CN100401353C - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN100401353C CN100401353C CNB2005100091548A CN200510009154A CN100401353C CN 100401353 C CN100401353 C CN 100401353C CN B2005100091548 A CNB2005100091548 A CN B2005100091548A CN 200510009154 A CN200510009154 A CN 200510009154A CN 100401353 C CN100401353 C CN 100401353C
- Authority
- CN
- China
- Prior art keywords
- voltage
- circuit
- bipolar transistor
- power supply
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 56
- 238000007667 floating Methods 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims abstract description 22
- 238000009792 diffusion process Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 5
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23L—FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT; PRESERVATION OF FOODS OR FOODSTUFFS, IN GENERAL
- A23L13/00—Meat products; Meat meal; Preparation or treatment thereof
- A23L13/60—Comminuted or emulsified meat products, e.g. sausages; Reformed meat from comminuted meat product
- A23L13/67—Reformed meat products other than sausages
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23P—SHAPING OR WORKING OF FOODSTUFFS, NOT FULLY COVERED BY A SINGLE OTHER SUBCLASS
- A23P30/00—Shaping or working of foodstuffs characterised by the process or apparatus
- A23P30/20—Extruding
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05F—SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES
- G05F3/00—Non-retroactive systems for regulating electric variables by using an uncontrolled element, or an uncontrolled combination of elements, such element or such combination having self-regulating properties
- G05F3/02—Regulating voltage or current
- G05F3/08—Regulating voltage or current wherein the variable is dc
- G05F3/10—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics
- G05F3/16—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics being semiconductor devices
- G05F3/20—Regulating voltage or current wherein the variable is dc using uncontrolled devices with non-linear characteristics being semiconductor devices using diode- transistor combinations
- G05F3/30—Regulators using the difference between the base-emitter voltages of two bipolar transistors operating at different current densities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0635—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with bipolar transistors and diodes, or resistors, or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0684—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
- H01L29/0692—Surface layout
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
- A23V2002/00—Food compositions, function of food ingredients or processes for food or foodstuffs
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
- A23V2300/00—Processes
- A23V2300/16—Extrusion
-
- A—HUMAN NECESSITIES
- A23—FOODS OR FOODSTUFFS; TREATMENT THEREOF, NOT COVERED BY OTHER CLASSES
- A23V—INDEXING SCHEME RELATING TO FOODS, FOODSTUFFS OR NON-ALCOHOLIC BEVERAGES AND LACTIC OR PROPIONIC ACID BACTERIA USED IN FOODSTUFFS OR FOOD PREPARATION
- A23V2300/00—Processes
- A23V2300/24—Heat, thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Food Science & Technology (AREA)
- Nonlinear Science (AREA)
- Automation & Control Theory (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Radar, Positioning & Navigation (AREA)
- Electromagnetism (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Nutrition Science (AREA)
- Health & Medical Sciences (AREA)
- Semiconductor Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
- Bipolar Transistors (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004027419 | 2004-02-04 | ||
JP2004027419 | 2004-02-04 | ||
JP2005001038A JP4242353B2 (ja) | 2004-02-04 | 2005-01-06 | 半導体装置 |
JP2005001038 | 2005-01-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1652179A CN1652179A (zh) | 2005-08-10 |
CN100401353C true CN100401353C (zh) | 2008-07-09 |
Family
ID=34680680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100091548A Expired - Fee Related CN100401353C (zh) | 2004-02-04 | 2005-02-04 | 半导体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7129779B2 (zh) |
EP (1) | EP1562166A2 (zh) |
JP (1) | JP4242353B2 (zh) |
KR (1) | KR20060041675A (zh) |
CN (1) | CN100401353C (zh) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060064071A1 (en) * | 2001-11-06 | 2006-03-23 | Possis Medical, Inc. | Gas inflation/evacuation system incorporating a reservoir and removably attached sealing system for a guidewire assembly having an occlusive device |
US7183626B2 (en) * | 2004-11-17 | 2007-02-27 | International Rectifier Corporation | Passivation structure with voltage equalizing loops |
CN101405871A (zh) * | 2004-11-24 | 2009-04-08 | 美高森美公司 | 用于宽禁带功率器件的结终端结构 |
CN1987710B (zh) * | 2005-12-23 | 2010-05-05 | 深圳市芯海科技有限公司 | 一种电压调整装置 |
JP5099282B1 (ja) * | 2011-03-15 | 2012-12-19 | 富士電機株式会社 | 高耐圧集積回路装置 |
US8587071B2 (en) * | 2012-04-23 | 2013-11-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electrostatic discharge (ESD) guard ring protective structure |
US9171738B2 (en) * | 2012-12-18 | 2015-10-27 | Infineon Technologies Austria Ag | Systems and methods for integrating bootstrap circuit elements in power transistors and other devices |
US9450044B2 (en) | 2014-08-20 | 2016-09-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Guard ring structure and method of forming the same |
JP6692323B2 (ja) * | 2017-06-12 | 2020-05-13 | 三菱電機株式会社 | 半導体装置 |
CN109712972B (zh) * | 2017-10-26 | 2024-06-04 | 上海维安电子股份有限公司 | 一种过压保护芯片的版图结构 |
JP6749521B2 (ja) * | 2018-04-18 | 2020-09-02 | 三菱電機株式会社 | ポリフェーズフィルタ |
JP7148481B2 (ja) * | 2019-12-04 | 2022-10-05 | エルジー ディスプレイ カンパニー リミテッド | 表示装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10335726A (ja) * | 1997-06-02 | 1998-12-18 | Nec Corp | 半導体装置の駆動方法及び駆動回路 |
JP2001244411A (ja) * | 2000-02-25 | 2001-09-07 | Hitachi Ltd | ドライバicモジュール |
US20030160284A1 (en) * | 2001-10-17 | 2003-08-28 | Takasumi Ohyanagi | Semiconductor device for driving plasma display panel |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3309905B2 (ja) | 1999-03-05 | 2002-07-29 | サンケン電気株式会社 | 電界効果トランジスタを含む半導体装置 |
-
2005
- 2005-01-06 JP JP2005001038A patent/JP4242353B2/ja not_active Expired - Fee Related
- 2005-02-03 US US11/048,732 patent/US7129779B2/en not_active Expired - Fee Related
- 2005-02-03 KR KR1020050010257A patent/KR20060041675A/ko not_active Application Discontinuation
- 2005-02-03 EP EP05002280A patent/EP1562166A2/en not_active Withdrawn
- 2005-02-04 CN CNB2005100091548A patent/CN100401353C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10335726A (ja) * | 1997-06-02 | 1998-12-18 | Nec Corp | 半導体装置の駆動方法及び駆動回路 |
JP2001244411A (ja) * | 2000-02-25 | 2001-09-07 | Hitachi Ltd | ドライバicモジュール |
US20030160284A1 (en) * | 2001-10-17 | 2003-08-28 | Takasumi Ohyanagi | Semiconductor device for driving plasma display panel |
Also Published As
Publication number | Publication date |
---|---|
US20050189603A1 (en) | 2005-09-01 |
CN1652179A (zh) | 2005-08-10 |
US7129779B2 (en) | 2006-10-31 |
KR20060041675A (ko) | 2006-05-12 |
EP1562166A2 (en) | 2005-08-10 |
JP2005252235A (ja) | 2005-09-15 |
JP4242353B2 (ja) | 2009-03-25 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141202 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141202 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 Termination date: 20170204 |
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CF01 | Termination of patent right due to non-payment of annual fee |