CA2095609A1 - Porte-puces sans conducteur - Google Patents
Porte-puces sans conducteurInfo
- Publication number
- CA2095609A1 CA2095609A1 CA2095609A CA2095609A CA2095609A1 CA 2095609 A1 CA2095609 A1 CA 2095609A1 CA 2095609 A CA2095609 A CA 2095609A CA 2095609 A CA2095609 A CA 2095609A CA 2095609 A1 CA2095609 A1 CA 2095609A1
- Authority
- CA
- Canada
- Prior art keywords
- chip carrier
- array chip
- circuit board
- printed circuit
- pad array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000001465 metallisation Methods 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63184890A | 1990-12-21 | 1990-12-21 | |
US07/631,848 | 1990-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2095609A1 true CA2095609A1 (fr) | 1992-06-22 |
CA2095609C CA2095609C (fr) | 1996-11-26 |
Family
ID=24533025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA 2095609 Expired - Lifetime CA2095609C (fr) | 1990-12-21 | 1991-11-21 | Porte-puces sans conducteur |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0563264B1 (fr) |
JP (1) | JP2822272B2 (fr) |
KR (1) | KR970011619B1 (fr) |
AU (1) | AU647864B2 (fr) |
CA (1) | CA2095609C (fr) |
DE (1) | DE69129906T2 (fr) |
WO (1) | WO1992011654A1 (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5299730A (en) * | 1989-08-28 | 1994-04-05 | Lsi Logic Corporation | Method and apparatus for isolation of flux materials in flip-chip manufacturing |
US5175612A (en) * | 1989-12-19 | 1992-12-29 | Lsi Logic Corporation | Heat sink for semiconductor device assembly |
US5399903A (en) * | 1990-08-15 | 1995-03-21 | Lsi Logic Corporation | Semiconductor device having an universal die size inner lead layout |
US5434750A (en) * | 1992-02-07 | 1995-07-18 | Lsi Logic Corporation | Partially-molded, PCB chip carrier package for certain non-square die shapes |
US5592025A (en) * | 1992-08-06 | 1997-01-07 | Motorola, Inc. | Pad array semiconductor device |
EP0582052A1 (fr) * | 1992-08-06 | 1994-02-09 | Motorola, Inc. | Dispositif semi-conducteur encapsulé à profil et procédé de sa fabrication |
US5438477A (en) * | 1993-08-12 | 1995-08-01 | Lsi Logic Corporation | Die-attach technique for flip-chip style mounting of semiconductor dies |
DE4329696C2 (de) * | 1993-09-02 | 1995-07-06 | Siemens Ag | Auf Leiterplatten oberflächenmontierbares Multichip-Modul mit SMD-fähigen Anschlußelementen |
US5388327A (en) * | 1993-09-15 | 1995-02-14 | Lsi Logic Corporation | Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package |
JP2833996B2 (ja) * | 1994-05-25 | 1998-12-09 | 日本電気株式会社 | フレキシブルフィルム及びこれを有する半導体装置 |
US5770889A (en) * | 1995-12-29 | 1998-06-23 | Lsi Logic Corporation | Systems having advanced pre-formed planar structures |
DE19739591A1 (de) * | 1997-09-10 | 1999-03-11 | Wuerth Elektronik Gmbh & Co Kg | Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem |
JP4559163B2 (ja) | 2004-08-31 | 2010-10-06 | ルネサスエレクトロニクス株式会社 | 半導体装置用パッケージ基板およびその製造方法と半導体装置 |
JP4651359B2 (ja) * | 2004-10-29 | 2011-03-16 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
DE102012106700A1 (de) * | 2012-07-24 | 2014-01-30 | Valeo Schalter Und Sensoren Gmbh | Ultraschallsensoranordnung mit einem Zwischenelement, Vorrichtung und Verfahren zum Herstellen einer Ultraschallsensoranordnung für ein Kraftfahrzeug |
CN106409747A (zh) * | 2016-11-15 | 2017-02-15 | 广东美的制冷设备有限公司 | 智能功率模块及其制造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680617A (en) * | 1984-05-23 | 1987-07-14 | Ross Milton I | Encapsulated electronic circuit device, and method and apparatus for making same |
JP2502511B2 (ja) * | 1986-02-06 | 1996-05-29 | 日立マクセル株式会社 | 半導体装置の製造方法 |
US4874722A (en) * | 1987-04-16 | 1989-10-17 | Texas Instruments Incorporated | Process of packaging a semiconductor device with reduced stress forces |
US4868349A (en) * | 1988-05-09 | 1989-09-19 | National Semiconductor Corporation | Plastic molded pin-grid-array power package |
EP0351581A1 (fr) * | 1988-07-22 | 1990-01-24 | Oerlikon-Contraves AG | Circuit intégré à haute densité et procédé pour sa fabrication |
US5077633A (en) * | 1989-05-01 | 1991-12-31 | Motorola Inc. | Grounding an ultra high density pad array chip carrier |
-
1991
- 1991-11-21 WO PCT/US1991/008787 patent/WO1992011654A1/fr active IP Right Grant
- 1991-11-21 AU AU91639/91A patent/AU647864B2/en not_active Expired
- 1991-11-21 EP EP92903161A patent/EP0563264B1/fr not_active Expired - Lifetime
- 1991-11-21 CA CA 2095609 patent/CA2095609C/fr not_active Expired - Lifetime
- 1991-11-21 JP JP4503144A patent/JP2822272B2/ja not_active Expired - Lifetime
- 1991-11-21 DE DE69129906T patent/DE69129906T2/de not_active Expired - Lifetime
- 1991-11-21 KR KR1019930701715A patent/KR970011619B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
AU647864B2 (en) | 1994-03-31 |
KR930703701A (ko) | 1993-11-30 |
EP0563264A4 (fr) | 1993-08-02 |
DE69129906T2 (de) | 1999-03-04 |
JP2822272B2 (ja) | 1998-11-11 |
WO1992011654A1 (fr) | 1992-07-09 |
CA2095609C (fr) | 1996-11-26 |
EP0563264A1 (fr) | 1993-10-06 |
DE69129906D1 (de) | 1998-09-03 |
EP0563264B1 (fr) | 1998-07-29 |
KR970011619B1 (ko) | 1997-07-12 |
AU9163991A (en) | 1992-07-22 |
JPH06506319A (ja) | 1994-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKEX | Expiry |