FR2204886B3 - - Google Patents

Info

Publication number
FR2204886B3
FR2204886B3 FR7338058A FR7338058A FR2204886B3 FR 2204886 B3 FR2204886 B3 FR 2204886B3 FR 7338058 A FR7338058 A FR 7338058A FR 7338058 A FR7338058 A FR 7338058A FR 2204886 B3 FR2204886 B3 FR 2204886B3
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7338058A
Other languages
French (fr)
Other versions
FR2204886A1 (hu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Esec Sales SA
Original Assignee
Esec Sales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales SA filed Critical Esec Sales SA
Publication of FR2204886A1 publication Critical patent/FR2204886A1/fr
Application granted granted Critical
Publication of FR2204886B3 publication Critical patent/FR2204886B3/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/78—Apparatus for connecting with wire connectors
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
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    • H01L2224/45015—Cross-sectional shape being circular
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    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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    • H01L2924/20—Parameters
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    • H01L2924/20752—Diameter ranges larger or equal to 20 microns less than 30 microns

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
FR7338058A 1972-10-26 1973-10-25 Expired FR2204886B3 (hu)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1563572A CH558983A (de) 1972-10-26 1972-10-26 Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.
GB1838075A GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components

Publications (2)

Publication Number Publication Date
FR2204886A1 FR2204886A1 (hu) 1974-05-24
FR2204886B3 true FR2204886B3 (hu) 1976-09-17

Family

ID=62527839

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7338058A Expired FR2204886B3 (hu) 1972-10-26 1973-10-25

Country Status (4)

Country Link
CH (1) CH558983A (hu)
DE (1) DE2353100A1 (hu)
FR (1) FR2204886B3 (hu)
GB (2) GB1430666A (hu)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608250C3 (de) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
JP3459291B2 (ja) * 1993-09-21 2003-10-20 ローム株式会社 半導体チップを備えた電子部品
US5644281A (en) * 1992-04-07 1997-07-01 Rohm Co., Ltd. Electronic component incorporating solder fuse wire
US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP3248778B2 (ja) * 1993-05-21 2002-01-21 ローム株式会社 半田ワイヤーにボール部を形成する方法

Also Published As

Publication number Publication date
GB1464687A (en) 1977-02-16
FR2204886A1 (hu) 1974-05-24
GB1430666A (en) 1976-03-31
CH558983A (de) 1975-02-14
DE2353100A1 (de) 1974-05-09

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