TWI240373B - Method of self-assembling electronic circuitry and circuits formed thereby - Google Patents

Method of self-assembling electronic circuitry and circuits formed thereby Download PDF

Info

Publication number
TWI240373B
TWI240373B TW092133852A TW92133852A TWI240373B TW I240373 B TWI240373 B TW I240373B TW 092133852 A TW092133852 A TW 092133852A TW 92133852 A TW92133852 A TW 92133852A TW I240373 B TWI240373 B TW I240373B
Authority
TW
Taiwan
Prior art keywords
patent application
circuit
self
scope
layer
Prior art date
Application number
TW092133852A
Other languages
English (en)
Chinese (zh)
Other versions
TW200520156A (en
Inventor
Praveen Chaudhari
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of TW200520156A publication Critical patent/TW200520156A/zh
Application granted granted Critical
Publication of TWI240373B publication Critical patent/TWI240373B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/701—Organic molecular electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105—Using an electrical field; Special methods of applying an electric potential
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Bipolar Transistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
TW092133852A 2002-12-18 2003-12-02 Method of self-assembling electronic circuitry and circuits formed thereby TWI240373B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/040307 WO2004059730A1 (en) 2002-12-18 2002-12-18 Method of self-assembling electronic circuitry and circuits formed thereby

Publications (2)

Publication Number Publication Date
TW200520156A TW200520156A (en) 2005-06-16
TWI240373B true TWI240373B (en) 2005-09-21

Family

ID=32679928

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092133852A TWI240373B (en) 2002-12-18 2003-12-02 Method of self-assembling electronic circuitry and circuits formed thereby

Country Status (10)

Country Link
US (1) US7615776B2 (enExample)
EP (1) EP1579499B1 (enExample)
JP (1) JP4755827B2 (enExample)
CN (1) CN100386868C (enExample)
AT (1) ATE486368T1 (enExample)
AU (1) AU2002351391A1 (enExample)
DE (1) DE60238147D1 (enExample)
IL (1) IL169138A (enExample)
TW (1) TWI240373B (enExample)
WO (1) WO2004059730A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635410B2 (ja) * 2002-07-02 2011-02-23 ソニー株式会社 半導体装置及びその製造方法
WO2006076036A2 (en) * 2004-05-25 2006-07-20 The Trustees Of The University Of Pennsylvania Nanostructure assemblies, methods and devices thereof
WO2006102292A2 (en) * 2005-03-21 2006-09-28 The Trustees Of The University Of Pennsylvania Nanogaps: methods and devices containing same
FI122011B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Menetelmä elektroniikkamoduulin tuottamiseksi, välituote elektroniikkamoduulin valmistamiseksi, muistielementti, painettu elektroniikkatuote, anturilaite sekä RFID-tunniste
FI122644B (fi) * 2007-06-08 2012-04-30 Teknologian Tutkimuskeskus Vtt Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen
FI122014B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi
JP5846626B2 (ja) * 2011-07-12 2016-01-20 国立研究開発法人情報通信研究機構 超伝導単一光子検出システムおよび超伝導単一光子検出方法
US8871601B2 (en) 2012-12-27 2014-10-28 Intermolecular, Inc. Diffusion barriers
US8859439B1 (en) 2013-03-28 2014-10-14 International Business Machines Corporation Solution-assisted carbon nanotube placement with graphene electrodes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6290839B1 (en) * 1998-06-23 2001-09-18 Clinical Micro Sensors, Inc. Systems for electrophoretic transport and detection of analytes
US6265021B1 (en) * 1998-07-31 2001-07-24 International Business Machines Corporation Nanoparticle structures utilizing synthetic DNA lattices
US6262129B1 (en) * 1998-07-31 2001-07-17 International Business Machines Corporation Method for producing nanoparticles of transition metals
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US7335603B2 (en) * 2000-02-07 2008-02-26 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US6294450B1 (en) * 2000-03-01 2001-09-25 Hewlett-Packard Company Nanoscale patterning for the formation of extensive wires
US20020079487A1 (en) * 2000-10-12 2002-06-27 G. Ramanath Diffusion barriers comprising a self-assembled monolayer
US6755956B2 (en) * 2000-10-24 2004-06-29 Ut-Battelle, Llc Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
WO2002035580A2 (en) * 2000-10-24 2002-05-02 Molecular Electronics Corporation Three-terminal field-controlled molecular devices
US6562633B2 (en) * 2001-02-26 2003-05-13 International Business Machines Corporation Assembling arrays of small particles using an atomic force microscope to define ferroelectric domains
WO2002080360A1 (en) * 2001-03-30 2002-10-10 California Institute Of Technology Pattern-aligned carbon nanotube growth and tunable resonator apparatus
JP2004136377A (ja) * 2002-10-15 2004-05-13 Nippon Telegr & Teleph Corp <Ntt> 分子ナノワイヤ−ナノ微粒子複合体、その製造方法ならびに該複合体を用いた分子ワイヤリング法

Also Published As

Publication number Publication date
WO2004059730A1 (en) 2004-07-15
CN1714443A (zh) 2005-12-28
ATE486368T1 (de) 2010-11-15
IL169138A (en) 2011-09-27
AU2002351391A1 (en) 2004-07-22
CN100386868C (zh) 2008-05-07
TW200520156A (en) 2005-06-16
EP1579499A4 (en) 2007-09-12
IL169138A0 (en) 2007-07-04
US20060049486A1 (en) 2006-03-09
JP4755827B2 (ja) 2011-08-24
DE60238147D1 (de) 2010-12-09
US7615776B2 (en) 2009-11-10
JP2006511090A (ja) 2006-03-30
EP1579499A1 (en) 2005-09-28
EP1579499B1 (en) 2010-10-27

Similar Documents

Publication Publication Date Title
US20090087622A1 (en) Directed Assembly of Carbon Nanotubes and Nanoparticles Using Nanotemplates With Nanotrenches
US9102527B2 (en) Systems and methods for making and using nanoelectrodes
CN100381616C (zh) 使用ac电场选择性对准纳米大小成分
Ma et al. Electrostatic funneling for precise nanoparticle placement: a route to wafer-scale integration
US9129969B2 (en) Nanoscale interconnects fabricated by electrical field directed assembly of nanoelements
TWI240373B (en) Method of self-assembling electronic circuitry and circuits formed thereby
TWI399624B (zh) 用於電子元件之電子顯像印刷術
Sun et al. Stretchable conductors fabricated by stencil lithography and centrifugal force-assisted patterning of liquid metal
Zhang et al. Assembly of highly aligned DNA strands onto Si chips
US8362618B2 (en) Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis
US9596762B2 (en) Method of fabricating a circuit board
US20050106804A1 (en) Electrical contacts for molecular electronic transistors
Noh et al. 50 nm DNA nanoarrays generated from uniform oligonucleotide films
US7504014B2 (en) High density interconnections with nanowiring
Zhao et al. Spillover-induced chemisorption of amino acid on silver surfaces
KR100925144B1 (ko) 전자 회로의 자가-형성 방법 및 이 방법에 의해 형성된회로
Daksh et al. Recent developments in bio-nanoelectronics devices: A review
Duan et al. Metal nanoparticle wires formed by an integrated nanomolding− chemical assembly process: fabrication and properties
JP2010162673A (ja) ナノ構造体の配列方法、ナノデバイスの作製方法及びナノデバイス作製用基板
KR101128015B1 (ko) 단일 나노 채널 형성 방법
JPH09275214A (ja) 微少電荷制御素子及びその作製法
JPWO2006035524A1 (ja) 微小電極製造方法及びその製造方法によって作製された微小電極
JP2006147909A (ja) 半導体装置及びその製造方法
KR20140083627A (ko) 투명전극 기반의 유전영동 소자 및 그 제조 방법
KR20160012907A (ko) 그래핀의 하나 이상의 굽힘변형을 구비하여 전기의 On/Off를 조절하는 트랜지스터 및 그래핀 단일 전자 트랜지스터 및 전자 터널링 그래핀 트랜지스터

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees