GB1430666A - Connections for semiconductor components - Google Patents

Connections for semiconductor components

Info

Publication number
GB1430666A
GB1430666A GB4951873A GB4951873A GB1430666A GB 1430666 A GB1430666 A GB 1430666A GB 4951873 A GB4951873 A GB 4951873A GB 4951873 A GB4951873 A GB 4951873A GB 1430666 A GB1430666 A GB 1430666A
Authority
GB
United Kingdom
Prior art keywords
wire
dies
holders
sphere
conveyer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4951873A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Esec Sales SA
Original Assignee
Esec Sales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales SA filed Critical Esec Sales SA
Publication of GB1430666A publication Critical patent/GB1430666A/en
Expired legal-status Critical Current

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Classifications

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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

1430666 Semi-conductor devices ESEC SALES SA 24 Oct 1973 [26 Oct 1972] 49518/73 Heading H1K In an apparatus (Fig. 1) continuously applying wire connections in succession to semiconductor devices, e.g. a transistor 1, the semiconductor chip 4 is secured to a substrate 2 over a metal electrode, e.g. a collector connection, and the substrate has connecting pins 5, 6 for the base, and emitter electrodes over wires 7<SP>1</SP>, 8<SP>1</SP> attached by thermal compression of a sphere of the end of each wire to the appropriate electrode and pin. Dies 9, 10; 11, 12 movable together to and from the transistor are provided for each connecting wire 7<SP>1</SP>, 8<SP>1</SP>; one of which (9 or 11) being recessed to accommodate the sphere on the wire end and the other of which (10 or 12) is either flat or also recessed to accommodate a sphere. Die 9 or 11 is obliquely faced and grooved to retain part of wire 7<SP>1</SP>, 8<SP>1</SP>; with an aperture leading to a retaining vacuum. The semi-conductor devices are arranged on a horizontally movable conveyer (not shown). Wires 13, 14 (e.g. gold) are paid out over brakes 15, 16 through capillary tubes 17, 18 to a fuse-off device with flame 21, 22 periodically acting on the wire (alternatively a plasma flame or arc may be used). The wire 13, 14 is clamped by vacuum to holders 23, 24, mechanically interconnected with the capillary tubes 17, 18 for axial displacement of the wire, while the holders are independently displaceable perpendicular to the axis; the motions of the holders and dies being obtained by cams (not shown). In operation, at a predetermined instant, dies 9, 10; 11, 12 respectively impress the wire end spheres on the chip 4 in the required positions P3, P4 and also impress the remaining spheres on pins 5, 6; the component 1 being heated to 300-360‹ C. to achieve mechanical and electrical connection. Simultaneously the pay-out wires with fused end spheres are positioned at P 1 , P 2 at a pre-set distance from the required positions P 3 , P 4 and flamed at 21, 22 to produce a detached sphere ended piece of the required length which is held at 23, 24 while wire supply 13, 14 is held by capillaries 17, 18. Thereafter, dies 9, 10; 11, 12 are raised and separated (Fig. 2) and holders 23, 24 are translated downwards, while the semi-conductor component 1 with wire connections is removed by the conveyer and a further component is presented (Fig. 1). Capillaries 17, 18 are displaced axially towards dies 9, 10; 11, 12 over distances B 1 , B 2 and wire 13, 14 is paid out from the supply until the end sphere is positioned at P 1 , P 2 (Fig. 3) and the wire is held by brake 15, 16. As capillary 17, 18 advances, holders 23, 24 are also displaced over distance B 1 , B 2 to a new position wherein the wire end spheres register with dies 9, 10; 11, 12 perpendicularly to the axis. The holders are then displaced perpendicularly to the axis so that a sphere rests in a recess of dies 9, 11 and the wire rests in the groove thereof by vacuum retention. The holders and capillaries are removed leaving the wires in situ (Fig. 4) and the dies 9, 10; 11, 12 are lowered to attach the sphere ends to the electrodes and pins by thermocompression. Simultaneously further wires are prepared by fusion (Fig. 1) and the process is recommenced for a third semi-conductor device presented by the conveyer. The cam drives for dies 9, 10; 11, 12; capillaries 17, 18 and holders 23, 24 also operate valves for vacuum in dies 9, 11 and holders 23, 24. The conveyer may be controlled mechanically, electrically, pneumatically or hydraulically for complete automation, with light projection manipulation control for setting the semi-conductor devices accurately on the conveyer. The process is also applicable to single wire connections, e.g. for luminous diodes. The wire connections may be angled or of different lengths.
GB4951873A 1972-10-26 1973-10-24 Connections for semiconductor components Expired GB1430666A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1563572A CH558983A (en) 1972-10-26 1972-10-26 PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS.
GB1838075A GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components

Publications (1)

Publication Number Publication Date
GB1430666A true GB1430666A (en) 1976-03-31

Family

ID=62527839

Family Applications (2)

Application Number Title Priority Date Filing Date
GB4951873A Expired GB1430666A (en) 1972-10-26 1973-10-24 Connections for semiconductor components
GB1838075A Expired GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1838075A Expired GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components

Country Status (4)

Country Link
CH (1) CH558983A (en)
DE (1) DE2353100A1 (en)
FR (1) FR2204886B3 (en)
GB (2) GB1430666A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608250C3 (en) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Method for thermocompression joining of metal connection contacts located on semiconductor bodies with associated housing connection parts and device for carrying out the method
JP3459291B2 (en) * 1993-09-21 2003-10-20 ローム株式会社 Electronic components with semiconductor chips
US5644281A (en) * 1992-04-07 1997-07-01 Rohm Co., Ltd. Electronic component incorporating solder fuse wire
US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP3248778B2 (en) * 1993-05-21 2002-01-21 ローム株式会社 Method of forming ball part on solder wire

Also Published As

Publication number Publication date
GB1464687A (en) 1977-02-16
CH558983A (en) 1975-02-14
FR2204886A1 (en) 1974-05-24
DE2353100A1 (en) 1974-05-09
FR2204886B3 (en) 1976-09-17

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