SE315951B - - Google Patents
Info
- Publication number
- SE315951B SE315951B SE5674/66A SE567466A SE315951B SE 315951 B SE315951 B SE 315951B SE 5674/66 A SE5674/66 A SE 5674/66A SE 567466 A SE567466 A SE 567466A SE 315951 B SE315951 B SE 315951B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/051—Etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/085—Isolated-integrated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Weting (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DES0096768 | 1965-04-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
SE315951B true SE315951B (xx) | 1969-10-13 |
Family
ID=7520280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SE5674/66A SE315951B (xx) | 1965-04-26 | 1966-04-26 |
Country Status (7)
Country | Link |
---|---|
US (1) | US3494023A (xx) |
AT (1) | AT263083B (xx) |
CH (1) | CH445649A (xx) |
DE (1) | DE1514453A1 (xx) |
GB (1) | GB1101906A (xx) |
NL (1) | NL6605366A (xx) |
SE (1) | SE315951B (xx) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3654000A (en) * | 1969-04-18 | 1972-04-04 | Hughes Aircraft Co | Separating and maintaining original dice position in a wafer |
US3810300A (en) * | 1969-05-20 | 1974-05-14 | Ferranti Ltd | Electrical circuit assemblies |
US3679941A (en) * | 1969-09-22 | 1972-07-25 | Gen Electric | Composite integrated circuits including semiconductor chips mounted on a common substrate with connections made through a dielectric encapsulator |
GB1335201A (en) * | 1970-05-21 | 1973-10-24 | Lucas Industries Ltd | Method of manufacturing semi-conductor devices |
US3770531A (en) * | 1972-05-04 | 1973-11-06 | Bell Telephone Labor Inc | Bonding substance for the fabrication of integrated circuits |
US3839783A (en) * | 1972-07-12 | 1974-10-08 | Rodan Ind Inc | Thermistor manufacturing method |
NL7215200A (xx) * | 1972-11-10 | 1974-05-14 | ||
US4504427A (en) * | 1983-06-17 | 1985-03-12 | At&T Bell Laboratories | Solder preform stabilization for lead frames |
US6173490B1 (en) * | 1997-08-20 | 2001-01-16 | National Semiconductor Corporation | Method for forming a panel of packaged integrated circuits |
US6582990B2 (en) * | 2001-08-24 | 2003-06-24 | International Rectifier Corporation | Wafer level underfill and interconnect process |
WO2009138990A1 (en) * | 2008-05-15 | 2009-11-19 | Pythagoras Solar Inc. | Encapsulation material |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3076051A (en) * | 1959-03-05 | 1963-01-29 | Rca Corp | Thermoelectric devices and methods of making same |
US3158788A (en) * | 1960-08-15 | 1964-11-24 | Fairchild Camera Instr Co | Solid-state circuitry having discrete regions of semi-conductor material isolated by an insulating material |
US3271625A (en) * | 1962-08-01 | 1966-09-06 | Signetics Corp | Electronic package assembly |
US3307239A (en) * | 1964-02-18 | 1967-03-07 | Bell Telephone Labor Inc | Method of making integrated semiconductor devices |
-
1965
- 1965-04-26 DE DE19651514453 patent/DE1514453A1/de active Pending
-
1966
- 1966-04-21 NL NL6605366A patent/NL6605366A/xx unknown
- 1966-04-21 US US544254A patent/US3494023A/en not_active Expired - Lifetime
- 1966-04-25 AT AT388766A patent/AT263083B/de active
- 1966-04-25 CH CH600466A patent/CH445649A/de unknown
- 1966-04-25 GB GB17956/66A patent/GB1101906A/en not_active Expired
- 1966-04-26 SE SE5674/66A patent/SE315951B/xx unknown
Also Published As
Publication number | Publication date |
---|---|
DE1514453A1 (de) | 1969-08-14 |
NL6605366A (xx) | 1966-10-27 |
US3494023A (en) | 1970-02-10 |
AT263083B (de) | 1968-07-10 |
GB1101906A (en) | 1968-02-07 |
CH445649A (de) | 1967-10-31 |