CN100337103C - 用于压力传感器杆的电连接器 - Google Patents

用于压力传感器杆的电连接器 Download PDF

Info

Publication number
CN100337103C
CN100337103C CNB2004100639261A CN200410063926A CN100337103C CN 100337103 C CN100337103 C CN 100337103C CN B2004100639261 A CNB2004100639261 A CN B2004100639261A CN 200410063926 A CN200410063926 A CN 200410063926A CN 100337103 C CN100337103 C CN 100337103C
Authority
CN
China
Prior art keywords
pressure sensor
electric connector
protective bulkhead
substrate
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100639261A
Other languages
English (en)
Chinese (zh)
Other versions
CN1573308A (zh
Inventor
克里斯托弗·L·埃里克森
詹姆斯·L·格拉韦尔
兰德尔·G·奥尔森
戴维·斯特赖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rosemount Inc
Original Assignee
Rosemount Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rosemount Inc filed Critical Rosemount Inc
Publication of CN1573308A publication Critical patent/CN1573308A/zh
Application granted granted Critical
Publication of CN100337103C publication Critical patent/CN100337103C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
CNB2004100639261A 2003-05-28 2004-05-28 用于压力传感器杆的电连接器 Expired - Fee Related CN100337103C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/446,457 US6722927B1 (en) 2003-05-28 2003-05-28 Electrical connector for a pressure sensor stem
US10/446,457 2003-05-28

Publications (2)

Publication Number Publication Date
CN1573308A CN1573308A (zh) 2005-02-02
CN100337103C true CN100337103C (zh) 2007-09-12

Family

ID=32070011

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100639261A Expired - Fee Related CN100337103C (zh) 2003-05-28 2004-05-28 用于压力传感器杆的电连接器

Country Status (4)

Country Link
US (1) US6722927B1 (enExample)
JP (1) JP4726434B2 (enExample)
CN (1) CN100337103C (enExample)
DE (1) DE102004026220B4 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2643051C (en) * 2006-02-21 2013-01-29 Rosemount Inc. Industrial process field device with energy limited battery assembly
DE202009001989U1 (de) * 2009-03-23 2009-06-10 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Steckergehäuse aus Kunststoff für einen Steckverbinder
JP5136861B2 (ja) * 2009-03-27 2013-02-06 住友電装株式会社 シールドコネクタ
US9442031B2 (en) 2013-06-28 2016-09-13 Rosemount Inc. High integrity process fluid pressure probe
US9459170B2 (en) 2013-09-26 2016-10-04 Rosemount Inc. Process fluid pressure sensing assembly for pressure transmitters subjected to high working pressure
US9638600B2 (en) * 2014-09-30 2017-05-02 Rosemount Inc. Electrical interconnect for pressure sensor in a process variable transmitter
US10209154B2 (en) * 2015-03-30 2019-02-19 Rosemount Inc. In-line process fluid pressure transmitter for high pressure applications
US10756471B1 (en) * 2019-06-04 2020-08-25 Te Connectivity Corporation Shield grounding electrical connectors

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842525A (en) * 1985-10-22 1989-06-27 Amp Incorporated Electrical connector assembly for antiskid braking system
JPH0843224A (ja) * 1994-08-01 1996-02-16 Matsushita Electric Ind Co Ltd 圧力検知装置
US6089097A (en) * 1995-02-28 2000-07-18 Rosemount Inc. Elongated pressure sensor for a pressure transmitter
US6148681A (en) * 1997-01-06 2000-11-21 Rosemount Inc. Level probe with modular connection

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05145085A (ja) * 1991-11-25 1993-06-11 Nippondenso Co Ltd 半導体圧力センサ
US5711552A (en) * 1995-04-05 1998-01-27 General Electric Company Coupling
US5853020A (en) * 1995-06-23 1998-12-29 Widner; Ronald D. Miniature combination valve and pressure transducer and system
JPH10275648A (ja) * 1997-03-29 1998-10-13 Omron Corp コネクタ
US6131467A (en) * 1997-05-09 2000-10-17 Fujikoki Corporation Pressure sensor including a joint for connecting a housing and connector case together
JPH1123400A (ja) * 1997-05-09 1999-01-29 Fuji Koki Corp 圧力センサ
US5975955A (en) * 1997-12-15 1999-11-02 Molex Incorporated Shielded electrical connector assembly with grounding system
JP3309808B2 (ja) * 1998-08-04 2002-07-29 株式会社デンソー 圧力検出装置
US6506069B2 (en) * 2001-01-25 2003-01-14 Kelsey-Hayes Company Floating electrical connector for a pressure sensor
JP4281178B2 (ja) * 1999-10-06 2009-06-17 株式会社デンソー 半導体圧力センサ
JP4003363B2 (ja) * 1999-12-24 2007-11-07 株式会社デンソー 燃焼圧センサ構造体
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
JP2001291543A (ja) * 2000-04-06 2001-10-19 Fujikura Ltd 表面実装用コネクタ及びその実装構造
US6584851B2 (en) * 2000-11-30 2003-07-01 Nagano Keiki Co., Ltd. Fluid pressure sensor having a pressure port
DE20111343U1 (de) * 2001-07-07 2001-10-18 Abb Patent Gmbh, 68309 Mannheim Messwerk zur Differenzdruckmessung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842525A (en) * 1985-10-22 1989-06-27 Amp Incorporated Electrical connector assembly for antiskid braking system
JPH0843224A (ja) * 1994-08-01 1996-02-16 Matsushita Electric Ind Co Ltd 圧力検知装置
US6089097A (en) * 1995-02-28 2000-07-18 Rosemount Inc. Elongated pressure sensor for a pressure transmitter
US6148681A (en) * 1997-01-06 2000-11-21 Rosemount Inc. Level probe with modular connection

Also Published As

Publication number Publication date
CN1573308A (zh) 2005-02-02
JP2004354384A (ja) 2004-12-16
DE102004026220A1 (de) 2005-02-10
DE102004026220B4 (de) 2015-09-24
US6722927B1 (en) 2004-04-20
JP4726434B2 (ja) 2011-07-20

Similar Documents

Publication Publication Date Title
KR100707923B1 (ko) 센서칩을 구비한 압력센서 및 공통 스템에 설치된신호처리회로
KR100804841B1 (ko) 집적 커패시터를 갖는 홀 효과 센서 어셈블리 및 그 제조 방법
EP1211496B1 (en) Pressure sensor
CN100337103C (zh) 用于压力传感器杆的电连接器
EP2620757A1 (en) Small form factor microfused silicon strain gage (MSG) pressure sensor packaging
CN103308218B (zh) 半导体传感器装置及使用半导体传感器装置的电子装置
JPH0969603A (ja) 電力用半導体装置、その外装ケースとその製造方法
CN107240583A (zh) 多芯片压力传感器封装体
KR102249785B1 (ko) 압력센서
US8637971B2 (en) Semiconductor device and method of manufacturing semiconductor device
US20170201145A1 (en) Feedthrough for hermetic applications
US20030184982A1 (en) Pressure sensor and method for manufacturing the same
US6619132B2 (en) Sensor including a circuit lead frame and a terminal lead frame formed by a metal plate
EP1926182A2 (en) Overmolded electronic assembly
US7474814B2 (en) Optical device, optical connector, electronic device, and electronic equipment
JP2007033047A (ja) 半導体圧力センサ
US20020081899A1 (en) Glass-metal leadthrough
WO2009150820A1 (ja) 半導体装置とその製造方法
KR102148550B1 (ko) 측정 송신기의 제조 방법
US20030005773A1 (en) Measurement mechanism for differential pressure measurement
JPH01196153A (ja) 樹脂封止半導体装置
CN103728093A (zh) 具有对抗安装应力的稳健性的压力传感器
DE19709977A1 (de) Halbleiterschaltungsvorrichtung und Halbleitersensorvorrichtung
CN103490222A (zh) 接头端子固定装置及接头端子固定方法
JP2002098609A (ja) センサ装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070912

Termination date: 20200528