CA2095609A1 - Porte-puces sans conducteur - Google Patents

Porte-puces sans conducteur

Info

Publication number
CA2095609A1
CA2095609A1 CA2095609A CA2095609A CA2095609A1 CA 2095609 A1 CA2095609 A1 CA 2095609A1 CA 2095609 A CA2095609 A CA 2095609A CA 2095609 A CA2095609 A CA 2095609A CA 2095609 A1 CA2095609 A1 CA 2095609A1
Authority
CA
Canada
Prior art keywords
chip carrier
array chip
circuit board
printed circuit
pad array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2095609A
Other languages
English (en)
Other versions
CA2095609C (fr
Inventor
William B. Mullen, Iii
Glenn F. Urbish
Bruce J. Freyman
Mauro J. Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Motorola Solutions Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=24533025&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CA2095609(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Individual filed Critical Individual
Publication of CA2095609A1 publication Critical patent/CA2095609A1/fr
Application granted granted Critical
Publication of CA2095609C publication Critical patent/CA2095609C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CA 2095609 1990-12-21 1991-11-21 Porte-puces sans conducteur Expired - Lifetime CA2095609C (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63184890A 1990-12-21 1990-12-21
US07/631,848 1990-12-21

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CA2095609A1 true CA2095609A1 (fr) 1992-06-22
CA2095609C CA2095609C (fr) 1996-11-26

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JP (1) JP2822272B2 (fr)
KR (1) KR970011619B1 (fr)
AU (1) AU647864B2 (fr)
CA (1) CA2095609C (fr)
DE (1) DE69129906T2 (fr)
WO (1) WO1992011654A1 (fr)

Families Citing this family (16)

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Publication number Priority date Publication date Assignee Title
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5592025A (en) * 1992-08-06 1997-01-07 Motorola, Inc. Pad array semiconductor device
EP0582052A1 (fr) * 1992-08-06 1994-02-09 Motorola, Inc. Dispositif semi-conducteur encapsulé à profil et procédé de sa fabrication
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
DE4329696C2 (de) * 1993-09-02 1995-07-06 Siemens Ag Auf Leiterplatten oberflächenmontierbares Multichip-Modul mit SMD-fähigen Anschlußelementen
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
JP2833996B2 (ja) * 1994-05-25 1998-12-09 日本電気株式会社 フレキシブルフィルム及びこれを有する半導体装置
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
DE19739591A1 (de) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
JP4559163B2 (ja) 2004-08-31 2010-10-06 ルネサスエレクトロニクス株式会社 半導体装置用パッケージ基板およびその製造方法と半導体装置
JP4651359B2 (ja) * 2004-10-29 2011-03-16 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
DE102012106700A1 (de) * 2012-07-24 2014-01-30 Valeo Schalter Und Sensoren Gmbh Ultraschallsensoranordnung mit einem Zwischenelement, Vorrichtung und Verfahren zum Herstellen einer Ultraschallsensoranordnung für ein Kraftfahrzeug
CN106409747A (zh) * 2016-11-15 2017-02-15 广东美的制冷设备有限公司 智能功率模块及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4680617A (en) * 1984-05-23 1987-07-14 Ross Milton I Encapsulated electronic circuit device, and method and apparatus for making same
JP2502511B2 (ja) * 1986-02-06 1996-05-29 日立マクセル株式会社 半導体装置の製造方法
US4874722A (en) * 1987-04-16 1989-10-17 Texas Instruments Incorporated Process of packaging a semiconductor device with reduced stress forces
US4868349A (en) * 1988-05-09 1989-09-19 National Semiconductor Corporation Plastic molded pin-grid-array power package
EP0351581A1 (fr) * 1988-07-22 1990-01-24 Oerlikon-Contraves AG Circuit intégré à haute densité et procédé pour sa fabrication
US5077633A (en) * 1989-05-01 1991-12-31 Motorola Inc. Grounding an ultra high density pad array chip carrier

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AU647864B2 (en) 1994-03-31
KR930703701A (ko) 1993-11-30
EP0563264A4 (fr) 1993-08-02
DE69129906T2 (de) 1999-03-04
JP2822272B2 (ja) 1998-11-11
WO1992011654A1 (fr) 1992-07-09
CA2095609C (fr) 1996-11-26
EP0563264A1 (fr) 1993-10-06
DE69129906D1 (de) 1998-09-03
EP0563264B1 (fr) 1998-07-29
KR970011619B1 (ko) 1997-07-12
AU9163991A (en) 1992-07-22
JPH06506319A (ja) 1994-07-14

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