CA3005349A1 - Stress reduction interposer for ceramic no-lead surface mount electronic device - Google Patents
Stress reduction interposer for ceramic no-lead surface mount electronic device Download PDFInfo
- Publication number
- CA3005349A1 CA3005349A1 CA3005349A CA3005349A CA3005349A1 CA 3005349 A1 CA3005349 A1 CA 3005349A1 CA 3005349 A CA3005349 A CA 3005349A CA 3005349 A CA3005349 A CA 3005349A CA 3005349 A1 CA3005349 A1 CA 3005349A1
- Authority
- CA
- Canada
- Prior art keywords
- solder
- materials
- cavities
- cavity
- cqfn
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009467 reduction Effects 0.000 title claims abstract description 29
- 239000000919 ceramic Substances 0.000 title description 4
- 229910000679 solder Inorganic materials 0.000 claims abstract description 142
- 239000000463 material Substances 0.000 claims abstract description 106
- 230000008018 melting Effects 0.000 claims abstract description 11
- 238000002844 melting Methods 0.000 claims abstract description 11
- 230000005496 eutectics Effects 0.000 claims description 10
- 229910010293 ceramic material Inorganic materials 0.000 claims 3
- 238000007747 plating Methods 0.000 claims 3
- 230000003044 adaptive effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005382 thermal cycling Methods 0.000 description 2
- 229910016525 CuMo Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
- H01L23/4924—Bases or plates or solder therefor characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49534—Multi-layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/047—Soldering with different solders, e.g. two different solders on two sides of the PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/947,574 US9648729B1 (en) | 2015-11-20 | 2015-11-20 | Stress reduction interposer for ceramic no-lead surface mount electronic device |
US14/947,574 | 2015-11-20 | ||
PCT/US2016/062700 WO2017087762A1 (en) | 2015-11-20 | 2016-11-18 | Stress reduction interposer for ceramic no-lead surface mount electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
CA3005349A1 true CA3005349A1 (en) | 2017-05-26 |
Family
ID=57485947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA3005349A Pending CA3005349A1 (en) | 2015-11-20 | 2016-11-18 | Stress reduction interposer for ceramic no-lead surface mount electronic device |
Country Status (9)
Country | Link |
---|---|
US (1) | US9648729B1 (es) |
EP (1) | EP3378290A1 (es) |
JP (1) | JP6599556B2 (es) |
KR (1) | KR20180089407A (es) |
CA (1) | CA3005349A1 (es) |
IL (1) | IL258859B (es) |
MX (1) | MX2018005616A (es) |
TW (1) | TWI705542B (es) |
WO (1) | WO2017087762A1 (es) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11508669B2 (en) | 2019-08-30 | 2022-11-22 | Nxp B.V. | Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials |
US11532593B2 (en) | 2020-09-30 | 2022-12-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Embedded stress absorber in package |
CN116779584B (zh) * | 2023-08-21 | 2023-11-03 | 湖南大学 | 一种低芯片温度梯度的功率半导体模块封装结构及方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5188985A (en) | 1991-03-29 | 1993-02-23 | Aegis, Inc. | Surface mount device with high thermal conductivity |
MY112145A (en) | 1994-07-11 | 2001-04-30 | Ibm | Direct attachment of heat sink attached directly to flip chip using flexible epoxy |
DE19524739A1 (de) | 1994-11-17 | 1996-05-23 | Fraunhofer Ges Forschung | Kernmetall-Lothöcker für die Flip-Chip-Technik |
JPH11163225A (ja) * | 1997-11-25 | 1999-06-18 | Ngk Spark Plug Co Ltd | 中継基板、ic実装基板と中継基板との接続体、ic実装基板と中継基板と取付基板とからなる構造体 |
USD423532S (en) | 1998-10-21 | 2000-04-25 | Ngk Spark Plug Co., Ltd. | Solder column interposer |
JP3792445B2 (ja) * | 1999-03-30 | 2006-07-05 | 日本特殊陶業株式会社 | コンデンサ付属配線基板 |
US6276593B1 (en) | 1999-07-12 | 2001-08-21 | Agere Systems Guardian Corp. | Apparatus and method for solder attachment of high powered transistors to base heatsink |
US6774315B1 (en) | 2000-05-24 | 2004-08-10 | International Business Machines Corporation | Floating interposer |
US6663399B2 (en) | 2001-01-31 | 2003-12-16 | High Connection Density, Inc. | Surface mount attachable land grid array connector and method of forming same |
TWI245402B (en) | 2002-01-07 | 2005-12-11 | Megic Corp | Rod soldering structure and manufacturing process thereof |
US7245022B2 (en) | 2003-11-25 | 2007-07-17 | International Business Machines Corporation | Semiconductor module with improved interposer structure and method for forming the same |
CN100485913C (zh) | 2004-02-24 | 2009-05-06 | 揖斐电株式会社 | 半导体搭载用基板 |
JP4343044B2 (ja) * | 2004-06-30 | 2009-10-14 | 新光電気工業株式会社 | インターポーザ及びその製造方法並びに半導体装置 |
JP5157455B2 (ja) | 2006-01-16 | 2013-03-06 | 日本電気株式会社 | 半導体装置 |
EP1916884B1 (en) | 2006-10-27 | 2011-04-06 | Agie Charmilles SA | Circuit board unit and method for production thereof |
JP2008283043A (ja) * | 2007-05-11 | 2008-11-20 | Toppan Printing Co Ltd | 多層配線板およびその製造方法 |
US7892441B2 (en) | 2007-06-01 | 2011-02-22 | General Dynamics Advanced Information Systems, Inc. | Method and apparatus to change solder pad size using a differential pad plating |
US7833897B2 (en) | 2007-07-17 | 2010-11-16 | International Business Machines Corporation | Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface |
KR20090079595A (ko) | 2008-01-18 | 2009-07-22 | 주식회사 케이엠더블유 | 인쇄 회로 기판의 장착 방법 |
JP5107959B2 (ja) * | 2009-04-09 | 2012-12-26 | ルネサスエレクトロニクス株式会社 | 基板 |
US20100314072A1 (en) | 2009-06-11 | 2010-12-16 | Hsing-Chung Lee | Base plate with tailored interface |
US8671560B2 (en) | 2010-03-30 | 2014-03-18 | Research Triangle Institute | In system reflow of low temperature eutectic bond balls |
-
2015
- 2015-11-20 US US14/947,574 patent/US9648729B1/en active Active
-
2016
- 2016-10-21 TW TW105134172A patent/TWI705542B/zh not_active IP Right Cessation
- 2016-11-18 KR KR1020187014738A patent/KR20180089407A/ko unknown
- 2016-11-18 WO PCT/US2016/062700 patent/WO2017087762A1/en active Application Filing
- 2016-11-18 CA CA3005349A patent/CA3005349A1/en active Pending
- 2016-11-18 MX MX2018005616A patent/MX2018005616A/es unknown
- 2016-11-18 EP EP16806407.9A patent/EP3378290A1/en not_active Withdrawn
- 2016-11-18 JP JP2018521614A patent/JP6599556B2/ja not_active Expired - Fee Related
-
2018
- 2018-04-23 IL IL258859A patent/IL258859B/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6599556B2 (ja) | 2019-10-30 |
MX2018005616A (es) | 2018-08-15 |
US20170150596A1 (en) | 2017-05-25 |
KR20180089407A (ko) | 2018-08-08 |
US9648729B1 (en) | 2017-05-09 |
TWI705542B (zh) | 2020-09-21 |
IL258859A (en) | 2018-06-28 |
EP3378290A1 (en) | 2018-09-26 |
IL258859B (en) | 2021-12-01 |
TW201729374A (zh) | 2017-08-16 |
JP2018535551A (ja) | 2018-11-29 |
WO2017087762A1 (en) | 2017-05-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8110915B2 (en) | Open cavity leadless surface mountable package for high power RF applications | |
US7916495B2 (en) | Universal solder pad | |
US20060249852A1 (en) | Flip-chip semiconductor device | |
US20100319974A1 (en) | Printed wiring board, electronic device, and method for manufacturing electronic device | |
US6410861B1 (en) | Low profile interconnect structure | |
JP2006210852A (ja) | 表面実装型回路部品を実装する回路基板及びその製造方法 | |
JP2015082576A (ja) | 電子装置、電子機器及び電子装置の製造方法 | |
US9648729B1 (en) | Stress reduction interposer for ceramic no-lead surface mount electronic device | |
KR102152041B1 (ko) | 높은 신뢰성을 갖는 전자 패키지 구조체, 회로 보드 및 디바이스 | |
US20110174526A1 (en) | Circuit module | |
JP2009105209A (ja) | 電子装置及びその製造方法 | |
US7888790B2 (en) | Bare die package with displacement constraint | |
WO2020147084A1 (zh) | 芯片封装结构、电子设备 | |
US20030202332A1 (en) | Second level packaging interconnection method with improved thermal and reliability performance | |
US6434817B1 (en) | Method for joining an integrated circuit | |
JP6323672B2 (ja) | 半導体装置及びその製造方法 | |
TWI619411B (zh) | 互連結構 | |
JP2004172260A (ja) | 配線基板 | |
US9706662B2 (en) | Adaptive interposer and electronic apparatus | |
US20100053923A1 (en) | Semiconductor device and circuit board assembly | |
TWI528518B (zh) | 基板結構與半導體封裝件 | |
JP2005216878A (ja) | 半導体パッケージ及びその実装構造 | |
JP2008022016A (ja) | 回路モジュール | |
JP2007305652A (ja) | 半導体パッケージ | |
JP2005019692A (ja) | 半導体装置及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request |
Effective date: 20211019 |
|
EEER | Examination request |
Effective date: 20211019 |
|
EEER | Examination request |
Effective date: 20211019 |
|
EEER | Examination request |
Effective date: 20211019 |
|
EEER | Examination request |
Effective date: 20211019 |