CH558983A - PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS. - Google Patents

PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS.

Info

Publication number
CH558983A
CH558983A CH1563572A CH1563572A CH558983A CH 558983 A CH558983 A CH 558983A CH 1563572 A CH1563572 A CH 1563572A CH 1563572 A CH1563572 A CH 1563572A CH 558983 A CH558983 A CH 558983A
Authority
CH
Switzerland
Prior art keywords
executing
wire connection
semiconductor components
continuously producing
continuously
Prior art date
Application number
CH1563572A
Other languages
German (de)
Original Assignee
Esec Sales Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Esec Sales Sa filed Critical Esec Sales Sa
Priority to CH1563572A priority Critical patent/CH558983A/en
Priority to DE19732353100 priority patent/DE2353100A1/en
Priority to GB4951873A priority patent/GB1430666A/en
Priority to FR7338058A priority patent/FR2204886B3/fr
Publication of CH558983A publication Critical patent/CH558983A/en
Priority to GB1838075A priority patent/GB1464687A/en
Priority to US05/584,369 priority patent/US3941298A/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45015Cross-sectional shape being circular
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    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
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    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
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    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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    • H01L2224/85043Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a flame torch, e.g. hydrogen torch
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
CH1563572A 1972-10-26 1972-10-26 PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS. CH558983A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CH1563572A CH558983A (en) 1972-10-26 1972-10-26 PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS.
DE19732353100 DE2353100A1 (en) 1972-10-26 1973-10-23 PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR CARRYING OUT THE PROCESS
GB4951873A GB1430666A (en) 1972-10-26 1973-10-24 Connections for semiconductor components
FR7338058A FR2204886B3 (en) 1972-10-26 1973-10-25
GB1838075A GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components
US05/584,369 US3941298A (en) 1972-10-26 1975-06-05 Process of making wire connections in semi-conductor elements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1563572A CH558983A (en) 1972-10-26 1972-10-26 PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS.
GB1838075A GB1464687A (en) 1972-10-26 1975-05-02 Connections for semiconductor components

Publications (1)

Publication Number Publication Date
CH558983A true CH558983A (en) 1975-02-14

Family

ID=62527839

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1563572A CH558983A (en) 1972-10-26 1972-10-26 PROCESS FOR CONTINUOUSLY PRODUCING AT LEAST ONE WIRE CONNECTION IN SEMICONDUCTOR COMPONENTS AND DEVICE FOR EXECUTING THE PROCESS.

Country Status (4)

Country Link
CH (1) CH558983A (en)
DE (1) DE2353100A1 (en)
FR (1) FR2204886B3 (en)
GB (2) GB1430666A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608250C3 (en) * 1976-02-28 1985-06-05 Telefunken electronic GmbH, 7100 Heilbronn Method for thermocompression joining of metal connection contacts located on semiconductor bodies with associated housing connection parts and device for carrying out the method
US5644281A (en) * 1992-04-07 1997-07-01 Rohm Co., Ltd. Electronic component incorporating solder fuse wire
JP3459291B2 (en) * 1993-09-21 2003-10-20 ローム株式会社 Electronic components with semiconductor chips
US5295619A (en) * 1992-05-22 1994-03-22 Rohm Co., Ltd. Method and apparatus for performing wire bonding by using solder wire
JP3248778B2 (en) * 1993-05-21 2002-01-21 ローム株式会社 Method of forming ball part on solder wire

Also Published As

Publication number Publication date
FR2204886B3 (en) 1976-09-17
GB1430666A (en) 1976-03-31
FR2204886A1 (en) 1974-05-24
GB1464687A (en) 1977-02-16
DE2353100A1 (en) 1974-05-09

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