CN100386868C - 自组装电子电路的方法以及由之形成的电路 - Google Patents

自组装电子电路的方法以及由之形成的电路 Download PDF

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Publication number
CN100386868C
CN100386868C CNB028300653A CN02830065A CN100386868C CN 100386868 C CN100386868 C CN 100386868C CN B028300653 A CNB028300653 A CN B028300653A CN 02830065 A CN02830065 A CN 02830065A CN 100386868 C CN100386868 C CN 100386868C
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CN
China
Prior art keywords
self
circuit
metal layer
layer
assembled
Prior art date
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Expired - Lifetime
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CNB028300653A
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English (en)
Chinese (zh)
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CN1714443A (zh
Inventor
帕拉维恩·乔德哈里
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International Business Machines Corp
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International Business Machines Corp
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Filing date
Publication date
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Publication of CN1714443A publication Critical patent/CN1714443A/zh
Application granted granted Critical
Publication of CN100386868C publication Critical patent/CN100386868C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/701—Organic molecular electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Bipolar Transistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
CNB028300653A 2002-12-18 2002-12-18 自组装电子电路的方法以及由之形成的电路 Expired - Lifetime CN100386868C (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/040307 WO2004059730A1 (en) 2002-12-18 2002-12-18 Method of self-assembling electronic circuitry and circuits formed thereby

Publications (2)

Publication Number Publication Date
CN1714443A CN1714443A (zh) 2005-12-28
CN100386868C true CN100386868C (zh) 2008-05-07

Family

ID=32679928

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028300653A Expired - Lifetime CN100386868C (zh) 2002-12-18 2002-12-18 自组装电子电路的方法以及由之形成的电路

Country Status (10)

Country Link
US (1) US7615776B2 (enExample)
EP (1) EP1579499B1 (enExample)
JP (1) JP4755827B2 (enExample)
CN (1) CN100386868C (enExample)
AT (1) ATE486368T1 (enExample)
AU (1) AU2002351391A1 (enExample)
DE (1) DE60238147D1 (enExample)
IL (1) IL169138A (enExample)
TW (1) TWI240373B (enExample)
WO (1) WO2004059730A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635410B2 (ja) * 2002-07-02 2011-02-23 ソニー株式会社 半導体装置及びその製造方法
WO2006076036A2 (en) * 2004-05-25 2006-07-20 The Trustees Of The University Of Pennsylvania Nanostructure assemblies, methods and devices thereof
WO2006102292A2 (en) * 2005-03-21 2006-09-28 The Trustees Of The University Of Pennsylvania Nanogaps: methods and devices containing same
FI122011B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Menetelmä elektroniikkamoduulin tuottamiseksi, välituote elektroniikkamoduulin valmistamiseksi, muistielementti, painettu elektroniikkatuote, anturilaite sekä RFID-tunniste
FI122644B (fi) * 2007-06-08 2012-04-30 Teknologian Tutkimuskeskus Vtt Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen
FI122014B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi
JP5846626B2 (ja) * 2011-07-12 2016-01-20 国立研究開発法人情報通信研究機構 超伝導単一光子検出システムおよび超伝導単一光子検出方法
US8871601B2 (en) 2012-12-27 2014-10-28 Intermolecular, Inc. Diffusion barriers
US8859439B1 (en) 2013-03-28 2014-10-14 International Business Machines Corporation Solution-assisted carbon nanotube placement with graphene electrodes

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6290839B1 (en) * 1998-06-23 2001-09-18 Clinical Micro Sensors, Inc. Systems for electrophoretic transport and detection of analytes
US6407443B2 (en) * 2000-03-01 2002-06-18 Hewlett-Packard Company Nanoscale patterning for the formation of extensive wires
US20020118369A1 (en) * 2001-02-26 2002-08-29 James Misewich Assembling arrays of small particles using an atomic force microscope to define ferroelectric domains

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6265021B1 (en) * 1998-07-31 2001-07-24 International Business Machines Corporation Nanoparticle structures utilizing synthetic DNA lattices
US6262129B1 (en) * 1998-07-31 2001-07-17 International Business Machines Corporation Method for producing nanoparticles of transition metals
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US7335603B2 (en) * 2000-02-07 2008-02-26 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US20020079487A1 (en) * 2000-10-12 2002-06-27 G. Ramanath Diffusion barriers comprising a self-assembled monolayer
US6755956B2 (en) * 2000-10-24 2004-06-29 Ut-Battelle, Llc Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
WO2002035580A2 (en) * 2000-10-24 2002-05-02 Molecular Electronics Corporation Three-terminal field-controlled molecular devices
WO2002080360A1 (en) * 2001-03-30 2002-10-10 California Institute Of Technology Pattern-aligned carbon nanotube growth and tunable resonator apparatus
JP2004136377A (ja) * 2002-10-15 2004-05-13 Nippon Telegr & Teleph Corp <Ntt> 分子ナノワイヤ−ナノ微粒子複合体、その製造方法ならびに該複合体を用いた分子ワイヤリング法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6290839B1 (en) * 1998-06-23 2001-09-18 Clinical Micro Sensors, Inc. Systems for electrophoretic transport and detection of analytes
US6407443B2 (en) * 2000-03-01 2002-06-18 Hewlett-Packard Company Nanoscale patterning for the formation of extensive wires
US20020118369A1 (en) * 2001-02-26 2002-08-29 James Misewich Assembling arrays of small particles using an atomic force microscope to define ferroelectric domains

Also Published As

Publication number Publication date
WO2004059730A1 (en) 2004-07-15
CN1714443A (zh) 2005-12-28
ATE486368T1 (de) 2010-11-15
TWI240373B (en) 2005-09-21
IL169138A (en) 2011-09-27
AU2002351391A1 (en) 2004-07-22
TW200520156A (en) 2005-06-16
EP1579499A4 (en) 2007-09-12
IL169138A0 (en) 2007-07-04
US20060049486A1 (en) 2006-03-09
JP4755827B2 (ja) 2011-08-24
DE60238147D1 (de) 2010-12-09
US7615776B2 (en) 2009-11-10
JP2006511090A (ja) 2006-03-30
EP1579499A1 (en) 2005-09-28
EP1579499B1 (en) 2010-10-27

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Granted publication date: 20080507

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