CH519247A - Stapelförmige Anordnung von Halbleiterkörpern - Google Patents

Stapelförmige Anordnung von Halbleiterkörpern

Info

Publication number
CH519247A
CH519247A CH510271A CH510271A CH519247A CH 519247 A CH519247 A CH 519247A CH 510271 A CH510271 A CH 510271A CH 510271 A CH510271 A CH 510271A CH 519247 A CH519247 A CH 519247A
Authority
CH
Switzerland
Prior art keywords
stacked arrangement
semiconductor bodies
bodies
semiconductor
stacked
Prior art date
Application number
CH510271A
Other languages
German (de)
English (en)
Inventor
Karl-Ulrich Dr Stein
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH519247A publication Critical patent/CH519247A/de

Links

Classifications

    • H10W70/611—
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • H10W90/00—
    • H10W90/401—
    • H10W72/60—
    • H10W90/297—
CH510271A 1970-05-11 1971-04-07 Stapelförmige Anordnung von Halbleiterkörpern CH519247A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19702022895 DE2022895B2 (de) 1970-05-11 1970-05-11 Stapelfoermige anordnung von halbleiterkoerpern und verfahren zu deren herstellung

Publications (1)

Publication Number Publication Date
CH519247A true CH519247A (de) 1972-02-15

Family

ID=5770762

Family Applications (1)

Application Number Title Priority Date Filing Date
CH510271A CH519247A (de) 1970-05-11 1971-04-07 Stapelförmige Anordnung von Halbleiterkörpern

Country Status (8)

Country Link
AT (1) AT322059B (enExample)
CA (1) CA922818A (enExample)
CH (1) CH519247A (enExample)
DE (1) DE2022895B2 (enExample)
FR (1) FR2088490A1 (enExample)
GB (1) GB1300881A (enExample)
NL (1) NL7106459A (enExample)
SE (1) SE369028B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2806685A1 (de) * 1978-02-16 1979-08-23 Siemens Ag Stapelbauweise fuer halbleiter- speicherbausteine
JPS5837948A (ja) * 1981-08-31 1983-03-05 Toshiba Corp 積層半導体記憶装置
GB2150749B (en) * 1983-12-03 1987-09-23 Standard Telephones Cables Ltd Integrated circuits
US4982264A (en) * 1985-02-27 1991-01-01 Texas Instruments Incorporated High density integrated circuit package
DE3640072A1 (de) * 1986-11-24 1988-06-01 Rolf Tiedeken Elektronisches datenspeicherorgan, welches eine anzahl von statischen ram-chips aufweist
FR2645681B1 (fr) * 1989-04-07 1994-04-08 Thomson Csf Dispositif d'interconnexion verticale de pastilles de circuits integres et son procede de fabrication
US5059557A (en) * 1989-08-08 1991-10-22 Texas Instruments Incorporated Method of electrically connecting integrated circuits by edge-insertion in grooved support members
US5696030A (en) * 1994-09-30 1997-12-09 International Business Machines Corporation Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor

Also Published As

Publication number Publication date
SE369028B (enExample) 1974-07-29
DE2022895B2 (de) 1976-12-02
AT322059B (de) 1975-05-12
DE2022895A1 (de) 1971-12-30
FR2088490A1 (enExample) 1972-01-07
CA922818A (en) 1973-03-13
NL7106459A (enExample) 1971-11-15
GB1300881A (en) 1972-12-20

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Legal Events

Date Code Title Description
PL Patent ceased