CN100356530C - 半导体装置的制造方法 - Google Patents
半导体装置的制造方法 Download PDFInfo
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- CN100356530C CN100356530C CNB031525091A CN03152509A CN100356530C CN 100356530 C CN100356530 C CN 100356530C CN B031525091 A CNB031525091 A CN B031525091A CN 03152509 A CN03152509 A CN 03152509A CN 100356530 C CN100356530 C CN 100356530C
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- metal bump
- chip
- semiconductor substrate
- temperature
- metal
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- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002225097A JP3850352B2 (ja) | 2002-08-01 | 2002-08-01 | 半導体装置の製造方法 |
JP2002225097 | 2002-08-01 | ||
JP2002236036A JP4009505B2 (ja) | 2002-08-13 | 2002-08-13 | 半導体装置の製造方法 |
JP2002236036 | 2002-08-13 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2007100017248A Division CN1983544A (zh) | 2002-08-01 | 2003-08-01 | 半导体装置的制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1481002A CN1481002A (zh) | 2004-03-10 |
CN100356530C true CN100356530C (zh) | 2007-12-19 |
Family
ID=32032808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031525091A Expired - Lifetime CN100356530C (zh) | 2002-08-01 | 2003-08-01 | 半导体装置的制造方法 |
Country Status (2)
Country | Link |
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US (1) | US6835593B2 (zh) |
CN (1) | CN100356530C (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005101149A (ja) * | 2003-09-24 | 2005-04-14 | Sharp Corp | 半導体発光装置及びその製造方法 |
US7098075B1 (en) * | 2004-01-29 | 2006-08-29 | Xilinx, Inc. | Integrated circuit and method of producing a carrier wafer for an integrated circuit |
JP2006013073A (ja) * | 2004-06-24 | 2006-01-12 | Sharp Corp | ボンディング装置、ボンディング方法及び半導体装置の製造方法 |
JP4718809B2 (ja) * | 2004-08-11 | 2011-07-06 | ローム株式会社 | 電子装置およびそれを用いた半導体装置、ならびに半導体装置の製造方法 |
US8283208B2 (en) | 2004-12-28 | 2012-10-09 | Mitsumasa Koyanagi | Method and apparatus for fabricating integrated circuit device using self-organizing function |
KR100718781B1 (ko) * | 2005-06-15 | 2007-05-16 | 매그나칩 반도체 유한회사 | 콤팩트 픽셀 레이아웃을 갖는 cmos 이미지 센서 |
US8022554B2 (en) | 2006-06-15 | 2011-09-20 | Sitime Corporation | Stacked die package for MEMS resonator system |
JP4955334B2 (ja) * | 2006-08-03 | 2012-06-20 | ローム株式会社 | 加速度センサ |
JP2011061073A (ja) * | 2009-09-11 | 2011-03-24 | Toshiba Corp | 半導体装置の製造方法及び半導体製造装置 |
JP6000626B2 (ja) | 2012-05-01 | 2016-10-05 | 新光電気工業株式会社 | 電子装置の製造方法及び電子部品搭載装置 |
KR102190382B1 (ko) | 2012-12-20 | 2020-12-11 | 삼성전자주식회사 | 반도체 패키지 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH118270A (ja) * | 1997-06-16 | 1999-01-12 | Tokai Rika Co Ltd | 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法 |
US6015652A (en) * | 1998-02-27 | 2000-01-18 | Lucent Technologies Inc. | Manufacture of flip-chip device |
JP2000036657A (ja) * | 1998-07-21 | 2000-02-02 | Fujitsu Ltd | 電子装置およびその製造方法 |
US6046074A (en) * | 1995-06-05 | 2000-04-04 | International Business Machines Corporation | Hermetic thin film metallized sealband for SCM and MCM-D modules |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2793528B2 (ja) * | 1995-09-22 | 1998-09-03 | インターナショナル・ビジネス・マシーンズ・コーポレイション | ハンダ付け方法、ハンダ付け装置 |
US6103549A (en) * | 1998-03-17 | 2000-08-15 | Advanced Micro Devices, Inc. | No clean flux for flip chip assembly |
JP4387548B2 (ja) * | 2000-03-28 | 2009-12-16 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP3735526B2 (ja) * | 2000-10-04 | 2006-01-18 | 日本電気株式会社 | 半導体装置及びその製造方法 |
US6610559B2 (en) * | 2001-11-16 | 2003-08-26 | Indium Corporation Of America | Integrated void-free process for assembling a solder bumped chip |
-
2003
- 2003-07-30 US US10/629,904 patent/US6835593B2/en not_active Expired - Lifetime
- 2003-08-01 CN CNB031525091A patent/CN100356530C/zh not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6046074A (en) * | 1995-06-05 | 2000-04-04 | International Business Machines Corporation | Hermetic thin film metallized sealband for SCM and MCM-D modules |
JPH118270A (ja) * | 1997-06-16 | 1999-01-12 | Tokai Rika Co Ltd | 半導体チップの搭載方法、チップオンチップ構造体の製造方法及びチップオンボード構造体の製造方法 |
US6015652A (en) * | 1998-02-27 | 2000-01-18 | Lucent Technologies Inc. | Manufacture of flip-chip device |
JP2000036657A (ja) * | 1998-07-21 | 2000-02-02 | Fujitsu Ltd | 電子装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US6835593B2 (en) | 2004-12-28 |
US20040137708A1 (en) | 2004-07-15 |
CN1481002A (zh) | 2004-03-10 |
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