CH489911A - Verfahren zum Kontaktieren von Halbleiteranordnungen - Google Patents
Verfahren zum Kontaktieren von HalbleiteranordnungenInfo
- Publication number
- CH489911A CH489911A CH1561567A CH1561567A CH489911A CH 489911 A CH489911 A CH 489911A CH 1561567 A CH1561567 A CH 1561567A CH 1561567 A CH1561567 A CH 1561567A CH 489911 A CH489911 A CH 489911A
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor arrangements
- contacting semiconductor
- contacting
- arrangements
- semiconductor
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Junction Field-Effect Transistors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DD12080766 | 1966-11-09 | ||
DD12606067 | 1967-07-18 | ||
DEV0034439 | 1967-09-15 | ||
GB48292/67A GB1189908A (en) | 1966-11-09 | 1967-10-24 | Process for the Contacting of Semi-Conductor Arrangements |
Publications (1)
Publication Number | Publication Date |
---|---|
CH489911A true CH489911A (de) | 1970-04-30 |
Family
ID=27430180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1561567A CH489911A (de) | 1966-11-09 | 1967-11-08 | Verfahren zum Kontaktieren von Halbleiteranordnungen |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH489911A (de) |
DE (1) | DE1614982B2 (de) |
GB (1) | GB1189908A (de) |
SU (1) | SU664244A1 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19963550B4 (de) * | 1999-12-22 | 2004-05-06 | Epigap Optoelektronik Gmbh | Bipolare Beleuchtungsquelle aus einem einseitig kontaktierten, selbstbündelnden Halbleiterkörper |
DE102011005743B3 (de) * | 2011-03-17 | 2012-07-26 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Abscheidung einer Metallschicht auf einem Halbleiterbauelement |
DE102013217300A1 (de) * | 2013-08-30 | 2014-05-08 | Robert Bosch Gmbh | MEMS-Bauelement mit einer mikromechanischen Mikrofonstruktur |
-
1967
- 1967-09-15 DE DE1614982A patent/DE1614982B2/de not_active Ceased
- 1967-10-24 GB GB48292/67A patent/GB1189908A/en not_active Expired
- 1967-11-08 CH CH1561567A patent/CH489911A/de not_active IP Right Cessation
- 1967-11-09 SU SU671196191A patent/SU664244A1/ru active
Also Published As
Publication number | Publication date |
---|---|
DE1614982B2 (de) | 1974-02-21 |
DE1614982A1 (de) | 1971-02-25 |
SU664244A1 (ru) | 1979-05-25 |
GB1189908A (en) | 1970-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |