CH420390A - Verfahren zum Herstellen von Halbleiterbauelementen aus Siliziumkarbid - Google Patents
Verfahren zum Herstellen von Halbleiterbauelementen aus SiliziumkarbidInfo
- Publication number
- CH420390A CH420390A CH917665A CH917665A CH420390A CH 420390 A CH420390 A CH 420390A CH 917665 A CH917665 A CH 917665A CH 917665 A CH917665 A CH 917665A CH 420390 A CH420390 A CH 420390A
- Authority
- CH
- Switzerland
- Prior art keywords
- silicon carbide
- semiconductor components
- manufacturing semiconductor
- manufacturing
- components
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title 1
- 229910010271 silicon carbide Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/107—Melt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/148—Silicon carbide
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/931—Silicon carbide semiconductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US379225A US3308356A (en) | 1964-06-30 | 1964-06-30 | Silicon carbide semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH420390A true CH420390A (de) | 1966-09-15 |
Family
ID=23496340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH917665A CH420390A (de) | 1964-06-30 | 1965-06-30 | Verfahren zum Herstellen von Halbleiterbauelementen aus Siliziumkarbid |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3308356A (de) |
| CH (1) | CH420390A (de) |
| GB (1) | GB1052587A (de) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3458779A (en) * | 1967-11-24 | 1969-07-29 | Gen Electric | Sic p-n junction electroluminescent diode with a donor concentration diminishing from the junction to one surface and an acceptor concentration increasing in the same region |
| DE2519338C3 (de) * | 1975-04-30 | 1979-01-18 | Danfoss A/S, Nordborg (Daenemark) | Verfahren zur Herstellung eines Thermoelements und dessen Anwendung |
| US4947218A (en) * | 1987-11-03 | 1990-08-07 | North Carolina State University | P-N junction diodes in silicon carbide |
| US5298767A (en) * | 1992-10-06 | 1994-03-29 | Kulite Semiconductor Products, Inc. | Porous silicon carbide (SiC) semiconductor device |
| US5929523A (en) * | 1996-03-07 | 1999-07-27 | 3C Semiconductor Corporation | Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC |
| US6388272B1 (en) | 1996-03-07 | 2002-05-14 | Caldus Semiconductor, Inc. | W/WC/TAC ohmic and rectifying contacts on SiC |
| US6204160B1 (en) | 1999-02-22 | 2001-03-20 | The United States Of America As Represented By The Secretary Of The Navy | Method for making electrical contacts and junctions in silicon carbide |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL87348C (de) * | 1954-03-19 | 1900-01-01 | ||
| GB843267A (en) * | 1956-09-14 | 1960-08-04 | Ass Elect Ind | Improvements relating to the preparation of semi-conductor materials |
| DE1073109B (de) * | 1957-08-16 | 1960-01-14 | General Electric Company Sehe nectady, N Y (V St A) | Verfahren zur Her stellung nicht gleichrichtender ohmscher Metallkontakte an Siliziumkarbidkorpern |
| DE1073110B (de) * | 1957-08-16 | 1960-01-14 | General Electric Company, Schenectady, N Y (V St A) | Verfahren zur Herstellung gleichrichtender oder ohmscher Anschlußkontakte an Siliziumkarbidkorpern |
| US2937323A (en) * | 1958-05-29 | 1960-05-17 | Westinghouse Electric Corp | Fused junctions in silicon carbide |
| US2937324A (en) * | 1959-02-05 | 1960-05-17 | Westinghouse Electric Corp | Silicon carbide rectifier |
| US3082126A (en) * | 1959-06-19 | 1963-03-19 | Westinghouse Electric Corp | Producing diffused junctions in silicon carbide |
| US3124454A (en) * | 1961-06-20 | 1964-03-10 | Method of making silicon carbide negative resistance diode |
-
0
- GB GB1052587D patent/GB1052587A/en active Active
-
1964
- 1964-06-30 US US379225A patent/US3308356A/en not_active Expired - Lifetime
-
1965
- 1965-06-30 CH CH917665A patent/CH420390A/de unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3308356A (en) | 1967-03-07 |
| GB1052587A (de) |
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