CA2108542A1 - Advance multilayer molded plastic package using mesic technology - Google Patents

Advance multilayer molded plastic package using mesic technology

Info

Publication number
CA2108542A1
CA2108542A1 CA002108542A CA2108542A CA2108542A1 CA 2108542 A1 CA2108542 A1 CA 2108542A1 CA 002108542 A CA002108542 A CA 002108542A CA 2108542 A CA2108542 A CA 2108542A CA 2108542 A1 CA2108542 A1 CA 2108542A1
Authority
CA
Canada
Prior art keywords
layer
lead frame
conductive
package
insulative
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002108542A
Other languages
English (en)
French (fr)
Inventor
Bidyut K. Bhattacharyya
Debendra Mallik
Syunsuke Ban
Takatoshi Takikawa
Shosaku Yamanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Intel Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CA002120464A priority Critical patent/CA2120464A1/en
Publication of CA2108542A1 publication Critical patent/CA2108542A1/en
Abandoned legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Physical Vapour Deposition (AREA)
CA002108542A 1992-02-18 1993-02-18 Advance multilayer molded plastic package using mesic technology Abandoned CA2108542A1 (en)

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CA002120464A CA2120464A1 (en) 1992-02-18 1993-02-18 Advance multilayer molded plastic package using mesic technology

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US83728592A 1992-02-18 1992-02-18
US07/837,285 1992-02-18

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US (2) US5556807A (enExample)
EP (2) EP0603158A3 (enExample)
JP (2) JPH06507275A (enExample)
CA (2) CA2108542A1 (enExample)
WO (1) WO1993016492A1 (enExample)

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Also Published As

Publication number Publication date
JPH0629452A (ja) 1994-02-04
JPH06507275A (ja) 1994-08-11
US5488257A (en) 1996-01-30
EP0580855A4 (enExample) 1994-03-16
EP0603158A3 (en) 1994-07-13
EP0580855A1 (en) 1994-02-02
US5556807A (en) 1996-09-17
WO1993016492A1 (en) 1993-08-19
CA2120464A1 (en) 1993-08-19
EP0603158A2 (en) 1994-06-22

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