FR2170679A5 - - Google Patents

Info

Publication number
FR2170679A5
FR2170679A5 FR7302602A FR7302602A FR2170679A5 FR 2170679 A5 FR2170679 A5 FR 2170679A5 FR 7302602 A FR7302602 A FR 7302602A FR 7302602 A FR7302602 A FR 7302602A FR 2170679 A5 FR2170679 A5 FR 2170679A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7302602A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of FR2170679A5 publication Critical patent/FR2170679A5/fr
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • B23D59/001Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00Accessories specially designed for sawing machines or sawing devices
    • B23D59/008Accessories specially designed for sawing machines or sawing devices comprising computers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/10Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with provision for measuring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
FR7302602A 1972-01-31 1973-01-25 Expired FR2170679A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19722204491 DE2204491C3 (de) 1972-01-31 1972-01-31 Meßsteuerung einer Siliciumsäge über eine Hilfsspindel

Publications (1)

Publication Number Publication Date
FR2170679A5 true FR2170679A5 (fr) 1973-09-14

Family

ID=5834584

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7302602A Expired FR2170679A5 (fr) 1972-01-31 1973-01-25

Country Status (4)

Country Link
CH (1) CH545177A (fr)
DE (1) DE2204491C3 (fr)
FR (1) FR2170679A5 (fr)
GB (1) GB1394707A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417644A2 (fr) * 1989-09-07 1991-03-20 Tokyo Seimitsu Co.,Ltd. Dispositif pour découper du matériel cylindrique en plaquettes

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4949700A (en) * 1987-12-17 1990-08-21 Tokyou Seimitsu Co., Ltd. Ingot support device in slicing apparatus
JPH09508326A (ja) * 1994-02-07 1997-08-26 ストルエルス アクチェ セルスカプ 試料から物質構造サンプルを切断するための装置
CN109482967B (zh) * 2018-11-26 2023-09-26 安徽昊方机电股份有限公司 一种锯床料棒的延长夹具

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1294795A (fr) * 1961-04-17 1962-06-01 Landis Gendron S A Dispositif d'avance très précis et son application à une machine à scier les monocristaux de silicium
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
FR1327469A (fr) * 1961-07-24 1963-05-17 Telefunken Patent Procédé et dispositif pour produire des tronçons de matières premières, relativement courts de préférence
FR2038291A1 (fr) * 1969-04-07 1971-01-08 Hamco Mach & Elect Co

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3039235A (en) * 1961-01-31 1962-06-19 Hamco Mach & Elect Co Cutting apparatus
FR1294795A (fr) * 1961-04-17 1962-06-01 Landis Gendron S A Dispositif d'avance très précis et son application à une machine à scier les monocristaux de silicium
FR1327469A (fr) * 1961-07-24 1963-05-17 Telefunken Patent Procédé et dispositif pour produire des tronçons de matières premières, relativement courts de préférence
FR2038291A1 (fr) * 1969-04-07 1971-01-08 Hamco Mach & Elect Co

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0417644A2 (fr) * 1989-09-07 1991-03-20 Tokyo Seimitsu Co.,Ltd. Dispositif pour découper du matériel cylindrique en plaquettes
EP0417644A3 (en) * 1989-09-07 1992-05-27 Tokyo Seimitsu Co.,Ltd. Method of slicing cylindrical material into wafers

Also Published As

Publication number Publication date
DE2204491A1 (de) 1973-08-09
DE2204491B2 (de) 1980-06-19
DE2204491C3 (de) 1981-02-26
CH545177A (de) 1973-12-15
GB1394707A (en) 1975-05-21

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Legal Events

Date Code Title Description
ST Notification of lapse