CA2757530A1 - Thermoelectric module with insulated substrate - Google Patents

Thermoelectric module with insulated substrate Download PDF

Info

Publication number
CA2757530A1
CA2757530A1 CA2757530A CA2757530A CA2757530A1 CA 2757530 A1 CA2757530 A1 CA 2757530A1 CA 2757530 A CA2757530 A CA 2757530A CA 2757530 A CA2757530 A CA 2757530A CA 2757530 A1 CA2757530 A1 CA 2757530A1
Authority
CA
Canada
Prior art keywords
thermoelectric module
module according
thermoelectric
substrate
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA2757530A
Other languages
English (en)
French (fr)
Inventor
Madalina Andreea Stefan
Kerstin Schierle-Arndt
Guenther Huber
Frank Haass
John Stuart Blackburn
Ivor Wynn Jones
Francis Stackpool
Stephen Heavens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of CA2757530A1 publication Critical patent/CA2757530A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N3/00—Generators in which thermal or kinetic energy is converted into electrical energy by ionisation of a fluid and removal of the charge therefrom

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Non-Adjustable Resistors (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
CA2757530A 2009-04-02 2010-03-31 Thermoelectric module with insulated substrate Abandoned CA2757530A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09157158 2009-04-02
EP09157158.8 2009-04-02
PCT/EP2010/054268 WO2010115792A1 (en) 2009-04-02 2010-03-31 Thermoelectric module with insulated substrate

Publications (1)

Publication Number Publication Date
CA2757530A1 true CA2757530A1 (en) 2010-10-14

Family

ID=42357317

Family Applications (1)

Application Number Title Priority Date Filing Date
CA2757530A Abandoned CA2757530A1 (en) 2009-04-02 2010-03-31 Thermoelectric module with insulated substrate

Country Status (10)

Country Link
US (1) US20120017963A1 (enExample)
EP (1) EP2415090B1 (enExample)
JP (1) JP2012523111A (enExample)
KR (1) KR20120007027A (enExample)
CN (1) CN102449791A (enExample)
CA (1) CA2757530A1 (enExample)
RU (1) RU2011144115A (enExample)
SG (1) SG174559A1 (enExample)
TW (1) TW201042788A (enExample)
WO (1) WO2010115792A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9040339B2 (en) 2013-10-01 2015-05-26 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material
US9276190B2 (en) 2013-10-01 2016-03-01 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material by modified MOCVD

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2011142629A (ru) * 2009-03-24 2013-04-27 Басф Се Самоорганизующиеся термоэлектрические материалы
US9082928B2 (en) 2010-12-09 2015-07-14 Brian Isaac Ashkenazi Next generation thermoelectric device designs and methods of using same
JP2013026334A (ja) * 2011-07-19 2013-02-04 National Institute Of Advanced Industrial & Technology 積層型熱電変換モジュール
US10454013B2 (en) * 2012-11-16 2019-10-22 Micropower Global Limited Thermoelectric device
CN105207529A (zh) * 2015-10-28 2015-12-30 蒋安为 一种红外光发电装置
NO341705B1 (en) * 2016-02-22 2018-01-02 Tegma As Thermoelectric half-cell and method of production
CN107124108A (zh) * 2016-02-25 2017-09-01 西门子公司 热量管理方法、装置及包含大功率发热元件的设备
KR102050138B1 (ko) * 2017-12-07 2019-11-28 한국세라믹기술원 전극층/절연층 다층기판 및 그 제조방법과 이를 포함한 열전발전 모듈
DE102019207227B4 (de) * 2019-05-17 2021-10-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung thermoelektrischer Elemente mit elektrischen Anschlusskontakten sowie ein mit dem Verfahren hergestelltes thermoelektrisches Modul

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794048A (en) * 1987-05-04 1988-12-27 Allied-Signal Inc. Ceramic coated metal substrates for electronic applications
US5209786A (en) * 1990-10-09 1993-05-11 Thermo Electron Technologies Corporation Integrity-enhanced thermoelectrics
US5439528A (en) 1992-12-11 1995-08-08 Miller; Joel Laminated thermo element
US5448109B1 (en) 1994-03-08 1997-10-07 Tellurex Corp Thermoelectric module
JPH09139525A (ja) * 1995-11-15 1997-05-27 Hitachi Chem Co Ltd ペルチェ冷却ユニット構造
US6300150B1 (en) 1997-03-31 2001-10-09 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
JP2000164941A (ja) * 1998-11-30 2000-06-16 Yamaha Corp 熱電変換モジュール
JP2000286467A (ja) * 1999-03-31 2000-10-13 Nhk Spring Co Ltd 電気絶縁材料、モジュールおよびその製造方法
JP3163380B2 (ja) * 1999-08-05 2001-05-08 科学技術庁航空宇宙技術研究所長 電気絶縁材とその製造方法
DE19955788A1 (de) 1999-11-19 2001-05-23 Basf Ag Thermoelektrisch aktive Materialien und diese enthaltende Generatoren
JP3680684B2 (ja) * 2000-03-06 2005-08-10 株式会社村田製作所 絶縁体磁器、セラミック多層基板、セラミック電子部品及び積層セラミック電子部品
JP2002280621A (ja) * 2001-01-15 2002-09-27 Furukawa Electric Co Ltd:The レーザーモジュール、ペルチェモジュールおよびペルチェモジュール一体型ヒートスプレッダー
US6826916B2 (en) * 2001-04-24 2004-12-07 The Furukawa Electric Co., Ltd. Laser module, Peltier module, and Peltier module integrated heat spreader
JP2003174202A (ja) * 2001-09-25 2003-06-20 Sumitomo Electric Ind Ltd 熱電装置とこれを用いた光モジュール及びこれらの製造方法
JP2005033095A (ja) * 2003-07-10 2005-02-03 Hitachi Powdered Metals Co Ltd 熱電変換素子用熱応力緩和パッドの製造方法
KR20070026586A (ko) * 2004-06-17 2007-03-08 아르재 가부시키가이샤 열전변환 모듈
JP2006066822A (ja) * 2004-08-30 2006-03-09 Denso Corp 熱電変換装置
FR2882371B1 (fr) * 2005-02-24 2008-01-18 Centre Nat Rech Scient Materiau composite constitue par une matrice poreuse et des nanoparticules de metal ou d'oxyde de metal
CN1304327C (zh) * 2005-06-22 2007-03-14 中国科学院上海硅酸盐研究所 提高与铜共烧的含钛微波介质陶瓷绝缘电阻率的方法
CN100579929C (zh) * 2005-07-19 2010-01-13 宁波材料技术与工程研究所 纳米复合低熔点玻璃绝缘涂层的制备方法
JP2007035907A (ja) * 2005-07-27 2007-02-08 Kyocera Corp 熱電モジュール
CN100585896C (zh) * 2005-08-02 2010-01-27 株式会社东芝 热电装置及其制造方法
JP4901350B2 (ja) * 2005-08-02 2012-03-21 株式会社東芝 熱電変換装置及びその製造方法
WO2007104603A2 (de) 2006-03-16 2007-09-20 Basf Se Blei-germanium-telluride fuer thermoelektrische anwendungen
CN101421185B (zh) 2006-03-16 2014-05-07 巴斯夫欧洲公司 用于热电应用的掺杂碲化铅

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9040339B2 (en) 2013-10-01 2015-05-26 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material
US9276190B2 (en) 2013-10-01 2016-03-01 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material by modified MOCVD

Also Published As

Publication number Publication date
US20120017963A1 (en) 2012-01-26
WO2010115792A1 (en) 2010-10-14
EP2415090B1 (en) 2013-10-23
SG174559A1 (en) 2011-10-28
RU2011144115A (ru) 2013-05-10
JP2012523111A (ja) 2012-09-27
CN102449791A (zh) 2012-05-09
EP2415090A1 (en) 2012-02-08
KR20120007027A (ko) 2012-01-19
TW201042788A (en) 2010-12-01

Similar Documents

Publication Publication Date Title
EP2415090B1 (en) Thermoelectric module with insulated substrate
EP2415089B1 (en) Thermoelectric material coated with a protective layer
EP1258918B1 (en) Electrostatic chuck member and method of producing the same
Gu et al. A high-throughput strategy to screen interfacial diffusion barrier materials for thermoelectric modules
JP5834256B2 (ja) 熱発電素子、熱発電ユニットおよび熱発電システム
JP2013545298A (ja) 熱電モジュールとその製造方法
CN107955961A (zh) 一种镁合金表面导电防腐涂层的制备方法
Antharam et al. Milliwatt-scale 3D thermoelectric generators via additive screen printing
CN102208377A (zh) 具抗氧化纳米薄膜的散热单元及抗氧化纳米薄膜沉积方法
Schilm et al. TiOx based thermoelectric modules–manufacturing, properties and operational behavior
Talebi et al. Thermoelectric performance of electrophoretically deposited p-type Bi2Te3 film
Su et al. Micro-thermoelectric devices with large output power fabricated on a multi-channel glass template
RU2570429C1 (ru) Термоэлектрический модуль
Talebi et al. Fabrication of n-type Bi2Te3 film using electrophoretic deposition for thermoelectric applications
CN109930186B (zh) 一种方钴矿基热电材料表面Al-Ni-Al复合涂层
Choi et al. Fabrication of aluminum-based thermal radiation plate for thermoelectric module using aluminum anodic oxidization and copper electroplating
Talebi et al. Suspension Characteristics and Electrophoretic Deposition of p-Type Bi2Te3 Films for Thermoelectric Applications
CN105349936A (zh) 一种金属钨表面WAl4-AlN-Al2O3高温绝缘涂层及其制备方法
RU2779038C1 (ru) Способ изготовления батареи трубчатых твердооксидных топливных элементов и батарея, изготовленная заявленным способом
Ullrich et al. Surface characterization of new and aged semiconducting glazes
Weil High-temperature electrical testing of a solid oxide fuel cell cathode contact material
Qiu et al. Effect of hot-press treatment on electrochemically deposited antimony telluride film
Martinez Liquid metal thermal-electric converter electrode development
Puschmann et al. Technological approach for a full thermally sprayed thermoelectric generator
Sommer et al. Low-Cost Glass Coatings on Stainless Steel Foil for Thin-Film Photovoltaics

Legal Events

Date Code Title Description
FZDE Discontinued

Effective date: 20140402