CH545177A - Device for cutting semiconductor rods, in particular silicon rods, into wafers - Google Patents

Device for cutting semiconductor rods, in particular silicon rods, into wafers

Info

Publication number
CH545177A
CH545177A CH1493872A CH1493872A CH545177A CH 545177 A CH545177 A CH 545177A CH 1493872 A CH1493872 A CH 1493872A CH 1493872 A CH1493872 A CH 1493872A CH 545177 A CH545177 A CH 545177A
Authority
CH
Switzerland
Prior art keywords
rods
wafers
particular silicon
cutting semiconductor
silicon rods
Prior art date
Application number
CH1493872A
Other languages
German (de)
Inventor
Stut Hans
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH545177A publication Critical patent/CH545177A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/008—Accessories specially designed for sawing machines or sawing devices comprising computers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/10—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with provision for measuring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CH1493872A 1972-01-31 1972-10-12 Device for cutting semiconductor rods, in particular silicon rods, into wafers CH545177A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722204491 DE2204491C3 (en) 1972-01-31 1972-01-31 Measurement control of a silicon saw via an auxiliary spindle

Publications (1)

Publication Number Publication Date
CH545177A true CH545177A (en) 1973-12-15

Family

ID=5834584

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1493872A CH545177A (en) 1972-01-31 1972-10-12 Device for cutting semiconductor rods, in particular silicon rods, into wafers

Country Status (4)

Country Link
CH (1) CH545177A (en)
DE (1) DE2204491C3 (en)
FR (1) FR2170679A5 (en)
GB (1) GB1394707A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
JPH0767692B2 (en) * 1989-09-07 1995-07-26 株式会社東京精密 Cutting method of slicing machine
DE69501394T2 (en) * 1994-02-07 1998-07-16 Struers As DEVICE FOR CUTTING MATERIAL SAMPLES FROM A SAMPLE BODY
CN109482967B (en) * 2018-11-26 2023-09-26 安徽昊方机电股份有限公司 Extension fixture for sawing machine material rod

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
FR1294795A (en) * 1961-04-17 1962-06-01 Landis Gendron S A Very precise feed device and its application to a machine for sawing silicon single crystals
DE1217840B (en) * 1961-07-24 1966-05-26 Telefunken Patent Inner hole saw device
US3577861A (en) * 1969-04-07 1971-05-11 Kayex Corp Transfer device for cutting apparatus

Also Published As

Publication number Publication date
FR2170679A5 (en) 1973-09-14
GB1394707A (en) 1975-05-21
DE2204491A1 (en) 1973-08-09
DE2204491C3 (en) 1981-02-26
DE2204491B2 (en) 1980-06-19

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Legal Events

Date Code Title Description
PL Patent ceased