CA2303979A1 - Improved chemical drying and cleaning system - Google Patents

Improved chemical drying and cleaning system Download PDF

Info

Publication number
CA2303979A1
CA2303979A1 CA002303979A CA2303979A CA2303979A1 CA 2303979 A1 CA2303979 A1 CA 2303979A1 CA 002303979 A CA002303979 A CA 002303979A CA 2303979 A CA2303979 A CA 2303979A CA 2303979 A1 CA2303979 A1 CA 2303979A1
Authority
CA
Canada
Prior art keywords
workpiece
liquid
exposed surface
processing liquid
hfe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002303979A
Other languages
English (en)
French (fr)
Inventor
Gary W. Ferrell
John F. Schipper
Robert J. Elson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/034,369 external-priority patent/US5974689A/en
Priority claimed from US09/109,460 external-priority patent/US6119366A/en
Application filed by Individual filed Critical Individual
Publication of CA2303979A1 publication Critical patent/CA2303979A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Solid Materials (AREA)
CA002303979A 1997-09-23 1998-09-22 Improved chemical drying and cleaning system Abandoned CA2303979A1 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US93567197A 1997-09-23 1997-09-23
US08/935,671 1997-09-23
US09/034,369 US5974689A (en) 1997-09-23 1998-03-03 Chemical drying and cleaning system
US09/034,369 1998-03-03
US09/109,460 1998-07-02
US09/109,460 US6119366A (en) 1998-03-03 1998-07-02 Chemical drying and cleaning method
PCT/US1998/019793 WO1999015845A1 (en) 1997-09-23 1998-09-22 Improved chemical drying and cleaning system

Publications (1)

Publication Number Publication Date
CA2303979A1 true CA2303979A1 (en) 1999-04-01

Family

ID=27364636

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002303979A Abandoned CA2303979A1 (en) 1997-09-23 1998-09-22 Improved chemical drying and cleaning system

Country Status (5)

Country Link
EP (1) EP1025409A1 (ja)
JP (1) JP4299966B2 (ja)
CN (1) CN1125963C (ja)
CA (1) CA2303979A1 (ja)
WO (1) WO1999015845A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322633B1 (en) 1999-07-28 2001-11-27 Semitool, Inc. Wafer container cleaning system
US6310018B1 (en) 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
US6372700B1 (en) 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
US20060035475A1 (en) * 2004-08-12 2006-02-16 Applied Materials, Inc. Semiconductor substrate processing apparatus
EP2160456A1 (en) * 2007-06-07 2010-03-10 L'air Liquide-societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Non-flammable solvents for semiconductor applications
US20110139183A1 (en) * 2009-12-11 2011-06-16 Katrina Mikhaylichenko System and method of preventing pattern collapse using low surface tension fluid
CN102425922B (zh) * 2011-11-22 2015-04-08 洛阳伟信电子科技有限公司 一种高洁净度电镀板烘干装置
JP6005702B2 (ja) * 2014-09-18 2016-10-12 株式会社東芝 半導体基板の超臨界乾燥方法および基板処理装置
CN112992740A (zh) * 2021-03-01 2021-06-18 李军平 一种切割晶圆用的清洗设备
CN113369237A (zh) * 2021-06-04 2021-09-10 深圳市创裕达电子有限公司 一种液晶显示屏内部电器元件智能清灰装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553607B2 (ja) * 1973-01-05 1980-01-25
US5226242A (en) * 1992-02-18 1993-07-13 Santa Clara Plastics, Division Of Preco, Inc. Vapor jet dryer apparatus and method
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid

Also Published As

Publication number Publication date
JP4299966B2 (ja) 2009-07-22
CN1284159A (zh) 2001-02-14
WO1999015845A1 (en) 1999-04-01
EP1025409A1 (en) 2000-08-09
JP2001517864A (ja) 2001-10-09
CN1125963C (zh) 2003-10-29

Similar Documents

Publication Publication Date Title
US5974689A (en) Chemical drying and cleaning system
US6119366A (en) Chemical drying and cleaning method
US5456758A (en) Submicron particle removal using liquid nitrogen
US6348101B1 (en) Methods for treating objects
US5685086A (en) Method and apparatus for drying objects using aerosols
KR100452542B1 (ko) 세정물 건조장치 및 건조방법
US5964958A (en) Methods for drying and cleaning objects using aerosols
JP4861609B2 (ja) 有機物質の除去方法および除去装置
WO2006062923A2 (en) Cleaning with electrically charged aerosols
CA2303979A1 (en) Improved chemical drying and cleaning system
WO2014081464A1 (en) Process for removing substances from substrates
CN109326535A (zh) 基板处理方法和基板处理装置
US20090165819A1 (en) Method for treating fine structure, system for treating fine structure, and method for producing electronic device
JP2003234323A (ja) 基板処理装置
JPH10116809A (ja) 洗浄方法及び洗浄システム
KR20020048911A (ko) 화학 필름의 세정 및 건조 방법과 그 장치
KR100487834B1 (ko) 레이저를 이용한 패턴마스크 세정방법 및 장치
KR100765900B1 (ko) 기판의 가장자리 식각장치 및 상기 장치를 구비하는 기판처리 설비, 그리고 기판 처리 방법
US6495215B1 (en) Method and apparatus for processing substrate
EP0886548B1 (en) Method and apparatus for drying and cleaning objects using aerosols
JPH0756323A (ja) 基板洗浄装置
JP3688309B2 (ja) 半導体装置の製造装置と製造方法
KR100868364B1 (ko) 초음파 발생 장치 및 이를 갖는 기판 세정 장치
US20020195130A1 (en) Electrostatic charge-free solvent-type dryer for semiconductor wafers
JP3020360B2 (ja) 電子部品又は精密部品類の洗浄方法及びその装置

Legal Events

Date Code Title Description
FZDE Discontinued