CH489911A - Verfahren zum Kontaktieren von Halbleiteranordnungen - Google Patents

Verfahren zum Kontaktieren von Halbleiteranordnungen

Info

Publication number
CH489911A
CH489911A CH1561567A CH1561567A CH489911A CH 489911 A CH489911 A CH 489911A CH 1561567 A CH1561567 A CH 1561567A CH 1561567 A CH1561567 A CH 1561567A CH 489911 A CH489911 A CH 489911A
Authority
CH
Switzerland
Prior art keywords
semiconductor arrangements
contacting semiconductor
contacting
arrangements
semiconductor
Prior art date
Application number
CH1561567A
Other languages
English (en)
Inventor
Siegbert Dipl Phys Heise
Hans-Joachim Dipl Phys Munte
Hartwin Dipl Phys Obernik
Original Assignee
Werk Fernsehelektronik Veb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Werk Fernsehelektronik Veb filed Critical Werk Fernsehelektronik Veb
Publication of CH489911A publication Critical patent/CH489911A/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated
    • C25D7/12Semiconductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Junction Field-Effect Transistors (AREA)
CH1561567A 1966-11-09 1967-11-08 Verfahren zum Kontaktieren von Halbleiteranordnungen CH489911A (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DD12080766 1966-11-09
DD12606067 1967-07-18
DEV0034439 1967-09-15
GB48292/67A GB1189908A (en) 1966-11-09 1967-10-24 Process for the Contacting of Semi-Conductor Arrangements

Publications (1)

Publication Number Publication Date
CH489911A true CH489911A (de) 1970-04-30

Family

ID=27430180

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1561567A CH489911A (de) 1966-11-09 1967-11-08 Verfahren zum Kontaktieren von Halbleiteranordnungen

Country Status (4)

Country Link
CH (1) CH489911A (de)
DE (1) DE1614982B2 (de)
GB (1) GB1189908A (de)
SU (1) SU664244A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19963550B4 (de) * 1999-12-22 2004-05-06 Epigap Optoelektronik Gmbh Bipolare Beleuchtungsquelle aus einem einseitig kontaktierten, selbstbündelnden Halbleiterkörper
DE102011005743B3 (de) * 2011-03-17 2012-07-26 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Abscheidung einer Metallschicht auf einem Halbleiterbauelement
DE102013217300A1 (de) * 2013-08-30 2014-05-08 Robert Bosch Gmbh MEMS-Bauelement mit einer mikromechanischen Mikrofonstruktur

Also Published As

Publication number Publication date
DE1614982B2 (de) 1974-02-21
DE1614982A1 (de) 1971-02-25
SU664244A1 (ru) 1979-05-25
GB1189908A (en) 1970-04-29

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Legal Events

Date Code Title Description
PL Patent ceased