CA2901007C - Method of aerosol printing a solder mask ink composition - Google Patents

Method of aerosol printing a solder mask ink composition Download PDF

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Publication number
CA2901007C
CA2901007C CA2901007A CA2901007A CA2901007C CA 2901007 C CA2901007 C CA 2901007C CA 2901007 A CA2901007 A CA 2901007A CA 2901007 A CA2901007 A CA 2901007A CA 2901007 C CA2901007 C CA 2901007C
Authority
CA
Canada
Prior art keywords
solder mask
ink composition
aerosol
solvent
cps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CA2901007A
Other languages
English (en)
French (fr)
Other versions
CA2901007A1 (en
Inventor
Yiliang Wu
Kurt Halfyard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of CA2901007A1 publication Critical patent/CA2901007A1/en
Application granted granted Critical
Publication of CA2901007C publication Critical patent/CA2901007C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/215—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material by passing a medium, e.g. consisting of an air or particle stream, through an ink mist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2081—Compound repelling a metal, e.g. solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
CA2901007A 2014-08-28 2015-08-17 Method of aerosol printing a solder mask ink composition Active CA2901007C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/471,967 US9606430B2 (en) 2014-08-28 2014-08-28 Method of aerosol printing a solder mask ink composition
US14/471967 2014-08-28

Publications (2)

Publication Number Publication Date
CA2901007A1 CA2901007A1 (en) 2016-02-28
CA2901007C true CA2901007C (en) 2018-04-24

Family

ID=54011537

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2901007A Active CA2901007C (en) 2014-08-28 2015-08-17 Method of aerosol printing a solder mask ink composition

Country Status (4)

Country Link
US (2) US9606430B2 (OSRAM)
EP (1) EP2996447B1 (OSRAM)
JP (1) JP6424148B2 (OSRAM)
CA (1) CA2901007C (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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CN107614264B (zh) 2014-12-05 2020-02-04 佛罗里达大学研究基金会有限公司 使用相变材料作为支撑体的3d打印
WO2016130953A1 (en) 2015-02-13 2016-08-18 University Of Florida Research Foundation, Inc. High speed 3d printing system for wound and tissue replacement
TWI600125B (zh) * 2015-05-01 2017-09-21 精材科技股份有限公司 晶片封裝體及其製造方法
US11390835B2 (en) 2015-05-08 2022-07-19 University Of Florida Research Foundation, Inc. Growth media for three-dimensional cell culture
WO2017034591A1 (en) * 2015-08-27 2017-03-02 Intel IP Corporation Robust intermetallic compound layer interface for package in package embedding
US11027483B2 (en) 2015-09-03 2021-06-08 University Of Florida Research Foundation, Inc. Valve incorporating temporary phase change material
WO2017096263A1 (en) 2015-12-04 2017-06-08 University Of Florida Research Foundation, Incorporated Crosslinkable or functionalizable polymers for 3d printing of soft materials
US11124644B2 (en) * 2016-09-01 2021-09-21 University Of Florida Research Foundation, Inc. Organic microgel system for 3D printing of silicone structures
DE102017121726A1 (de) * 2017-09-19 2019-03-21 FELA GmbH Leiterplatte mit Lötstoppschicht und Verfahren zur mindestens abschnittsweisen Beschichtung einer Leiterplatte mit einer Lötstoppschicht
CN112105493B (zh) * 2018-08-27 2023-04-04 惠普发展公司，有限责任合伙企业 接合剂
US20200102468A1 (en) * 2018-10-02 2020-04-02 Xerox Corporation Dielectric ink composition
CN118109082A (zh) * 2024-03-12 2024-05-31 深圳市墨库新材料集团股份有限公司 一种阻焊喷墨墨水及其应用

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4019188A (en) * 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
JPS5975955A (ja) 1982-10-22 1984-04-28 Kansai Paint Co Ltd 自己熱硬化性塗料用樹脂組成物
DE3585901D1 (de) * 1984-02-13 1992-05-27 Iii Jerome J Schmitt Verfahren und vorrichtung fuer gasstrahlniederschlag von leitfaehigen und dielektrischen duennen festfilmen und so hergestellte erzeugnisse.
US5045141A (en) * 1988-07-01 1991-09-03 Amoco Corporation Method of making solderable printed circuits formed without plating
IL94474A (en) * 1989-06-09 1993-07-08 Morton Int Inc Photoimageable compositions
US5229252A (en) * 1989-06-09 1993-07-20 Morton International, Inc. Photoimageable compositions
US6207346B1 (en) * 1997-04-09 2001-03-27 Advanced Coatings International Waterborne photoresists made from urethane acrylates
US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
JP2001013679A (ja) * 1999-04-30 2001-01-19 Toagosei Co Ltd レジスト組成物
JP2000347402A (ja) * 1999-06-02 2000-12-15 Toagosei Co Ltd レジスト組成物
US6458509B1 (en) 1999-04-30 2002-10-01 Toagosei Co., Ltd. Resist compositions
JP2002338612A (ja) 2001-05-11 2002-11-27 Toyobo Co Ltd 光硬化性組成物およびその硬化方法
GB0221893D0 (en) * 2002-09-20 2002-10-30 Avecia Ltd Process
US7439285B2 (en) * 2004-01-23 2008-10-21 Printar Ltd. Liquid thermosetting ink
US20090163615A1 (en) * 2005-08-31 2009-06-25 Izhar Halahmi Uv curable hybridcuring ink jet ink composition and solder mask using the same
US7964032B2 (en) 2006-10-17 2011-06-21 Momentive Performance Materials Inc. Fluorine-free trisiloxane surfactant compositions for use in coatings and printing ink compositions
KR20080069354A (ko) * 2007-01-23 2008-07-28 타무라 카켄 코포레이션 레지스트 잉크, 프린트 배선판 및 레지스트 잉크의 제조방법
NZ585407A (en) * 2007-11-14 2011-10-28 Univ Queensland Device and method for preparing microparticles
JP5295669B2 (ja) * 2008-07-14 2013-09-18 新光電気工業株式会社 配線基板の製造方法
JP5569216B2 (ja) * 2010-07-27 2014-08-13 Ｊｎｃ株式会社 熱硬化性組成物およびその用途
US9796864B2 (en) 2014-08-28 2017-10-24 Xerox Corporation Solder mask ink composition

Also Published As

Publication number Publication date
EP2996447A1 (en) 2016-03-16
JP2016049566A (ja) 2016-04-11
US20160062230A1 (en) 2016-03-03
CA2901007A1 (en) 2016-02-28
JP6424148B2 (ja) 2018-11-14
EP2996447B1 (en) 2022-04-06
US20170136779A1 (en) 2017-05-18
US9840088B2 (en) 2017-12-12
US9606430B2 (en) 2017-03-28

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