110, the raisedportions 724 of thefingers 716 contact theedge 806 of theopening 110. The contact between thefingers 716 and theedge 806 of theopening 110 reduce the EMR escaping through theopening 110. - The present invention may be embodied in other specific forms. The described embodiments are to be considered in all respects only as illustrative and not restrictive. The scope of the invention is, therefore, indicated by the appended claims rather than by the foregoing description. All changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (20)
1. An electromagnetic radiation (EMR) shield configured to reduce EMR from escaping a host device, the EMR shield comprising:
a structure configured to substantially surround two or more adjacent transceiver modules positioned in an opening defined in a bezel;
two or more module-grounding tabs extending from the structure and each configured to contact one of the transceiver modules; and
a plurality of fingers extending from the structure and configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
2. The EMR shield of claim 1 , wherein the structure comprises an upper wall configured to be positioned parallel to a top surface of the transceiver modules, a lower wall configured to be positioned parallel to a bottom surface of the transceiver modules, and two side walls configured to be positioned parallel to side surfaces of the transceiver modules.
3. The EMR shield of claim 2 , wherein the structure further comprises a rear wall configured to be positioned parallel to a rear surface of the transceiver module.
4. The EMR shield of claim 3 , wherein the structure comprises an outer edge opposite the rear wall and defined along the upper wall, the lower wall, and the two side walls, and the fingers extend from the outer edge.
5. The EMR shield of claim 4 , wherein each finger that extends from a portion of the outer edge defined along the upper wall and the two side walls is curved.
6. The EMR shield of claim 5 , wherein each finger that extends from a portion of the outer edge defined along the lower wall is substantially straight.
7. The EMR shield of claim 6 , wherein the rear wall comprises one or more connectors configured to be coupled to a printed circuit board (PCB) and the lower wall comprises one or more connectors configured to be coupled to the PCB.
8. The EMR shield of claim 1 , wherein the structure comprises a first portion configured to be positioned inside the opening and a second portion configured to be positioned outside the opening, the first portion and the second portion being connected by the fingers, each finger configured to contact an edge of the opening.
9. The EMR shield of claim 1 , wherein the structure further comprises one or more vertical slats each configured to be positioned between adjacent transceiver modules of the transceiver modules.
10. A peripheral component interconnect express (PCIe) card comprising the EMR shield of claim 1 .
11. A peripheral component interconnect express (PCIe) card comprising:
a bezel defining an opening;
two or more adjacent transceiver modules positioned in the opening;
a printed circuit board (PCB) mechanically coupled to the bezel and to the transceiver modules; and
an electromagnetic radiation (EMR) shield configured to reduce EMR that escapes through the opening from a host device into which the PCIe card is received, the EMR shield including a structure defining an enclosure configured to at least partially enclose the transceiver modules, the EMR shield further including a plurality of fingers extending from the structure and configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
12. The PCIe card of claim 11 , wherein:
the structure comprises an upper piece configured to at least partially enclose a top surface of the transceiver modules, a rear surface of the transceiver modules, and two side surfaces of the transceiver modules;
the upper piece includes an outer edge; and
each of the fingers that extends from the outer edge of the upper piece is curved.
13. The PCIe card of claim 12 , wherein the upper piece comprises one or more upper piece connectors configured to be coupled to the PCB.
14. The PCIe card of claim 12 , wherein:
the structure comprises a lower piece positioned between the transceiver modules and the PCB;
the lower piece including an outer edge;
each of the fingers that extends from the outer edge of the lower piece is substantially straight.
15. The PCIe card of claim 12 , wherein:
the structure comprises a lower piece positioned between the transceiver modules and the PCB;
the lower piece including an outer edge;
each of the fingers that extends from the outer edge of the lower piece is curved.
16. The PCIe card of claim 11 , wherein the plurality of fingers is substantially evenly spaced around the opening.
17. The PCIe card of claim 11 , wherein the structure substantially surrounds the transceiver modules.
18. A peripheral component interconnect express (PCIe) card comprising:
a bezel defining an opening;
two or more adjacent transceiver modules positioned in the opening;
a printed circuit board (PCB) mechanically coupled to the bezel and to the transceiver module; and
an electromagnetic radiation (EMR) shield configured to reduce EMR that escapes through the opening from a host device into which the PCIe card is received, the EMR shield including a structure substantially surrounding the transceiver modules, the EMR shield further including a plurality of ridges defined in the structure, the plurality of ridges configured to contact the bezel at a plurality of contact areas substantially surrounding the opening.
19. The PCIe card of claim 18 , wherein:
the structure comprises a front wall defining two or more module openings in each of which one of the transceiver modules is positioned, an upper wall, a lower wall, and two side walls;
the upper wall, the lower wall, and the two side walls are substantially perpendicular to the front wall;
each of the upper wall, the lower wall, and the two side walls includes two or more of the ridges; and
each ridge includes a raised portion configured to contact an edge of the opening.
20. The PCI card of claim 18 , wherein the ridges are substantially evenly spaced around the opening.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/651,245 US20130094153A1 (en) | 2011-10-13 | 2012-10-12 | Electromagnetic radiation shielding on a pci express card |
US15/925,620 US10488894B2 (en) | 2011-10-13 | 2018-03-19 | Electromagnetic radiation shielding on a PCI express card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161546625P | 2011-10-13 | 2011-10-13 | |
US13/651,245 US20130094153A1 (en) | 2011-10-13 | 2012-10-12 | Electromagnetic radiation shielding on a pci express card |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/925,620 Continuation US10488894B2 (en) | 2011-10-13 | 2018-03-19 | Electromagnetic radiation shielding on a PCI express card |
Publications (1)
Publication Number | Publication Date |
---|---|
US20130094153A1 true US20130094153A1 (en) | 2013-04-18 |
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ID=48085833
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US13/651,245 Abandoned US20130094153A1 (en) | 2011-10-13 | 2012-10-12 | Electromagnetic radiation shielding on a pci express card |
US15/925,620 Active US10488894B2 (en) | 2011-10-13 | 2018-03-19 | Electromagnetic radiation shielding on a PCI express card |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US15/925,620 Active US10488894B2 (en) | 2011-10-13 | 2018-03-19 | Electromagnetic radiation shielding on a PCI express card |
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US (2) | US20130094153A1 (en) |
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WO2018170127A1 (en) * | 2017-03-15 | 2018-09-20 | Pulse Electronics, Inc. | Integrated connector apparatus for pcie applications |
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Also Published As
Publication number | Publication date |
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US10488894B2 (en) | 2019-11-26 |
US20190101962A1 (en) | 2019-04-04 |
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Owner name: FINISAR CORPORATION, CALIFORNIA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TEO, TAT MING;TOGAMI, CHRIS KIYOSHI;SIGNING DATES FROM 20121010 TO 20121011;REEL/FRAME:029123/0840 |
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |
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Owner name: II-VI DELAWARE, INC., DELAWARE Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:FINISAR CORPORATION;REEL/FRAME:052286/0001 Effective date: 20190924 |