CA2042840A1 - Preparation et usage de resines polymeriques difficilement inflammables et resistant a de hautes temperatures - Google Patents
Preparation et usage de resines polymeriques difficilement inflammables et resistant a de hautes temperaturesInfo
- Publication number
- CA2042840A1 CA2042840A1 CA2042840A CA2042840A CA2042840A1 CA 2042840 A1 CA2042840 A1 CA 2042840A1 CA 2042840 A CA2042840 A CA 2042840A CA 2042840 A CA2042840 A CA 2042840A CA 2042840 A1 CA2042840 A1 CA 2042840A1
- Authority
- CA
- Canada
- Prior art keywords
- resins
- resistant
- curable
- component consisting
- high temperatures
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
- C08K5/357—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4016296A DE4016296C1 (en) | 1990-05-21 | 1990-05-21 | Flame retardant thermosetting adhesive for metals etc. - comprises oxa:aza:tetralin, halogenated epoxy] resins and opt. additives |
DEP4016296.6 | 1990-05-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2042840A1 true CA2042840A1 (fr) | 1991-11-22 |
CA2042840C CA2042840C (fr) | 1996-11-26 |
Family
ID=6406865
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002042840A Expired - Lifetime CA2042840C (fr) | 1990-05-21 | 1991-05-17 | Preparation et usage de resines polymeriques difficilement inflammables et resistant a de hautes temperatures |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0458739A3 (fr) |
JP (1) | JP3203385B2 (fr) |
KR (1) | KR0166377B1 (fr) |
AU (1) | AU636226B2 (fr) |
CA (1) | CA2042840C (fr) |
CS (1) | CS145891A2 (fr) |
DE (1) | DE4016296C1 (fr) |
ZA (1) | ZA913434B (fr) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0493310A1 (fr) * | 1990-12-21 | 1992-07-01 | Gurit-Essex AG | Résines durcissables ayant des propriétés ignifuges à l'état durci et leur utilisation |
CN1058738C (zh) * | 1994-07-29 | 2000-11-22 | 四川联合大学 | 开环聚合酚醛树脂与纤维增强复合材料 |
JP3543866B2 (ja) * | 1995-02-28 | 2004-07-21 | 日立化成工業株式会社 | 摩擦材及びその製造方法 |
JPH09157496A (ja) * | 1995-12-06 | 1997-06-17 | Hitachi Chem Co Ltd | 熱硬化性樹脂組成物、その硬化物並びにこの樹脂組成物を用いたプリプレグ及び金属箔張積層板 |
JP3487083B2 (ja) * | 1996-02-09 | 2004-01-13 | 日立化成工業株式会社 | 熱硬化性樹脂組成物及びその硬化物 |
DE10309617A1 (de) * | 2003-03-05 | 2004-09-23 | Siemens Ag | Werkstückträger zur Aufnahme von Werkstücken |
US7157509B2 (en) * | 2003-06-27 | 2007-01-02 | Henkel Corporation | Curable compositions |
US20050042961A1 (en) | 2003-08-18 | 2005-02-24 | Henkel Loctite Corporation | Curable compositions for advanced processes, and products made therefrom |
JP2004156045A (ja) * | 2003-12-22 | 2004-06-03 | Hitachi Chem Co Ltd | 摩擦材 |
DE102004046745B4 (de) * | 2004-09-27 | 2008-04-24 | Atotech Deutschland Gmbh | Verfahren zur lösungsmittelfreien Herstellung einer faserverstärkten, mit Harz beschichteten Folie und Verwendung derselben |
DE102004046744B4 (de) | 2004-09-27 | 2007-05-24 | Atotech Deutschland Gmbh | Verfahren zur Übertragung von Pulvern und Pulverlacken auf Substrate und Verwendung zur Herstellung von Leiterplatten und Solarzellen |
TWI374137B (en) * | 2004-09-28 | 2012-10-11 | Huntsman Adv Mat Switzerland | Organic compounds |
US7649060B2 (en) | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
DE102006017891A1 (de) | 2006-04-13 | 2007-10-25 | Hexion Specialty Chemicals Gmbh | Harzdispersion |
EP2070984A1 (fr) | 2007-12-12 | 2009-06-17 | Hexion Specialty Chemicals Research Belgium S.A. | Co-dispersions de résines époxides-phénoliques |
US8975318B2 (en) | 2008-02-21 | 2015-03-10 | Huntsman Advanced Materials Americas Llc | Halogen-free benzoxazine based curable compositions for high TG applications |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH579113A5 (fr) * | 1972-05-09 | 1976-08-31 | Micafil Ag | |
IT984956B (it) * | 1972-05-09 | 1974-11-20 | Sued West Chemie Gmbh | Prodotti polimerizzabili o induribili |
DE3433851A1 (de) * | 1984-09-14 | 1986-03-27 | Gurit-Essex, Freienbach | Chemisch haertbare harze aus 1-oxa-3-aza-tetralin-gruppen enthaltenden verbindungen und cycloaliphatischen epoxid-harzen, verfahren zu deren herstellung und haertung sowie die verwendung solcher harze |
EP0356379B1 (fr) * | 1988-07-18 | 1996-03-20 | Gurit-Essex AG | Résines durcissables en vue d'obtenir des matières plastiques difficilement inflammables et résistantes à haute température et leur procédé de préparation |
-
1990
- 1990-05-21 DE DE4016296A patent/DE4016296C1/de not_active Expired - Lifetime
-
1991
- 1991-04-26 EP EP19910810319 patent/EP0458739A3/de active Pending
- 1991-05-07 ZA ZA913434A patent/ZA913434B/xx unknown
- 1991-05-17 CA CA002042840A patent/CA2042840C/fr not_active Expired - Lifetime
- 1991-05-17 CS CS911458A patent/CS145891A2/cs unknown
- 1991-05-20 JP JP11485091A patent/JP3203385B2/ja not_active Expired - Lifetime
- 1991-05-20 KR KR1019910008163A patent/KR0166377B1/ko not_active IP Right Cessation
- 1991-05-21 AU AU77213/91A patent/AU636226B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
ZA913434B (en) | 1992-02-26 |
AU636226B2 (en) | 1993-04-22 |
JP3203385B2 (ja) | 2001-08-27 |
AU7721391A (en) | 1991-11-21 |
CS145891A2 (en) | 1991-12-17 |
CA2042840C (fr) | 1996-11-26 |
EP0458739A3 (en) | 1993-09-01 |
JPH04227922A (ja) | 1992-08-18 |
EP0458739A2 (fr) | 1991-11-27 |
KR910020104A (ko) | 1991-12-19 |
KR0166377B1 (ko) | 1999-03-20 |
DE4016296C1 (en) | 1991-09-05 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKEX | Expiry |