TW200516686A - Manufacturing method for semiconductor integrated circuit device - Google Patents

Manufacturing method for semiconductor integrated circuit device

Info

Publication number
TW200516686A
TW200516686A TW093126873A TW93126873A TW200516686A TW 200516686 A TW200516686 A TW 200516686A TW 093126873 A TW093126873 A TW 093126873A TW 93126873 A TW93126873 A TW 93126873A TW 200516686 A TW200516686 A TW 200516686A
Authority
TW
Taiwan
Prior art keywords
fault
log data
detection
manufacturing
integrated circuit
Prior art date
Application number
TW093126873A
Other languages
English (en)
Other versions
TWI373082B (zh
Inventor
Kazuyuki Tokorozuki
Toshihiro Nakajima
Yoshiyuki Miyamoto
Yoshio Fukayama
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200516686A publication Critical patent/TW200516686A/zh
Application granted granted Critical
Publication of TWI373082B publication Critical patent/TWI373082B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32179—Quality control, monitor production tool with multiple sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S707/00—Data processing: database and file management or data structures
    • Y10S707/99931—Database or file accessing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • General Factory Administration (AREA)
  • Drying Of Semiconductors (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW093126873A 2003-11-10 2004-09-06 Manufacturing method for semiconductor integrated circuit device TW200516686A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003379981 2003-11-10

Publications (2)

Publication Number Publication Date
TW200516686A true TW200516686A (en) 2005-05-16
TWI373082B TWI373082B (zh) 2012-09-21

Family

ID=34567218

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126873A TW200516686A (en) 2003-11-10 2004-09-06 Manufacturing method for semiconductor integrated circuit device

Country Status (5)

Country Link
US (1) US7346412B2 (zh)
JP (1) JP4611894B2 (zh)
CN (1) CN100394546C (zh)
TW (1) TW200516686A (zh)
WO (1) WO2005045907A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070219664A1 (en) * 2004-11-30 2007-09-20 Nikon Corporation Device Processing System, Information Display Method, Program, and Recording Medium
JP4170315B2 (ja) * 2005-05-30 2008-10-22 インターナショナル・ビジネス・マシーンズ・コーポレーション 異常判断装置、制御方法、自動車およびプログラム
JP4697879B2 (ja) 2006-05-09 2011-06-08 東京エレクトロン株式会社 サーバ装置、およびプログラム
JP5000987B2 (ja) * 2006-11-20 2012-08-15 株式会社日立ハイテクノロジーズ 半導体製造装置
US7953511B1 (en) * 2007-09-21 2011-05-31 National Semiconductor Corporation System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system
US20090137068A1 (en) * 2007-11-28 2009-05-28 Michal Rosen-Zvi Method and Computer Program Product for Wafer Manufacturing Process Abnormalities Detection
US7937168B2 (en) * 2007-12-31 2011-05-03 United Microelectronics Corp. Automated abnormal machine tracking and notifying system and method
JP5567307B2 (ja) * 2009-09-24 2014-08-06 株式会社日立国際電気 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。
CN102117731B (zh) * 2009-12-31 2013-01-02 中芯国际集成电路制造(上海)有限公司 半导体工艺生产流程中的测量数据的监测方法和装置
US9026239B2 (en) * 2010-06-03 2015-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. APC model extension using existing APC models
US20120046929A1 (en) * 2010-08-20 2012-02-23 International Business Machines Corporation Statistical Design with Importance Sampling Reuse
TWI456365B (zh) * 2011-04-19 2014-10-11 矽品精密工業股份有限公司 產品品質異常管理方法以及內儲產品品質異常管理程式之電腦可讀取記錄媒體與電腦程式產品
JP6029271B2 (ja) * 2011-09-28 2016-11-24 株式会社ディスコ 加工装置
KR102238648B1 (ko) * 2014-06-03 2021-04-09 삼성전자주식회사 반도체 공정 관리 시스템, 이를 포함하는 반도체 제조 시스템 및 반도체 제조 방법
US9915932B2 (en) * 2014-12-01 2018-03-13 Applied Materials, Inc. System and method for equipment monitoring using a group candidate baseline and probabilistic model
JP6890382B2 (ja) 2016-05-23 2021-06-18 ルネサスエレクトロニクス株式会社 生産システム
EP3570126A4 (en) * 2017-01-10 2020-04-01 Fuji Corporation ADMINISTRATIVE DEVICE, ASSEMBLY DEVICE RELATING TO THE ASSEMBLY AND ASSEMBLY SYSTEM
US10783290B2 (en) * 2017-09-28 2020-09-22 Taiwan Semiconductor Manufacturing Company, Ltd. IC manufacturing recipe similarity evaluation methods and systems
DE102017130551A1 (de) * 2017-12-19 2019-06-19 Aixtron Se Vorrichtung und Verfahren zur Gewinnnung von Informationen über in einem CVD-Verfahren abgeschiedener Schichten
CN113534611B (zh) * 2020-04-14 2023-12-08 和舰芯片制造(苏州)股份有限公司 对准机日志分析系统及方法
JP7520569B2 (ja) 2020-04-28 2024-07-23 キヤノン株式会社 情報処理装置、及び情報処理方法
CN115079748B (zh) * 2022-07-08 2023-09-22 杭州富芯半导体有限公司 蚀刻腔体的温度控制方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09129554A (ja) * 1995-10-26 1997-05-16 Kokusai Electric Co Ltd 半導体製造装置における障害復帰方法
KR100200480B1 (ko) * 1995-12-21 1999-10-01 윤종용 불량 분석 피드백에 의한 반도체 제조공정 제어방법
JPH10275753A (ja) 1997-03-31 1998-10-13 Hitachi Ltd 半導体基板の製造方法
CN1221981A (zh) * 1997-12-30 1999-07-07 国际商业机器公司 用于半导体晶片制备工艺实时原位监控的方法和系统
US6408219B2 (en) 1998-05-11 2002-06-18 Applied Materials, Inc. FAB yield enhancement system
JP2000269108A (ja) 1999-03-15 2000-09-29 Sharp Corp 半導体製造装置の管理システム
KR100303321B1 (ko) * 1999-05-20 2001-09-26 박종섭 반도체 라인 자동화 시스템에서의 오류발생 로트 제어 장치 및그 방법
JP2002043200A (ja) * 2000-07-24 2002-02-08 Mitsubishi Electric Corp 異常原因検出装置及び異常原因検出方法
JP2002149222A (ja) * 2000-11-08 2002-05-24 Mitsubishi Electric Corp 製品の生産ラインにおける品質管理方法および品質管理システム
US6947801B2 (en) * 2003-08-13 2005-09-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for synchronizing control limit and equipment performance

Also Published As

Publication number Publication date
US7346412B2 (en) 2008-03-18
JPWO2005045907A1 (ja) 2007-05-24
TWI373082B (zh) 2012-09-21
US20070097763A1 (en) 2007-05-03
CN100394546C (zh) 2008-06-11
CN1879195A (zh) 2006-12-13
JP4611894B2 (ja) 2011-01-12
WO2005045907A1 (ja) 2005-05-19

Similar Documents

Publication Publication Date Title
TW200516686A (en) Manufacturing method for semiconductor integrated circuit device
WO2002010873A3 (en) Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (apc) framework
WO2007005437A3 (en) Out-of-band change detection
CA2416000A1 (en) A method of monitoring equipment of an agricultural machine
WO2006105330A3 (en) A mobile device interface for input devices using existing mobile device connectors
AU2003211727A1 (en) System and method for accident prevention
GB2384070B (en) System and methods for network detection and configuration
WO2005106748A3 (en) Pedigree and integrity evaluation of packages
WO2004072617A3 (en) Sobriety testing apparatus having obd-ii connection capability
EP1241778A3 (en) Method and apparatus for fault condition protection of switched mode power supply
EP1139414A3 (en) Method for failure analysis during the manufacturing semiconductor devices
CA2487999A1 (en) Behavior-based adaptation of computer systems
WO2007047857A3 (en) Systems, methods, and apparatus for indicating faults within a power circuit utilizing dynamically modified inrush restraint
WO2004017389A3 (en) Method for performing real time arcing detection
WO2002075334A3 (en) Apparatus and method for measuring and probability estimating for clock skews
WO2001077638A3 (en) A method and system for assessing remanufacturability of an apparatus
JP2009520291A5 (zh)
WO2004089208A8 (en) Microwave based monitoring system and method
WO2005076132A3 (en) A test system
WO2003100857A3 (de) Aktiver schild einer integrierten schaltung
WO2007047091A3 (en) Method and electronic device for selective transfer of data from removable memory element
EP1085770A4 (en) ELECTRONIC DEVICE AND ITS REPAIR METHOD
WO2004099751A3 (en) Sealing process inspection device
TW200519956A (en) Circuit and method for fuse disposing in a semiconductor memory device
CN109698997B (zh) 用于附件和阻抗检测的系统和方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees