CH445649A - Verfahren zum Herstellen von Halbleiterschaltungen - Google Patents
Verfahren zum Herstellen von HalbleiterschaltungenInfo
- Publication number
- CH445649A CH445649A CH600466A CH600466A CH445649A CH 445649 A CH445649 A CH 445649A CH 600466 A CH600466 A CH 600466A CH 600466 A CH600466 A CH 600466A CH 445649 A CH445649 A CH 445649A
- Authority
- CH
- Switzerland
- Prior art keywords
- manufacturing semiconductor
- semiconductor circuits
- circuits
- manufacturing
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
- H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0096768 | 1965-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH445649A true CH445649A (de) | 1967-10-31 |
Family
ID=7520280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH600466A CH445649A (de) | 1965-04-26 | 1966-04-25 | Verfahren zum Herstellen von Halbleiterschaltungen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US3494023A (de) |
| AT (1) | AT263083B (de) |
| CH (1) | CH445649A (de) |
| DE (1) | DE1514453A1 (de) |
| GB (1) | GB1101906A (de) |
| NL (1) | NL6605366A (de) |
| SE (1) | SE315951B (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3654000A (en) * | 1969-04-18 | 1972-04-04 | Hughes Aircraft Co | Separating and maintaining original dice position in a wafer |
| US3810300A (en) * | 1969-05-20 | 1974-05-14 | Ferranti Ltd | Electrical circuit assemblies |
| US3679941A (en) * | 1969-09-22 | 1972-07-25 | Gen Electric | Composite integrated circuits including semiconductor chips mounted on a common substrate with connections made through a dielectric encapsulator |
| GB1335201A (en) * | 1970-05-21 | 1973-10-24 | Lucas Industries Ltd | Method of manufacturing semi-conductor devices |
| US3770531A (en) * | 1972-05-04 | 1973-11-06 | Bell Telephone Labor Inc | Bonding substance for the fabrication of integrated circuits |
| US3839783A (en) * | 1972-07-12 | 1974-10-08 | Rodan Ind Inc | Thermistor manufacturing method |
| NL7215200A (de) * | 1972-11-10 | 1974-05-14 | ||
| US4504427A (en) * | 1983-06-17 | 1985-03-12 | At&T Bell Laboratories | Solder preform stabilization for lead frames |
| US6173490B1 (en) * | 1997-08-20 | 2001-01-16 | National Semiconductor Corporation | Method for forming a panel of packaged integrated circuits |
| US6582990B2 (en) * | 2001-08-24 | 2003-06-24 | International Rectifier Corporation | Wafer level underfill and interconnect process |
| WO2009138990A1 (en) * | 2008-05-15 | 2009-11-19 | Pythagoras Solar Inc. | Encapsulation material |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3076051A (en) * | 1959-03-05 | 1963-01-29 | Rca Corp | Thermoelectric devices and methods of making same |
| US3158788A (en) * | 1960-08-15 | 1964-11-24 | Fairchild Camera Instr Co | Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material |
| US3271625A (en) * | 1962-08-01 | 1966-09-06 | Signetics Corp | Electronic package assembly |
| US3307239A (en) * | 1964-02-18 | 1967-03-07 | Bell Telephone Labor Inc | Method of making integrated semiconductor devices |
-
1965
- 1965-04-26 DE DE19651514453 patent/DE1514453A1/de active Pending
-
1966
- 1966-04-21 US US544254A patent/US3494023A/en not_active Expired - Lifetime
- 1966-04-21 NL NL6605366A patent/NL6605366A/xx unknown
- 1966-04-25 AT AT388766A patent/AT263083B/de active
- 1966-04-25 CH CH600466A patent/CH445649A/de unknown
- 1966-04-25 GB GB17956/66A patent/GB1101906A/en not_active Expired
- 1966-04-26 SE SE5674/66A patent/SE315951B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| NL6605366A (de) | 1966-10-27 |
| GB1101906A (en) | 1968-02-07 |
| DE1514453A1 (de) | 1969-08-14 |
| US3494023A (en) | 1970-02-10 |
| SE315951B (de) | 1969-10-13 |
| AT263083B (de) | 1968-07-10 |
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