CN100349977C - 聚酰胺模塑组合物和由其模塑的具有提高的热稳定性的电气和电子元件 - Google Patents

聚酰胺模塑组合物和由其模塑的具有提高的热稳定性的电气和电子元件 Download PDF

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Publication number
CN100349977C
CN100349977C CNB038194465A CN03819446A CN100349977C CN 100349977 C CN100349977 C CN 100349977C CN B038194465 A CNB038194465 A CN B038194465A CN 03819446 A CN03819446 A CN 03819446A CN 100349977 C CN100349977 C CN 100349977C
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China
Prior art keywords
acid
terephthalic acid
diaminododecane
diaminodecane
terephthalic
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Expired - Fee Related
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CNB038194465A
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English (en)
Chinese (zh)
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CN1675307A (zh
Inventor
M·M·马坦斯
K·雷德蒙德
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EIDP Inc
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EI Du Pont de Nemours and Co
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/016—Flame-proofing or flame-retarding additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
CNB038194465A 2002-08-09 2003-08-08 聚酰胺模塑组合物和由其模塑的具有提高的热稳定性的电气和电子元件 Expired - Fee Related CN100349977C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40235502P 2002-08-09 2002-08-09
US60/402,355 2002-08-09

Publications (2)

Publication Number Publication Date
CN1675307A CN1675307A (zh) 2005-09-28
CN100349977C true CN100349977C (zh) 2007-11-21

Family

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Family Applications (1)

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CNB038194465A Expired - Fee Related CN100349977C (zh) 2002-08-09 2003-08-08 聚酰胺模塑组合物和由其模塑的具有提高的热稳定性的电气和电子元件

Country Status (7)

Country Link
US (1) US20040077769A1 (https=)
EP (1) EP1539885A1 (https=)
JP (1) JP2005535754A (https=)
CN (1) CN100349977C (https=)
AU (1) AU2003259730A1 (https=)
CA (1) CA2495095A1 (https=)
WO (1) WO2004015010A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103254422A (zh) * 2013-05-20 2013-08-21 金发科技股份有限公司 一种聚酰胺树脂及由其组成的聚酰胺组合物

Families Citing this family (18)

* Cited by examiner, † Cited by third party
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US20060293435A1 (en) * 2005-06-10 2006-12-28 Marens Marvin M Light-emitting diode assembly housing comprising high temperature polyamide compositions
US20060293497A1 (en) 2005-06-10 2006-12-28 Martens Marvin M Articles of manufacture made from polyamide resins and suitable for incorporation into LED reflector applications
EP1988113B1 (de) * 2007-05-03 2009-10-14 Ems-Patent Ag Teilaromatische Polyamidformmassen und deren Verwendungen
FR2934864B1 (fr) * 2008-08-08 2012-05-25 Arkema France Polyamide semi-aromatique a terminaison de chaine
FR2934865B1 (fr) * 2008-08-08 2010-08-27 Arkema France Copolyamide semi-aromatique et son procede de preparation
KR20110133041A (ko) * 2009-03-11 2011-12-09 이 아이 듀폰 디 네모아 앤드 캄파니 내염성 폴리아미드 조성물
EP2325260B1 (de) 2009-11-23 2016-04-27 Ems-Patent Ag Teilaromatische Formmassen und deren Verwendungen
JPWO2011074536A1 (ja) * 2009-12-14 2013-04-25 東洋紡株式会社 共重合ポリアミド
FR2954773B1 (fr) * 2009-12-24 2013-01-04 Arkema France Polyamide semi-aromatique, son procede de preparation, composition comprenant un tel polyamide et leurs utilisations
JP5668387B2 (ja) * 2010-09-21 2015-02-12 東洋紡株式会社 中空成形体用強化ポリアミド樹脂組成物およびそれを用いた中空成形体
JP5648426B2 (ja) * 2010-11-01 2015-01-07 東洋紡株式会社 ポリアミド樹脂組成物およびポリアミド樹脂発泡成形体
CN102796257B (zh) * 2012-01-06 2014-04-30 东莞市信诺橡塑工业有限公司 一种长碳链半芳香族聚酰胺及其合成方法
JP6146063B2 (ja) * 2013-03-08 2017-06-14 東洋紡株式会社 圧縮成形用炭素長繊維強化ポリアミド複合材料
EP2821426A1 (en) * 2013-07-03 2015-01-07 Universita' Degli Studi Di Milano Polymers with complex macromolecular architecture having flame-retardant properties
CN106633858B (zh) * 2017-01-10 2019-01-04 江门市德众泰工程塑胶科技有限公司 一种聚酰胺树脂复合材料及其制备方法和应用
FR3094010B1 (fr) 2019-03-21 2021-10-08 Arkema France Compositions de copolyamides comprenant des fibres de renforts et presentant une stabilité de module élevée et leurs utilisations
KR20220055474A (ko) 2019-08-27 2022-05-03 솔베이 스페셜티 폴리머즈 유에스에이, 엘.엘.씨. 폴리아미드 및 상응하는 중합체 조성물, 물품 및 제조 및 사용 방법
CN114907563B (zh) * 2021-02-10 2023-11-17 上海凯赛生物技术股份有限公司 阻燃改性pa56/5t材料及其制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN88103022A (zh) * 1987-04-20 1988-11-23 三井石油化学工业株式会社 具有良好耐热性的阻燃聚酰胺组合物
WO2002024812A2 (en) * 2000-09-22 2002-03-28 E.I. Dupont De Nemours And Company Improved flame-retardant polyamide compositions
US20020040089A1 (en) * 2000-08-09 2002-04-04 Kunihiro Ouchi Flame-retardant polyamide composition, and its use
US20020086928A1 (en) * 2000-11-07 2002-07-04 Kunihiro Ouchi Fire retardant polyamide composition and use thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5256718A (en) * 1990-02-14 1993-10-26 Mitsui Petrochemical Industries, Ltd. Flame retardant polyamide thermoplastic resin composition
US6350802B2 (en) * 1998-03-18 2002-02-26 E. I. Du Pont De Nemours And Company Thermally stable flame retardant polyamides

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN88103022A (zh) * 1987-04-20 1988-11-23 三井石油化学工业株式会社 具有良好耐热性的阻燃聚酰胺组合物
US20020040089A1 (en) * 2000-08-09 2002-04-04 Kunihiro Ouchi Flame-retardant polyamide composition, and its use
WO2002024812A2 (en) * 2000-09-22 2002-03-28 E.I. Dupont De Nemours And Company Improved flame-retardant polyamide compositions
US20020086928A1 (en) * 2000-11-07 2002-07-04 Kunihiro Ouchi Fire retardant polyamide composition and use thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103254422A (zh) * 2013-05-20 2013-08-21 金发科技股份有限公司 一种聚酰胺树脂及由其组成的聚酰胺组合物

Also Published As

Publication number Publication date
US20040077769A1 (en) 2004-04-22
JP2005535754A (ja) 2005-11-24
WO2004015010A1 (en) 2004-02-19
CA2495095A1 (en) 2004-02-19
AU2003259730A1 (en) 2004-02-25
CN1675307A (zh) 2005-09-28
EP1539885A1 (en) 2005-06-15

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Granted publication date: 20071121

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