CN100405559C - 基板的蚀刻处理方法及蚀刻处理装置 - Google Patents
基板的蚀刻处理方法及蚀刻处理装置 Download PDFInfo
- Publication number
- CN100405559C CN100405559C CNB2004100473783A CN200410047378A CN100405559C CN 100405559 C CN100405559 C CN 100405559C CN B2004100473783 A CNB2004100473783 A CN B2004100473783A CN 200410047378 A CN200410047378 A CN 200410047378A CN 100405559 C CN100405559 C CN 100405559C
- Authority
- CN
- China
- Prior art keywords
- substrate
- etching solution
- etching
- treatment trough
- aforementioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
Abstract
Description
Claims (8)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003157433A JP4156975B2 (ja) | 2003-06-03 | 2003-06-03 | 基板処理装置 |
JP2003157434 | 2003-06-03 | ||
JP2003157434 | 2003-06-03 | ||
JP2003157433 | 2003-06-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1574251A CN1574251A (zh) | 2005-02-02 |
CN100405559C true CN100405559C (zh) | 2008-07-23 |
Family
ID=34525346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100473783A Expired - Fee Related CN100405559C (zh) | 2003-06-03 | 2004-06-03 | 基板的蚀刻处理方法及蚀刻处理装置 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100699336B1 (zh) |
CN (1) | CN100405559C (zh) |
TW (1) | TWI243407B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100576973C (zh) * | 2005-07-11 | 2009-12-30 | 索尼化学&信息部件株式会社 | 蚀刻装置及蚀刻方法 |
JP4557872B2 (ja) * | 2005-11-28 | 2010-10-06 | 株式会社日立ハイテクノロジーズ | 基板処理装置、基板処理方法、及び基板の製造方法 |
JP4593536B2 (ja) * | 2006-08-23 | 2010-12-08 | 大日本スクリーン製造株式会社 | 姿勢変換装置および基板搬送装置 |
KR100860294B1 (ko) * | 2008-01-09 | 2008-09-25 | 주식회사 이코니 | 유리기판 에칭 장치와 상기 에칭 장치에 의하여 제조된유리박판 |
KR101279376B1 (ko) | 2011-07-20 | 2013-07-24 | 주식회사 디엠에스 | 기판처리장치 |
CN103021905B (zh) | 2011-07-20 | 2016-12-21 | 显示器生产服务株式会社 | 基板处理装置 |
CN103187337A (zh) * | 2011-12-29 | 2013-07-03 | 均豪精密工业股份有限公司 | 基板表面处理装置及其方法 |
CN105225982B (zh) * | 2014-05-30 | 2020-07-28 | 盛美半导体设备(上海)有限公司 | 一种半导体加工装置和加工半导体工件的工艺方法 |
CN105140167A (zh) | 2015-07-28 | 2015-12-09 | 合肥鑫晟光电科技有限公司 | 承载装置、湿法刻蚀设备及其使用方法 |
CN105578774A (zh) * | 2015-12-25 | 2016-05-11 | 惠州中京电子科技有限公司 | 一种pcb板阴阳铜厚的制作方法 |
JP6789721B2 (ja) * | 2016-08-12 | 2020-11-25 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
CN108203247A (zh) * | 2018-03-13 | 2018-06-26 | 凌卫平 | 多角度自动蚀刻机 |
CN109680278A (zh) * | 2019-02-26 | 2019-04-26 | 合肥永淇智材科技有限公司 | 一种fmm金属薄板的竖直式蚀刻装置及其蚀刻方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719767B2 (ja) * | 1986-05-08 | 1995-03-06 | 大日本スクリ−ン製造株式会社 | 表面処理装置 |
JP2000031112A (ja) * | 1998-07-16 | 2000-01-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000138200A (ja) * | 1998-10-29 | 2000-05-16 | Shibaura Mechatronics Corp | 基板の処理方法及びその装置 |
JP2001102283A (ja) * | 1999-09-28 | 2001-04-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2004
- 2004-06-01 TW TW093115595A patent/TWI243407B/zh not_active IP Right Cessation
- 2004-06-01 KR KR1020040039541A patent/KR100699336B1/ko not_active IP Right Cessation
- 2004-06-03 CN CNB2004100473783A patent/CN100405559C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0719767B2 (ja) * | 1986-05-08 | 1995-03-06 | 大日本スクリ−ン製造株式会社 | 表面処理装置 |
JP2000031112A (ja) * | 1998-07-16 | 2000-01-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2000138200A (ja) * | 1998-10-29 | 2000-05-16 | Shibaura Mechatronics Corp | 基板の処理方法及びその装置 |
JP2001102283A (ja) * | 1999-09-28 | 2001-04-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100699336B1 (ko) | 2007-03-26 |
TWI243407B (en) | 2005-11-11 |
TW200501231A (en) | 2005-01-01 |
KR20040104405A (ko) | 2004-12-10 |
CN1574251A (zh) | 2005-02-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: SCREEN GROUP CO., LTD. Free format text: FORMER NAME: DAINIPPON SCREEN MFG. CO., LTD. Owner name: DAINIPPON SCREEN MFG. CO., LTD. Free format text: FORMER NAME: DAINIPPON MESH PLATE MFR. CO., LTD. |
|
CP01 | Change in the name or title of a patent holder |
Address after: Kyoto Japan Patentee after: Skilling Group Address before: Kyoto Japan Patentee before: DAINIPPON SCREEN MFG Co.,Ltd. Address after: Kyoto Japan Patentee after: DAINIPPON SCREEN MFG Co.,Ltd. Address before: Kyoto Japan Patentee before: Dainippon Screen Mfg. Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080723 Termination date: 20170603 |