CN1125963C - 改进的化学干燥和净化系统 - Google Patents

改进的化学干燥和净化系统 Download PDF

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Publication number
CN1125963C
CN1125963C CN 98811068 CN98811068A CN1125963C CN 1125963 C CN1125963 C CN 1125963C CN 98811068 CN98811068 CN 98811068 CN 98811068 A CN98811068 A CN 98811068A CN 1125963 C CN1125963 C CN 1125963C
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CN
China
Prior art keywords
workpiece
liquid
exposing
mentioned
treatment fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 98811068
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English (en)
Chinese (zh)
Other versions
CN1284159A (zh
Inventor
格雷·W·费雷尔
罗伯特·J·埃尔森
约翰·F·希珀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/034,369 external-priority patent/US5974689A/en
Priority claimed from US09/109,460 external-priority patent/US6119366A/en
Application filed by Individual filed Critical Individual
Publication of CN1284159A publication Critical patent/CN1284159A/zh
Application granted granted Critical
Publication of CN1125963C publication Critical patent/CN1125963C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Drying Of Solid Materials (AREA)
CN 98811068 1997-09-23 1998-09-22 改进的化学干燥和净化系统 Expired - Fee Related CN1125963C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US93567197A 1997-09-23 1997-09-23
US08/935,671 1997-09-23
US09/034,369 US5974689A (en) 1997-09-23 1998-03-03 Chemical drying and cleaning system
US09/034,369 1998-03-03
US09/109,460 US6119366A (en) 1998-03-03 1998-07-02 Chemical drying and cleaning method
US09/109,460 1998-07-02

Publications (2)

Publication Number Publication Date
CN1284159A CN1284159A (zh) 2001-02-14
CN1125963C true CN1125963C (zh) 2003-10-29

Family

ID=27364636

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 98811068 Expired - Fee Related CN1125963C (zh) 1997-09-23 1998-09-22 改进的化学干燥和净化系统

Country Status (5)

Country Link
EP (1) EP1025409A1 (ja)
JP (1) JP4299966B2 (ja)
CN (1) CN1125963C (ja)
CA (1) CA2303979A1 (ja)
WO (1) WO1999015845A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6322633B1 (en) 1999-07-28 2001-11-27 Semitool, Inc. Wafer container cleaning system
US6372700B1 (en) 2000-03-31 2002-04-16 3M Innovative Properties Company Fluorinated solvent compositions containing ozone
US6310018B1 (en) * 2000-03-31 2001-10-30 3M Innovative Properties Company Fluorinated solvent compositions containing hydrogen fluoride
US20060035475A1 (en) * 2004-08-12 2006-02-16 Applied Materials, Inc. Semiconductor substrate processing apparatus
WO2008149325A1 (en) * 2007-06-07 2008-12-11 L'air Liquide-Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Non-flammable solvents for semiconductor applications
US20110139183A1 (en) * 2009-12-11 2011-06-16 Katrina Mikhaylichenko System and method of preventing pattern collapse using low surface tension fluid
CN102425922B (zh) * 2011-11-22 2015-04-08 洛阳伟信电子科技有限公司 一种高洁净度电镀板烘干装置
JP6005702B2 (ja) * 2014-09-18 2016-10-12 株式会社東芝 半導体基板の超臨界乾燥方法および基板処理装置
CN112992740A (zh) * 2021-03-01 2021-06-18 李军平 一种切割晶圆用的清洗设备
CN113369237A (zh) * 2021-06-04 2021-09-10 深圳市创裕达电子有限公司 一种液晶显示屏内部电器元件智能清灰装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS553607B2 (ja) * 1973-01-05 1980-01-25
US5226242A (en) * 1992-02-18 1993-07-13 Santa Clara Plastics, Division Of Preco, Inc. Vapor jet dryer apparatus and method
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid

Also Published As

Publication number Publication date
CN1284159A (zh) 2001-02-14
JP4299966B2 (ja) 2009-07-22
CA2303979A1 (en) 1999-04-01
WO1999015845A1 (en) 1999-04-01
JP2001517864A (ja) 2001-10-09
EP1025409A1 (en) 2000-08-09

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C06 Publication
PB01 Publication
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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: SEZ AMERICA CO.,LTD.

Free format text: FORMER OWNER: GARY W. FERREL

Effective date: 20040924

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20040924

Address after: Arizona, USA

Patentee after: Gary W. Ferrell

Address before: American California

Patentee before: Gary W. Ferrell

ASS Succession or assignment of patent right

Owner name: SEZ STOCK CO., LTD.

Free format text: FORMER OWNER: SEZ AMERICA CO.,LTD.

Effective date: 20071109

C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20071109

Address after: Villach

Patentee after: SEZ AG

Address before: Arizona, USA

Patentee before: Gary W. Ferrell

C56 Change in the name or address of the patentee

Owner name: LAM RESEARCH CO., LTD.

Free format text: FORMER NAME: SEZ CO., LTD.

CP01 Change in the name or title of a patent holder

Address after: Villach

Patentee after: Sez AG

Address before: Villach

Patentee before: SEZ AG

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20031029

Termination date: 20140922

EXPY Termination of patent right or utility model