CH661129A5 - Kontaktiervorrichtung. - Google Patents
Kontaktiervorrichtung. Download PDFInfo
- Publication number
- CH661129A5 CH661129A5 CH566183A CH566183A CH661129A5 CH 661129 A5 CH661129 A5 CH 661129A5 CH 566183 A CH566183 A CH 566183A CH 566183 A CH566183 A CH 566183A CH 661129 A5 CH661129 A5 CH 661129A5
- Authority
- CH
- Switzerland
- Prior art keywords
- contacting device
- contact pin
- carrier
- contact pins
- contact
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3239001 | 1982-10-21 | ||
DE3300664 | 1983-01-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH661129A5 true CH661129A5 (de) | 1987-06-30 |
Family
ID=25805254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH566183A CH661129A5 (de) | 1982-10-21 | 1983-10-18 | Kontaktiervorrichtung. |
Country Status (3)
Country | Link |
---|---|
CH (1) | CH661129A5 (nl) |
FR (1) | FR2535064B1 (nl) |
NL (1) | NL8303621A (nl) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998001906A1 (en) * | 1996-07-05 | 1998-01-15 | Formfactor, Inc. | Floating lateral support for ends of elongate interconnection elements |
WO1998052224A1 (en) * | 1997-05-15 | 1998-11-19 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
DE19811795C1 (de) * | 1998-03-18 | 1999-09-02 | Atg Test Systems Gmbh | Nadel für einen Prüfadapter |
US6945827B2 (en) | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
US7122760B2 (en) | 2002-11-25 | 2006-10-17 | Formfactor, Inc. | Using electric discharge machining to manufacture probes |
DE102008023761A1 (de) * | 2008-05-09 | 2009-11-12 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
US7714235B1 (en) | 1997-05-06 | 2010-05-11 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4535536A (en) * | 1983-11-03 | 1985-08-20 | Augat Inc. | Method of assembling adaptor for automatic testing equipment |
US4609243A (en) * | 1983-11-03 | 1986-09-02 | Augat Inc. | Adaptor for automatic testing equipment |
JP2000502812A (ja) * | 1996-09-13 | 2000-03-07 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | ウエハ・レベルのテストおよびバーンインのための集積化コンプライアント・プローブ |
IT1290127B1 (it) * | 1997-03-19 | 1998-10-19 | Circuit Line Spa | Ago rigido per il test elettrico di circuiti stampati |
DE19748823B4 (de) * | 1997-11-05 | 2005-09-08 | Feinmetall Gmbh | Servicefreundliche Kontaktiervorrichtung |
EP0915344B1 (de) * | 1997-11-05 | 2004-02-25 | Feinmetall GmbH | Prüfkopf für Mikrostrukturen mit Schnittstelle |
IT1317517B1 (it) * | 2000-05-11 | 2003-07-09 | Technoprobe S R L | Testa di misura per microstrutture |
DE60312692T2 (de) | 2003-10-13 | 2007-12-06 | Technoprobe S.P.A, Cernusco Lombardone | Prüfkopf mit vertikalen Prüfnadeln für integrierte Halbleitergeräte |
CN101160531A (zh) * | 2005-04-12 | 2008-04-09 | 科技探索有限公司 | 用于具有半导体集成电子装置用的垂直探针的测试头的接触探针 |
EP2060921A1 (en) * | 2007-11-16 | 2009-05-20 | Technoprobe S.p.A | Contact probe for testing head having vertical probes and related testing head for testing microstructure electric performance |
JP6832661B2 (ja) * | 2016-09-28 | 2021-02-24 | 株式会社日本マイクロニクス | プローブカード及び接触検査装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1790052B1 (de) * | 1968-09-02 | 1972-01-13 | Siemens Ag | Kontaktvorrichtung zum abtasten von kontaktstellen |
DE2839982C2 (de) * | 1978-09-14 | 1984-01-05 | Feinmetall Gmbh, 7033 Herrenberg | Federnder Kontaktbaustein |
FR2511197A1 (fr) * | 1981-08-05 | 1983-02-11 | Cii Honeywell Bull | Connecteur electrique a contacts droits, notamment pour supports de circuits electroniques a forte densite de bornes de sortie |
-
1983
- 1983-10-18 CH CH566183A patent/CH661129A5/de not_active IP Right Cessation
- 1983-10-20 NL NL8303621A patent/NL8303621A/nl not_active Application Discontinuation
- 1983-10-21 FR FR8316748A patent/FR2535064B1/fr not_active Expired
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998001906A1 (en) * | 1996-07-05 | 1998-01-15 | Formfactor, Inc. | Floating lateral support for ends of elongate interconnection elements |
US7714235B1 (en) | 1997-05-06 | 2010-05-11 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
WO1998052224A1 (en) * | 1997-05-15 | 1998-11-19 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
DE19811795C1 (de) * | 1998-03-18 | 1999-09-02 | Atg Test Systems Gmbh | Nadel für einen Prüfadapter |
US7122760B2 (en) | 2002-11-25 | 2006-10-17 | Formfactor, Inc. | Using electric discharge machining to manufacture probes |
US7488917B2 (en) | 2002-11-25 | 2009-02-10 | Formfactor, Inc. | Electric discharge machining of a probe array |
US6945827B2 (en) | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
US7731546B2 (en) | 2002-12-23 | 2010-06-08 | Formfactor, Inc. | Microelectronic contact structure |
DE102008023761A1 (de) * | 2008-05-09 | 2009-11-12 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
US7850460B2 (en) | 2008-05-09 | 2010-12-14 | Feinmetall Gmbh | Electrical contact element for contacting an electrical component under test and contacting apparatus |
DE102008023761B4 (de) * | 2008-05-09 | 2012-10-31 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
DE102008023761B9 (de) * | 2008-05-09 | 2012-11-08 | Feinmetall Gmbh | Elektrisches Kontaktelement zum Berührungskontaktieren von elektrischen Prüflingen sowie entsprechende Kontaktieranordnung |
Also Published As
Publication number | Publication date |
---|---|
FR2535064B1 (fr) | 1987-11-20 |
FR2535064A1 (fr) | 1984-04-27 |
NL8303621A (nl) | 1984-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |