CH558983A - Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens. - Google Patents
Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.Info
- Publication number
- CH558983A CH558983A CH1563572A CH1563572A CH558983A CH 558983 A CH558983 A CH 558983A CH 1563572 A CH1563572 A CH 1563572A CH 1563572 A CH1563572 A CH 1563572A CH 558983 A CH558983 A CH 558983A
- Authority
- CH
- Switzerland
- Prior art keywords
- executing
- wire connection
- semiconductor components
- continuously producing
- continuously
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L24/78—Apparatus for connecting with wire connectors
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- H01L2224/45001—Core members of the connector
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1563572A CH558983A (de) | 1972-10-26 | 1972-10-26 | Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens. |
DE19732353100 DE2353100A1 (de) | 1972-10-26 | 1973-10-23 | Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens |
GB4951873A GB1430666A (en) | 1972-10-26 | 1973-10-24 | Connections for semiconductor components |
FR7338058A FR2204886B3 (hu) | 1972-10-26 | 1973-10-25 | |
GB1838075A GB1464687A (en) | 1972-10-26 | 1975-05-02 | Connections for semiconductor components |
US05/584,369 US3941298A (en) | 1972-10-26 | 1975-06-05 | Process of making wire connections in semi-conductor elements |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1563572A CH558983A (de) | 1972-10-26 | 1972-10-26 | Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens. |
GB1838075A GB1464687A (en) | 1972-10-26 | 1975-05-02 | Connections for semiconductor components |
Publications (1)
Publication Number | Publication Date |
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CH558983A true CH558983A (de) | 1975-02-14 |
Family
ID=62527839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1563572A CH558983A (de) | 1972-10-26 | 1972-10-26 | Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens. |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH558983A (hu) |
DE (1) | DE2353100A1 (hu) |
FR (1) | FR2204886B3 (hu) |
GB (2) | GB1430666A (hu) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2608250C3 (de) * | 1976-02-28 | 1985-06-05 | Telefunken electronic GmbH, 7100 Heilbronn | Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens |
US5644281A (en) * | 1992-04-07 | 1997-07-01 | Rohm Co., Ltd. | Electronic component incorporating solder fuse wire |
JP3459291B2 (ja) * | 1993-09-21 | 2003-10-20 | ローム株式会社 | 半導体チップを備えた電子部品 |
US5295619A (en) * | 1992-05-22 | 1994-03-22 | Rohm Co., Ltd. | Method and apparatus for performing wire bonding by using solder wire |
JP3248778B2 (ja) * | 1993-05-21 | 2002-01-21 | ローム株式会社 | 半田ワイヤーにボール部を形成する方法 |
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1972
- 1972-10-26 CH CH1563572A patent/CH558983A/xx not_active IP Right Cessation
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1973
- 1973-10-23 DE DE19732353100 patent/DE2353100A1/de active Pending
- 1973-10-24 GB GB4951873A patent/GB1430666A/en not_active Expired
- 1973-10-25 FR FR7338058A patent/FR2204886B3/fr not_active Expired
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1975
- 1975-05-02 GB GB1838075A patent/GB1464687A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1430666A (en) | 1976-03-31 |
FR2204886A1 (hu) | 1974-05-24 |
FR2204886B3 (hu) | 1976-09-17 |
DE2353100A1 (de) | 1974-05-09 |
GB1464687A (en) | 1977-02-16 |
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Legal Events
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