AU2002351391A1 - Method of self-assembling electronic circuitry and circuits formed thereby - Google Patents

Method of self-assembling electronic circuitry and circuits formed thereby

Info

Publication number
AU2002351391A1
AU2002351391A1 AU2002351391A AU2002351391A AU2002351391A1 AU 2002351391 A1 AU2002351391 A1 AU 2002351391A1 AU 2002351391 A AU2002351391 A AU 2002351391A AU 2002351391 A AU2002351391 A AU 2002351391A AU 2002351391 A1 AU2002351391 A1 AU 2002351391A1
Authority
AU
Australia
Prior art keywords
self
electronic circuitry
circuits formed
assembling electronic
template
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002351391A
Other languages
English (en)
Inventor
Praveen Chaudhari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of AU2002351391A1 publication Critical patent/AU2002351391A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/50Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0293Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/701Organic molecular electronic devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/105Using an electrical field; Special methods of applying an electric potential
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17Post-manufacturing processes
    • H05K2203/173Adding connections between adjacent pads or conductors, e.g. for modifying or repairing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mathematical Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Bipolar Transistors (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AU2002351391A 2002-12-18 2002-12-18 Method of self-assembling electronic circuitry and circuits formed thereby Abandoned AU2002351391A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2002/040307 WO2004059730A1 (en) 2002-12-18 2002-12-18 Method of self-assembling electronic circuitry and circuits formed thereby

Publications (1)

Publication Number Publication Date
AU2002351391A1 true AU2002351391A1 (en) 2004-07-22

Family

ID=32679928

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002351391A Abandoned AU2002351391A1 (en) 2002-12-18 2002-12-18 Method of self-assembling electronic circuitry and circuits formed thereby

Country Status (10)

Country Link
US (1) US7615776B2 (enExample)
EP (1) EP1579499B1 (enExample)
JP (1) JP4755827B2 (enExample)
CN (1) CN100386868C (enExample)
AT (1) ATE486368T1 (enExample)
AU (1) AU2002351391A1 (enExample)
DE (1) DE60238147D1 (enExample)
IL (1) IL169138A (enExample)
TW (1) TWI240373B (enExample)
WO (1) WO2004059730A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4635410B2 (ja) * 2002-07-02 2011-02-23 ソニー株式会社 半導体装置及びその製造方法
WO2006076036A2 (en) * 2004-05-25 2006-07-20 The Trustees Of The University Of Pennsylvania Nanostructure assemblies, methods and devices thereof
WO2006102292A2 (en) * 2005-03-21 2006-09-28 The Trustees Of The University Of Pennsylvania Nanogaps: methods and devices containing same
FI122011B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Menetelmä elektroniikkamoduulin tuottamiseksi, välituote elektroniikkamoduulin valmistamiseksi, muistielementti, painettu elektroniikkatuote, anturilaite sekä RFID-tunniste
FI122644B (fi) * 2007-06-08 2012-04-30 Teknologian Tutkimuskeskus Vtt Menetelmä sähköisesti johtavien tai puolijohtavien reittien muodostamiseksi substraatille sekä menetelmän käyttö transistorien tuottamiseen ja anturien valmistukseen
FI122014B (fi) * 2007-06-08 2011-07-15 Teknologian Tutkimuskeskus Vtt Menetelmä ja laite nanopartikkelijärjestelmien toiminnallistamiseksi
JP5846626B2 (ja) * 2011-07-12 2016-01-20 国立研究開発法人情報通信研究機構 超伝導単一光子検出システムおよび超伝導単一光子検出方法
US8871601B2 (en) 2012-12-27 2014-10-28 Intermolecular, Inc. Diffusion barriers
US8859439B1 (en) 2013-03-28 2014-10-14 International Business Machines Corporation Solution-assisted carbon nanotube placement with graphene electrodes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6290839B1 (en) * 1998-06-23 2001-09-18 Clinical Micro Sensors, Inc. Systems for electrophoretic transport and detection of analytes
US6265021B1 (en) * 1998-07-31 2001-07-24 International Business Machines Corporation Nanoparticle structures utilizing synthetic DNA lattices
US6262129B1 (en) * 1998-07-31 2001-07-17 International Business Machines Corporation Method for producing nanoparticles of transition metals
US6340822B1 (en) * 1999-10-05 2002-01-22 Agere Systems Guardian Corp. Article comprising vertically nano-interconnected circuit devices and method for making the same
US7335603B2 (en) * 2000-02-07 2008-02-26 Vladimir Mancevski System and method for fabricating logic devices comprising carbon nanotube transistors
US6294450B1 (en) * 2000-03-01 2001-09-25 Hewlett-Packard Company Nanoscale patterning for the formation of extensive wires
US20020079487A1 (en) * 2000-10-12 2002-06-27 G. Ramanath Diffusion barriers comprising a self-assembled monolayer
US6755956B2 (en) * 2000-10-24 2004-06-29 Ut-Battelle, Llc Catalyst-induced growth of carbon nanotubes on tips of cantilevers and nanowires
WO2002035580A2 (en) * 2000-10-24 2002-05-02 Molecular Electronics Corporation Three-terminal field-controlled molecular devices
US6562633B2 (en) * 2001-02-26 2003-05-13 International Business Machines Corporation Assembling arrays of small particles using an atomic force microscope to define ferroelectric domains
WO2002080360A1 (en) * 2001-03-30 2002-10-10 California Institute Of Technology Pattern-aligned carbon nanotube growth and tunable resonator apparatus
JP2004136377A (ja) * 2002-10-15 2004-05-13 Nippon Telegr & Teleph Corp <Ntt> 分子ナノワイヤ−ナノ微粒子複合体、その製造方法ならびに該複合体を用いた分子ワイヤリング法

Also Published As

Publication number Publication date
WO2004059730A1 (en) 2004-07-15
CN1714443A (zh) 2005-12-28
ATE486368T1 (de) 2010-11-15
TWI240373B (en) 2005-09-21
IL169138A (en) 2011-09-27
CN100386868C (zh) 2008-05-07
TW200520156A (en) 2005-06-16
EP1579499A4 (en) 2007-09-12
IL169138A0 (en) 2007-07-04
US20060049486A1 (en) 2006-03-09
JP4755827B2 (ja) 2011-08-24
DE60238147D1 (de) 2010-12-09
US7615776B2 (en) 2009-11-10
JP2006511090A (ja) 2006-03-30
EP1579499A1 (en) 2005-09-28
EP1579499B1 (en) 2010-10-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase