JP4726434B2 - 圧力センサステム用電気コネクタ - Google Patents

圧力センサステム用電気コネクタ Download PDF

Info

Publication number
JP4726434B2
JP4726434B2 JP2004157525A JP2004157525A JP4726434B2 JP 4726434 B2 JP4726434 B2 JP 4726434B2 JP 2004157525 A JP2004157525 A JP 2004157525A JP 2004157525 A JP2004157525 A JP 2004157525A JP 4726434 B2 JP4726434 B2 JP 4726434B2
Authority
JP
Japan
Prior art keywords
pressure sensor
electrical connector
base plate
stem
protective wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004157525A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004354384A (ja
JP2004354384A5 (enExample
Inventor
エル. エリクセン クリストファー
エル. グラベル ジェイムス
シー. オルソン ランダル
ストレイ デビッド
Original Assignee
ローズマウント インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ローズマウント インコーポレイテッド filed Critical ローズマウント インコーポレイテッド
Publication of JP2004354384A publication Critical patent/JP2004354384A/ja
Publication of JP2004354384A5 publication Critical patent/JP2004354384A5/ja
Application granted granted Critical
Publication of JP4726434B2 publication Critical patent/JP4726434B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061Electrical connection means
    • G01L19/0084Electrical connection means to the outside of the housing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • H01R13/504Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591Specific features or arrangements of connection of shield to conductive members
    • H01R13/6594Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
    • H01R13/6595Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members with separate members fixing the shield to the PCB

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
JP2004157525A 2003-05-28 2004-05-27 圧力センサステム用電気コネクタ Expired - Lifetime JP4726434B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/446,457 US6722927B1 (en) 2003-05-28 2003-05-28 Electrical connector for a pressure sensor stem
US10/446457 2003-05-28

Publications (3)

Publication Number Publication Date
JP2004354384A JP2004354384A (ja) 2004-12-16
JP2004354384A5 JP2004354384A5 (enExample) 2007-04-05
JP4726434B2 true JP4726434B2 (ja) 2011-07-20

Family

ID=32070011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004157525A Expired - Lifetime JP4726434B2 (ja) 2003-05-28 2004-05-27 圧力センサステム用電気コネクタ

Country Status (4)

Country Link
US (1) US6722927B1 (enExample)
JP (1) JP4726434B2 (enExample)
CN (1) CN100337103C (enExample)
DE (1) DE102004026220B4 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017529541A (ja) * 2014-09-30 2017-10-05 ローズマウント インコーポレイテッド プロセス変数トランスミッタにおける圧力センサのための電気相互接続

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2643051C (en) * 2006-02-21 2013-01-29 Rosemount Inc. Industrial process field device with energy limited battery assembly
DE202009001989U1 (de) * 2009-03-23 2009-06-10 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Steckergehäuse aus Kunststoff für einen Steckverbinder
JP5136861B2 (ja) * 2009-03-27 2013-02-06 住友電装株式会社 シールドコネクタ
US9442031B2 (en) 2013-06-28 2016-09-13 Rosemount Inc. High integrity process fluid pressure probe
US9459170B2 (en) 2013-09-26 2016-10-04 Rosemount Inc. Process fluid pressure sensing assembly for pressure transmitters subjected to high working pressure
US10209154B2 (en) * 2015-03-30 2019-02-19 Rosemount Inc. In-line process fluid pressure transmitter for high pressure applications
US10756471B1 (en) * 2019-06-04 2020-08-25 Te Connectivity Corporation Shield grounding electrical connectors

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4785532A (en) * 1985-10-22 1988-11-22 Amp Incorporated Method of making electrical connector assembly for antiskid braking system
JPH05145085A (ja) * 1991-11-25 1993-06-11 Nippondenso Co Ltd 半導体圧力センサ
JPH0843224A (ja) * 1994-08-01 1996-02-16 Matsushita Electric Ind Co Ltd 圧力検知装置
US5637802A (en) 1995-02-28 1997-06-10 Rosemount Inc. Capacitive pressure sensor for a pressure transmitted where electric field emanates substantially from back sides of plates
US5711552A (en) * 1995-04-05 1998-01-27 General Electric Company Coupling
US5853020A (en) * 1995-06-23 1998-12-29 Widner; Ronald D. Miniature combination valve and pressure transducer and system
US6148681A (en) * 1997-01-06 2000-11-21 Rosemount Inc. Level probe with modular connection
JPH10275648A (ja) * 1997-03-29 1998-10-13 Omron Corp コネクタ
US6131467A (en) * 1997-05-09 2000-10-17 Fujikoki Corporation Pressure sensor including a joint for connecting a housing and connector case together
JPH1123400A (ja) * 1997-05-09 1999-01-29 Fuji Koki Corp 圧力センサ
US5975955A (en) * 1997-12-15 1999-11-02 Molex Incorporated Shielded electrical connector assembly with grounding system
JP3309808B2 (ja) * 1998-08-04 2002-07-29 株式会社デンソー 圧力検出装置
US6506069B2 (en) * 2001-01-25 2003-01-14 Kelsey-Hayes Company Floating electrical connector for a pressure sensor
JP4281178B2 (ja) * 1999-10-06 2009-06-17 株式会社デンソー 半導体圧力センサ
JP4003363B2 (ja) * 1999-12-24 2007-11-07 株式会社デンソー 燃焼圧センサ構造体
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
JP2001291543A (ja) * 2000-04-06 2001-10-19 Fujikura Ltd 表面実装用コネクタ及びその実装構造
US6584851B2 (en) * 2000-11-30 2003-07-01 Nagano Keiki Co., Ltd. Fluid pressure sensor having a pressure port
DE20111343U1 (de) * 2001-07-07 2001-10-18 Abb Patent Gmbh, 68309 Mannheim Messwerk zur Differenzdruckmessung

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017529541A (ja) * 2014-09-30 2017-10-05 ローズマウント インコーポレイテッド プロセス変数トランスミッタにおける圧力センサのための電気相互接続

Also Published As

Publication number Publication date
CN1573308A (zh) 2005-02-02
JP2004354384A (ja) 2004-12-16
DE102004026220A1 (de) 2005-02-10
DE102004026220B4 (de) 2015-09-24
CN100337103C (zh) 2007-09-12
US6722927B1 (en) 2004-04-20

Similar Documents

Publication Publication Date Title
US6432737B1 (en) Method for forming a flip chip pressure sensor die package
US6441503B1 (en) Bond wire pressure sensor die package
US8035208B2 (en) Integrated circuit package
US8643127B2 (en) Sensor device packaging
US20080277747A1 (en) MEMS device support structure for sensor packaging
EP3124935B1 (en) Sensor package
US6420201B1 (en) Method for forming a bond wire pressure sensor die package
JP4726434B2 (ja) 圧力センサステム用電気コネクタ
JP2007501937A (ja) センサモジュール
CN102384807A (zh) 压力传感器装置、具备该装置的电子设备以及该装置的安装方法
JP6462187B2 (ja) カテーテルセンサの製造
EP3575765B1 (en) Overmolded lead frame assembly for pressure sensing applications
JP2009192424A (ja) 温度センサおよび温度センサ一体型圧力センサ
KR102242428B1 (ko) 스트레인 게이지 압력 센서
JP5175538B2 (ja) センサの防水装着構造
KR100834337B1 (ko) 압력 센서 장치 및 그 제조 방법
US6608725B2 (en) Optical module
CN105181216B (zh) 应变计式压力传感器
US7084473B2 (en) Semiconductor package with an optical sensor which may be fit inside an object
JP2004354384A5 (enExample)
KR20110076539A (ko) 압력 센서 및 그 제조 방법
EP2950070B1 (en) Strain gauge pressure sensor
KR101628267B1 (ko) 압력센서
KR100544712B1 (ko) 압력 검출 장치
JP2007192790A (ja) 半導体圧力センサ

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070214

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20100115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100324

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100609

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101201

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110222

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110316

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110412

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140422

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250