CN100394546C - 半导体集成电路器件的制造方法 - Google Patents
半导体集成电路器件的制造方法 Download PDFInfo
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- CN100394546C CN100394546C CNB2004800330203A CN200480033020A CN100394546C CN 100394546 C CN100394546 C CN 100394546C CN B2004800330203 A CNB2004800330203 A CN B2004800330203A CN 200480033020 A CN200480033020 A CN 200480033020A CN 100394546 C CN100394546 C CN 100394546C
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32179—Quality control, monitor production tool with multiple sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S707/00—Data processing: database and file management or data structures
- Y10S707/99931—Database or file accessing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing And Monitoring For Control Systems (AREA)
- General Factory Administration (AREA)
- Semiconductor Integrated Circuits (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003379981 | 2003-11-10 | ||
JP379981/2003 | 2003-11-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1879195A CN1879195A (zh) | 2006-12-13 |
CN100394546C true CN100394546C (zh) | 2008-06-11 |
Family
ID=34567218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800330203A Expired - Fee Related CN100394546C (zh) | 2003-11-10 | 2004-10-26 | 半导体集成电路器件的制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7346412B2 (zh) |
JP (1) | JP4611894B2 (zh) |
CN (1) | CN100394546C (zh) |
TW (1) | TW200516686A (zh) |
WO (1) | WO2005045907A1 (zh) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4730309B2 (ja) * | 2004-11-30 | 2011-07-20 | 株式会社ニコン | デバイス処理システム、情報表示方法、プログラム、及び記録媒体 |
JP4170315B2 (ja) * | 2005-05-30 | 2008-10-22 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 異常判断装置、制御方法、自動車およびプログラム |
JP4697879B2 (ja) | 2006-05-09 | 2011-06-08 | 東京エレクトロン株式会社 | サーバ装置、およびプログラム |
JP5000987B2 (ja) * | 2006-11-20 | 2012-08-15 | 株式会社日立ハイテクノロジーズ | 半導体製造装置 |
US7953511B1 (en) * | 2007-09-21 | 2011-05-31 | National Semiconductor Corporation | System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system |
US20090137068A1 (en) * | 2007-11-28 | 2009-05-28 | Michal Rosen-Zvi | Method and Computer Program Product for Wafer Manufacturing Process Abnormalities Detection |
US7937168B2 (en) * | 2007-12-31 | 2011-05-03 | United Microelectronics Corp. | Automated abnormal machine tracking and notifying system and method |
JP5567307B2 (ja) * | 2009-09-24 | 2014-08-06 | 株式会社日立国際電気 | 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。 |
CN102117731B (zh) * | 2009-12-31 | 2013-01-02 | 中芯国际集成电路制造(上海)有限公司 | 半导体工艺生产流程中的测量数据的监测方法和装置 |
US9026239B2 (en) * | 2010-06-03 | 2015-05-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | APC model extension using existing APC models |
US20120046929A1 (en) * | 2010-08-20 | 2012-02-23 | International Business Machines Corporation | Statistical Design with Importance Sampling Reuse |
TWI456365B (zh) * | 2011-04-19 | 2014-10-11 | 矽品精密工業股份有限公司 | 產品品質異常管理方法以及內儲產品品質異常管理程式之電腦可讀取記錄媒體與電腦程式產品 |
JP6029271B2 (ja) * | 2011-09-28 | 2016-11-24 | 株式会社ディスコ | 加工装置 |
KR102238648B1 (ko) * | 2014-06-03 | 2021-04-09 | 삼성전자주식회사 | 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법 |
US9915932B2 (en) * | 2014-12-01 | 2018-03-13 | Applied Materials, Inc. | System and method for equipment monitoring using a group candidate baseline and probabilistic model |
JP6890382B2 (ja) | 2016-05-23 | 2021-06-18 | ルネサスエレクトロニクス株式会社 | 生産システム |
WO2018131066A1 (ja) * | 2017-01-10 | 2018-07-19 | 株式会社Fuji | 管理装置、実装関連装置及び実装システム |
US10783290B2 (en) * | 2017-09-28 | 2020-09-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | IC manufacturing recipe similarity evaluation methods and systems |
DE102017130551A1 (de) * | 2017-12-19 | 2019-06-19 | Aixtron Se | Vorrichtung und Verfahren zur Gewinnnung von Informationen über in einem CVD-Verfahren abgeschiedener Schichten |
CN113534611B (zh) * | 2020-04-14 | 2023-12-08 | 和舰芯片制造(苏州)股份有限公司 | 对准机日志分析系统及方法 |
CN115079748B (zh) * | 2022-07-08 | 2023-09-22 | 杭州富芯半导体有限公司 | 蚀刻腔体的温度控制方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129554A (ja) * | 1995-10-26 | 1997-05-16 | Kokusai Electric Co Ltd | 半導体製造装置における障害復帰方法 |
JPH10275753A (ja) * | 1997-03-31 | 1998-10-13 | Hitachi Ltd | 半導体基板の製造方法 |
CN1221981A (zh) * | 1997-12-30 | 1999-07-07 | 国际商业机器公司 | 用于半导体晶片制备工艺实时原位监控的方法和系统 |
US5923553A (en) * | 1995-12-21 | 1999-07-13 | Samsung Electronics Co., Ltd. | Method for controlling a semiconductor manufacturing process by failure analysis feedback |
CN1280324A (zh) * | 1999-05-20 | 2001-01-17 | 现代电子产业株式会社 | 自动地控制半导体制造工艺的装置和方法 |
JP2002149222A (ja) * | 2000-11-08 | 2002-05-24 | Mitsubishi Electric Corp | 製品の生産ラインにおける品質管理方法および品質管理システム |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6408219B2 (en) | 1998-05-11 | 2002-06-18 | Applied Materials, Inc. | FAB yield enhancement system |
JP2000269108A (ja) | 1999-03-15 | 2000-09-29 | Sharp Corp | 半導体製造装置の管理システム |
JP2002043200A (ja) * | 2000-07-24 | 2002-02-08 | Mitsubishi Electric Corp | 異常原因検出装置及び異常原因検出方法 |
US6947801B2 (en) * | 2003-08-13 | 2005-09-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for synchronizing control limit and equipment performance |
-
2004
- 2004-09-06 TW TW093126873A patent/TW200516686A/zh not_active IP Right Cessation
- 2004-10-26 WO PCT/JP2004/015835 patent/WO2005045907A1/ja active Application Filing
- 2004-10-26 CN CNB2004800330203A patent/CN100394546C/zh not_active Expired - Fee Related
- 2004-10-26 US US10/578,723 patent/US7346412B2/en active Active
- 2004-10-26 JP JP2005515264A patent/JP4611894B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09129554A (ja) * | 1995-10-26 | 1997-05-16 | Kokusai Electric Co Ltd | 半導体製造装置における障害復帰方法 |
US5923553A (en) * | 1995-12-21 | 1999-07-13 | Samsung Electronics Co., Ltd. | Method for controlling a semiconductor manufacturing process by failure analysis feedback |
JPH10275753A (ja) * | 1997-03-31 | 1998-10-13 | Hitachi Ltd | 半導体基板の製造方法 |
CN1221981A (zh) * | 1997-12-30 | 1999-07-07 | 国际商业机器公司 | 用于半导体晶片制备工艺实时原位监控的方法和系统 |
CN1280324A (zh) * | 1999-05-20 | 2001-01-17 | 现代电子产业株式会社 | 自动地控制半导体制造工艺的装置和方法 |
JP2002149222A (ja) * | 2000-11-08 | 2002-05-24 | Mitsubishi Electric Corp | 製品の生産ラインにおける品質管理方法および品質管理システム |
Also Published As
Publication number | Publication date |
---|---|
JP4611894B2 (ja) | 2011-01-12 |
JPWO2005045907A1 (ja) | 2007-05-24 |
US20070097763A1 (en) | 2007-05-03 |
US7346412B2 (en) | 2008-03-18 |
TWI373082B (zh) | 2012-09-21 |
TW200516686A (en) | 2005-05-16 |
WO2005045907A1 (ja) | 2005-05-19 |
CN1879195A (zh) | 2006-12-13 |
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CF01 | Termination of patent right due to non-payment of annual fee |