CH545177A - Vorrichtung zum Schneiden von Halbleiterstäben, insbesondere Siliciumstäben, in Scheiben - Google Patents
Vorrichtung zum Schneiden von Halbleiterstäben, insbesondere Siliciumstäben, in ScheibenInfo
- Publication number
- CH545177A CH545177A CH1493872A CH1493872A CH545177A CH 545177 A CH545177 A CH 545177A CH 1493872 A CH1493872 A CH 1493872A CH 1493872 A CH1493872 A CH 1493872A CH 545177 A CH545177 A CH 545177A
- Authority
- CH
- Switzerland
- Prior art keywords
- rods
- wafers
- particular silicon
- cutting semiconductor
- silicon rods
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/008—Accessories specially designed for sawing machines or sawing devices comprising computers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
- B28D1/10—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with provision for measuring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19722204491 DE2204491C3 (de) | 1972-01-31 | 1972-01-31 | Meßsteuerung einer Siliciumsäge über eine Hilfsspindel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH545177A true CH545177A (de) | 1973-12-15 |
Family
ID=5834584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1493872A CH545177A (de) | 1972-01-31 | 1972-10-12 | Vorrichtung zum Schneiden von Halbleiterstäben, insbesondere Siliciumstäben, in Scheiben |
Country Status (4)
| Country | Link |
|---|---|
| CH (1) | CH545177A (de) |
| DE (1) | DE2204491C3 (de) |
| FR (1) | FR2170679A5 (de) |
| GB (1) | GB1394707A (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949700A (en) * | 1987-12-17 | 1990-08-21 | Tokyou Seimitsu Co., Ltd. | Ingot support device in slicing apparatus |
| JPH0767692B2 (ja) * | 1989-09-07 | 1995-07-26 | 株式会社東京精密 | スライシングマシンの切断方法 |
| DE69501394T2 (de) * | 1994-02-07 | 1998-07-16 | Struers As | Vorrichtung zum schneiden von materialproben von einem probenkörper |
| CN109482967B (zh) * | 2018-11-26 | 2023-09-26 | 安徽昊方机电股份有限公司 | 一种锯床料棒的延长夹具 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3039235A (en) * | 1961-01-31 | 1962-06-19 | Hamco Mach & Elect Co | Cutting apparatus |
| FR1294795A (fr) * | 1961-04-17 | 1962-06-01 | Landis Gendron S A | Dispositif d'avance très précis et son application à une machine à scier les monocristaux de silicium |
| DE1217840B (de) * | 1961-07-24 | 1966-05-26 | Telefunken Patent | Innenlochsaegevorrichtung |
| US3577861A (en) * | 1969-04-07 | 1971-05-11 | Kayex Corp | Transfer device for cutting apparatus |
-
1972
- 1972-01-31 DE DE19722204491 patent/DE2204491C3/de not_active Expired
- 1972-10-12 CH CH1493872A patent/CH545177A/de not_active IP Right Cessation
- 1972-12-18 GB GB5830172A patent/GB1394707A/en not_active Expired
-
1973
- 1973-01-25 FR FR7302602A patent/FR2170679A5/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB1394707A (en) | 1975-05-21 |
| DE2204491C3 (de) | 1981-02-26 |
| DE2204491A1 (de) | 1973-08-09 |
| DE2204491B2 (de) | 1980-06-19 |
| FR2170679A5 (de) | 1973-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |