CA2109133A1 - Multiple-layer microstrip assembly with inter-layer connections - Google Patents

Multiple-layer microstrip assembly with inter-layer connections

Info

Publication number
CA2109133A1
CA2109133A1 CA002109133A CA2109133A CA2109133A1 CA 2109133 A1 CA2109133 A1 CA 2109133A1 CA 002109133 A CA002109133 A CA 002109133A CA 2109133 A CA2109133 A CA 2109133A CA 2109133 A1 CA2109133 A1 CA 2109133A1
Authority
CA
Canada
Prior art keywords
circuitry
layer
ground plane
top surface
microstrip assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002109133A
Other languages
English (en)
French (fr)
Inventor
Patrick Westfeldt, Jr.
Brian J. Cox
Russell W. Johnson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ball Corp
Original Assignee
Patrick Westfeldt, Jr.
Brian J. Cox
Russell W. Johnson
Ball Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Patrick Westfeldt, Jr., Brian J. Cox, Russell W. Johnson, Ball Corporation filed Critical Patrick Westfeldt, Jr.
Publication of CA2109133A1 publication Critical patent/CA2109133A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/088—Stacked transmission lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Waveguides (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA002109133A 1992-10-28 1993-10-25 Multiple-layer microstrip assembly with inter-layer connections Abandoned CA2109133A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/967,828 US5309122A (en) 1992-10-28 1992-10-28 Multiple-layer microstrip assembly with inter-layer connections
US967,828 1992-10-28

Publications (1)

Publication Number Publication Date
CA2109133A1 true CA2109133A1 (en) 1994-04-29

Family

ID=25513392

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002109133A Abandoned CA2109133A1 (en) 1992-10-28 1993-10-25 Multiple-layer microstrip assembly with inter-layer connections

Country Status (6)

Country Link
US (1) US5309122A (de)
JP (1) JPH06260813A (de)
CA (1) CA2109133A1 (de)
DE (1) DE4336874A1 (de)
FR (1) FR2697374B1 (de)
GB (1) GB2272112B (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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JPH06314622A (ja) * 1993-04-30 1994-11-08 Murata Mfg Co Ltd チップ型回路部品及びその製造方法
US6728113B1 (en) * 1993-06-24 2004-04-27 Polychip, Inc. Method and apparatus for non-conductively interconnecting integrated circuits
GB9506878D0 (en) * 1995-04-03 1995-05-24 Northern Telecom Ltd A coxial transaction arrangement
FR2747239B1 (fr) * 1996-04-04 1998-05-15 Alcatel Espace Module hyperfrequence compact
US5751201A (en) * 1996-06-19 1998-05-12 Motorola, Inc. Resonator with metal layers devoid of DC connection and semiconductor device in substrate
US6018283A (en) * 1996-12-18 2000-01-25 Texas Instruments Incorporated Ultrawide bandwidth Z-axis interconnect
US6525620B1 (en) * 1999-05-21 2003-02-25 Intel Corporation Capacitive signal coupling device
SE514407C2 (sv) 1999-06-17 2001-02-19 Ericsson Telefon Ab L M Elektrisk transmissionsanordning
SE514408C2 (sv) * 1999-06-17 2001-02-19 Ericsson Telefon Ab L M Elektrisk transmissionsanordning
EP1069639B1 (de) * 1999-06-29 2006-04-26 Mitsubishi Denki Kabushiki Kaisha Modul mit einer Hochfrequenzschaltung
US6624722B2 (en) * 2001-09-12 2003-09-23 Radio Frequency Systems, Inc. Coplanar directional coupler for hybrid geometry
US7425760B1 (en) 2004-10-13 2008-09-16 Sun Microsystems, Inc. Multi-chip module structure with power delivery using flexible cables
US20080009211A1 (en) * 2006-07-07 2008-01-10 Matthew Raymond Himes Assemblies useful for the preparation of electronic components and methods for making same
CN112558016A (zh) * 2020-12-10 2021-03-26 中国电子科技集团公司第三十八研究所 一种采用多层微带连接的雷达收发系统

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2754484A (en) * 1954-11-22 1956-07-10 Itt Shield for microstrip circuits
US3345589A (en) * 1962-12-14 1967-10-03 Bell Telephone Labor Inc Transmission line type microwave filter
US3303439A (en) * 1965-06-14 1967-02-07 Western Electric Co Strip transmission line interboard connection
US3883828A (en) * 1974-06-03 1975-05-13 Merrimac Ind Inc High-power coupler synthesis
GB1501500A (en) * 1975-06-20 1978-02-15 Int Computers Ltd Multilayer printed circuit boards
JPS56128001A (en) * 1980-03-13 1981-10-07 Mitsubishi Electric Corp Multilayer unification method of triplate strip line
US4375053A (en) * 1980-12-29 1983-02-22 Sperry Corporation Interlevel stripline coupler
JPS58123202A (ja) * 1982-01-19 1983-07-22 Mitsubishi Electric Corp トリプレ−ト線路形マイクロ波回路
US4459568A (en) * 1982-02-02 1984-07-10 Rockwell International Corporation Air-stripline overlay hybrid coupler
JPH0244408B2 (ja) * 1984-09-03 1990-10-03 Nippon Denki Kk Ekookyanseragatasohokozofukuki
US4761654A (en) * 1985-06-25 1988-08-02 Communications Satellite Corporation Electromagnetically coupled microstrip antennas having feeding patches capacitively coupled to feedlines
US4810981A (en) * 1987-06-04 1989-03-07 General Microwave Corporation Assembly of microwave components
US4803450A (en) * 1987-12-14 1989-02-07 General Electric Company Multilayer circuit board fabricated from silicon
US4906953A (en) * 1988-09-08 1990-03-06 Varian Associates, Inc. Broadband microstrip to coplanar waveguide transition by anisotropic etching of gallium arsenide
US4891612A (en) * 1988-11-04 1990-01-02 Cascade Microtech, Inc. Overlap interfaces between coplanar transmission lines which are tolerant to transverse and longitudinal misalignment
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US4980659A (en) * 1989-08-24 1990-12-25 Raytheon Company Microwave dual level transition
JPH03237802A (ja) * 1990-02-14 1991-10-23 Murata Mfg Co Ltd 遅延線
JP3058898B2 (ja) * 1990-09-03 2000-07-04 三菱電機株式会社 半導体装置及びその評価方法
JPH04207701A (ja) * 1990-11-30 1992-07-29 Nippon Avionics Co Ltd プログラマブルディレイライン
US5184095A (en) * 1991-07-31 1993-02-02 Hughes Aircraft Company Constant impedance transition between transmission structures of different dimensions
US5261153A (en) * 1992-04-06 1993-11-16 Zycon Corporation In situ method for forming a capacitive PCB

Also Published As

Publication number Publication date
FR2697374B1 (fr) 1996-08-09
GB2272112B (en) 1996-07-24
GB2272112A (en) 1994-05-04
US5309122A (en) 1994-05-03
DE4336874A1 (de) 1994-05-05
GB9322170D0 (en) 1993-12-15
FR2697374A1 (fr) 1994-04-29
JPH06260813A (ja) 1994-09-16

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Dead