CH468083A - Method for the shape-changing processing of a crystalline body made of semiconductor material, in particular a silicon single crystal - Google Patents
Method for the shape-changing processing of a crystalline body made of semiconductor material, in particular a silicon single crystalInfo
- Publication number
- CH468083A CH468083A CH196968A CH196968A CH468083A CH 468083 A CH468083 A CH 468083A CH 196968 A CH196968 A CH 196968A CH 196968 A CH196968 A CH 196968A CH 468083 A CH468083 A CH 468083A
- Authority
- CH
- Switzerland
- Prior art keywords
- shape
- single crystal
- semiconductor material
- body made
- silicon single
- Prior art date
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title 1
- 239000013078 crystal Substances 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 229910052710 silicon Inorganic materials 0.000 title 1
- 239000010703 silicon Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
- B23K26/125—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases of mixed gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- High Energy & Nuclear Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH196968A CH468083A (en) | 1968-02-09 | 1968-02-09 | Method for the shape-changing processing of a crystalline body made of semiconductor material, in particular a silicon single crystal |
SE16921/68A SE344390B (en) | 1968-02-09 | 1968-12-11 | |
FR1599490D FR1599490A (en) | 1968-02-09 | 1968-12-27 | |
DE19691901524 DE1901524A1 (en) | 1968-02-09 | 1969-01-14 | Method for the shape-changing processing of a crystalline body made of semiconductor material, in particular a silicon single crystal |
NL6900909A NL6900909A (en) | 1968-02-09 | 1969-01-20 | |
BE728098D BE728098A (en) | 1968-02-09 | 1969-02-07 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH196968A CH468083A (en) | 1968-02-09 | 1968-02-09 | Method for the shape-changing processing of a crystalline body made of semiconductor material, in particular a silicon single crystal |
Publications (1)
Publication Number | Publication Date |
---|---|
CH468083A true CH468083A (en) | 1969-01-31 |
Family
ID=4222835
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH196968A CH468083A (en) | 1968-02-09 | 1968-02-09 | Method for the shape-changing processing of a crystalline body made of semiconductor material, in particular a silicon single crystal |
Country Status (6)
Country | Link |
---|---|
BE (1) | BE728098A (en) |
CH (1) | CH468083A (en) |
DE (1) | DE1901524A1 (en) |
FR (1) | FR1599490A (en) |
NL (1) | NL6900909A (en) |
SE (1) | SE344390B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4092515A (en) * | 1977-04-07 | 1978-05-30 | United Technologies Corporation | Laser method of precision hole drilling |
US4260649A (en) * | 1979-05-07 | 1981-04-07 | The Perkin-Elmer Corporation | Laser induced dissociative chemical gas phase processing of workpieces |
JPS5952037B2 (en) * | 1980-12-26 | 1984-12-17 | 株式会社東芝 | Laser processing equipment |
US4490210A (en) * | 1984-01-24 | 1984-12-25 | International Business Machines Corporation | Laser induced dry chemical etching of metals |
DE3437072A1 (en) * | 1984-10-09 | 1986-04-10 | Dieter Prof. Dr. Linz Bäuerle | METHOD FOR THE PRODUCTION OF CONDUCTOR PATHS AND / OR ELECTRODES ON DIELECTRIC MATERIAL |
DE3437056A1 (en) * | 1984-10-09 | 1986-04-10 | Dieter Prof. Dr. Linz Bäuerle | ETCHING PROCESS FOR BODIES MADE OF DIELECTRIC OXIDE CERAMICS OR DIELECTRIC OXIDIC (ONE) CRYSTALS |
DE19827771A1 (en) * | 1998-06-23 | 2000-01-05 | Rheinzink Gmbh | Connection for square roof penetrations |
-
1968
- 1968-02-09 CH CH196968A patent/CH468083A/en unknown
- 1968-12-11 SE SE16921/68A patent/SE344390B/xx unknown
- 1968-12-27 FR FR1599490D patent/FR1599490A/fr not_active Expired
-
1969
- 1969-01-14 DE DE19691901524 patent/DE1901524A1/en active Pending
- 1969-01-20 NL NL6900909A patent/NL6900909A/xx unknown
- 1969-02-07 BE BE728098D patent/BE728098A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
BE728098A (en) | 1969-08-07 |
SE344390B (en) | 1972-04-10 |
FR1599490A (en) | 1970-07-15 |
NL6900909A (en) | 1969-08-12 |
DE1901524A1 (en) | 1969-08-28 |
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