CH444827A - Verfahren zum Herstellen von Halbleiteranordnungen - Google Patents
Verfahren zum Herstellen von HalbleiteranordnungenInfo
- Publication number
- CH444827A CH444827A CH226066A CH226066A CH444827A CH 444827 A CH444827 A CH 444827A CH 226066 A CH226066 A CH 226066A CH 226066 A CH226066 A CH 226066A CH 444827 A CH444827 A CH 444827A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor devices
- manufacturing semiconductor
- manufacturing
- devices
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02373—Group 14 semiconducting materials
- H01L21/02381—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02529—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S118/00—Coating apparatus
- Y10S118/90—Semiconductor vapor doping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/006—Apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/052—Face to face deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/913—Diverse treatments performed in unitary chamber
Landscapes
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Recrystallisation Techniques (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES95520A DE1287047B (de) | 1965-02-18 | 1965-02-18 | Verfahren und Vorrichtung zum Abscheiden einer einkristallinen Halbleiterschicht |
Publications (1)
Publication Number | Publication Date |
---|---|
CH444827A true CH444827A (de) | 1967-10-15 |
Family
ID=7519442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH226066A CH444827A (de) | 1965-02-18 | 1966-02-16 | Verfahren zum Herstellen von Halbleiteranordnungen |
Country Status (7)
Country | Link |
---|---|
US (1) | US3425878A (de) |
AT (1) | AT258364B (de) |
CH (1) | CH444827A (de) |
DE (1) | DE1287047B (de) |
GB (1) | GB1132491A (de) |
NL (1) | NL6602149A (de) |
SE (1) | SE317652B (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3636919A (en) * | 1969-12-02 | 1972-01-25 | Univ Ohio State | Apparatus for growing films |
DE1769605A1 (de) * | 1968-06-14 | 1971-07-01 | Siemens Ag | Verfahren zum Herstellen epitaktischer Aufwachsschichten aus Halbleitermaterial fuer elektrische Bauelemente |
US3839991A (en) * | 1969-07-17 | 1974-10-08 | Siemens Ag | Apparatus for the production of homogeneous and plane parallel epitactic growth layers of semiconducting compounds by melt epitaxy |
US3648654A (en) * | 1970-03-16 | 1972-03-14 | Bell Telephone Labor Inc | Vertical liquid phase crystal growth apparatus |
DE2229229A1 (de) * | 1972-06-15 | 1974-01-10 | Siemens Ag | Verfahren zum herstellen von aus silizium oder siliziumcarbid bestehenden formkoerpern |
US4171996A (en) * | 1975-08-12 | 1979-10-23 | Gosudarstvenny Nauchno-Issledovatelsky i Proektny Institut Redkonetallicheskoi Promyshlennosti "Giredmet" | Fabrication of a heterogeneous semiconductor structure with composition gradient utilizing a gas phase transfer process |
US4262630A (en) * | 1977-01-04 | 1981-04-21 | Bochkarev Ellin P | Method of applying layers of source substance over recipient and device for realizing same |
US4063529A (en) * | 1977-04-19 | 1977-12-20 | Ellin Petrovich Bochkarev | Device for epitaxial growing of semiconductor periodic structures from gas phase |
US4555303A (en) * | 1984-10-02 | 1985-11-26 | Motorola, Inc. | Oxidation of material in high pressure oxygen plasma |
US4601779A (en) * | 1985-06-24 | 1986-07-22 | International Business Machines Corporation | Method of producing a thin silicon-on-insulator layer |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL265823A (de) * | 1960-06-13 | |||
NL268294A (de) * | 1960-10-10 | |||
NL271345A (de) * | 1960-11-30 | |||
US3172792A (en) * | 1961-07-05 | 1965-03-09 | Epitaxial deposition in a vacuum onto semiconductor wafers through an in- teracttgn between the wafer and the support material | |
US3243323A (en) * | 1962-06-11 | 1966-03-29 | Motorola Inc | Gas etching |
NL296876A (de) * | 1962-08-23 | |||
US3316130A (en) * | 1963-05-07 | 1967-04-25 | Gen Electric | Epitaxial growth of semiconductor devices |
DE1289829B (de) * | 1963-05-09 | 1969-02-27 | Siemens Ag | Verfahren zum Herstellen einer einkristallinen Halbleiterschicht durch Abscheidung aus einem Reaktionsgas |
DE1297085B (de) * | 1964-01-10 | 1969-06-12 | Siemens Ag | Verfahren zum Abscheiden einer einkristallinen Halbleiterschicht |
-
1965
- 1965-02-18 DE DES95520A patent/DE1287047B/de active Pending
-
1966
- 1966-02-16 US US527983A patent/US3425878A/en not_active Expired - Lifetime
- 1966-02-16 CH CH226066A patent/CH444827A/de unknown
- 1966-02-17 GB GB6909/66A patent/GB1132491A/en not_active Expired
- 1966-02-17 AT AT146166A patent/AT258364B/de active
- 1966-02-17 SE SE2076/66A patent/SE317652B/xx unknown
- 1966-02-18 NL NL6602149A patent/NL6602149A/xx unknown
Also Published As
Publication number | Publication date |
---|---|
GB1132491A (en) | 1968-11-06 |
NL6602149A (de) | 1966-08-19 |
US3425878A (en) | 1969-02-04 |
SE317652B (de) | 1969-11-24 |
AT258364B (de) | 1967-11-27 |
DE1287047B (de) | 1969-01-16 |
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