CH558983A - Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens. - Google Patents

Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.

Info

Publication number
CH558983A
CH558983A CH1563572A CH1563572A CH558983A CH 558983 A CH558983 A CH 558983A CH 1563572 A CH1563572 A CH 1563572A CH 1563572 A CH1563572 A CH 1563572A CH 558983 A CH558983 A CH 558983A
Authority
CH
Switzerland
Prior art keywords
executing
wire connection
semiconductor components
continuously producing
continuously
Prior art date
Application number
CH1563572A
Other languages
English (en)
Original Assignee
Esec Sales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales Sa filed Critical Esec Sales Sa
Priority to CH1563572A priority Critical patent/CH558983A/de
Priority to DE19732353100 priority patent/DE2353100A1/de
Priority to GB4951873A priority patent/GB1430666A/en
Priority to FR7338058A priority patent/FR2204886B3/fr
Publication of CH558983A publication Critical patent/CH558983A/de
Priority to GB1838075A priority patent/GB1464687A/en
Priority to US05/584,369 priority patent/US3941298A/en

Links

Classifications

    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
CH1563572A 1972-10-26 1972-10-26 Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens. CH558983A (de)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1563572A CH558983A (de) 1972-10-26 1972-10-26 Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.
DE19732353100 DE2353100A1 (de) 1972-10-26 1973-10-23 Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens
GB4951873A GB1430666A (en) 1972-10-26 1973-10-24 Connections for semiconductor components
FR7338058A FR2204886B3 (de) 1972-10-26 1973-10-25
GB1838075A GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components
US05/584,369 US3941298A (en) 1972-10-26 1975-06-05 Process of making wire connections in semi-conductor elements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1563572A CH558983A (de) 1972-10-26 1972-10-26 Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.
GB1838075A GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components

Publications (1)

Publication Number Publication Date
CH558983A true CH558983A (de) 1975-02-14

Family

ID=62527839

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1563572A CH558983A (de) 1972-10-26 1972-10-26 Verfahren zum fortlaufenden herstellen mindestens einer drahtverbindung in halbleiter-bauteilen und vorrichtung zur ausfuehrung des verfahrens.

Country Status (4)

Country Link
CH (1) CH558983A (de)
DE (1) DE2353100A1 (de)
FR (1) FR2204886B3 (de)
GB (2) GB1430666A (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608250C3 (de) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zum Thermokompressions-Verbinden von auf Halbleiterkörpern befindlichen Metall-Anschlußkontakten mit zugeordneten Gehäuseanschlußteilen und Vorrichtung zur Durchführung des Verfahrens
US5644281A (en) * 1992-04-07 1997-07-01 Rohm Co., Ltd. Electronic component incorporating solder fuse wire
JP3459291B2 (ja) * 1993-09-21 2003-10-20 ローム株式会社 半導体チップを備えた電子部品
US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP3248778B2 (ja) * 1993-05-21 2002-01-21 ローム株式会社 半田ワイヤーにボール部を形成する方法

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Publication number Publication date
DE2353100A1 (de) 1974-05-09
GB1464687A (en) 1977-02-16
GB1430666A (en) 1976-03-31
FR2204886B3 (de) 1976-09-17
FR2204886A1 (de) 1974-05-24

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